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AMD XC6SLX25-3FTG256I
- Part No.:
- XC6SLX25-3FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-3FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,980
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Product details
Overview
XC6SLX25-3FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (fastest), supports LVCMOS/LVTTL interfaces, and is used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC6SLX25-3FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), embedded DSP48A1 slices for arithmetic acceleration, and support for PCI Express x1 Gen1 endpoints.
Technical Context
The XC6SLX25-3FTG256I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic chains. It integrates six 18×18 multipliers and up to 12 embedded DSP48A1 slices for high-speed multiply-accumulate operations.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor interface. The device supports JTAG boundary-scan (IEEE 1149.1) and includes internal oscillator for configuration clock generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 18 Kbits - distributed across 32 × 512-bit dual-port RAM blocks for data buffering |
| User I/Os | 186 - configurable as single-ended or differential standards including LVDS, TMDS, and RSDS |
| Speed Grade | -3 - fastest timing bin, enabling operation up to 766 MHz in select I/O paths |
| DSP Slices | 12 × DSP48A1 - each supports 18×18 signed multiplication and 48-bit accumulation per cycle |
| Package | FTG256 - 17×17 mm fine-pitch BGA with 1.0 mm ball pitch and Pb-free finish |
| Operating Temp | -40°C to +100°C - industrial temperature range suitable for extended ambient environments |
Pinout & Package
XC6SLX25-3FTG256I uses a 256-ball FTBGA (Fine-Pitch Ball Grid Array) package with 1.0 mm pitch, 17×17 array, and thermal pad exposed on underside for enhanced heat dissipation. Pin functions are defined by bank-based I/O standards and configuration mode selection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be set to match signal standard (1.2V/1.8V/2.5V/3.3V) |
| P1 | IO_L1P_0 | Bank 0 differential input/output pair - supports LVDS, TMDS, or single-ended LVCMOS |
| T1 | M0 | Configuration mode select - sets boot source (Master Serial, Slave SelectMAP, etc.) |
| R1 | CCLK | Configuration clock input - driven externally or by internal oscillator during startup |
| A1 | GND | Ground reference for core and I/O banks - requires low-inductance connection to PCB plane |
| B1 | VCCINT | Core logic supply - regulated 1.2V required with tight tolerance (±3%) |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM up to 400 MHz with 16-bit data bus and hardware calibration |
| PCIe Endpoint Logic | Hard IP block for x1 Gen1 endpoint - eliminates need for soft-core PCIe implementation |
| Low-Power Architecture | Dynamic power gating per I/O bank and selective clock disabling reduce active power by up to 40% |
| Embedded Debug | ChipScope Pro integration enables real-time signal capture without external logic analyzer |
| Multi-Standard I/O | Single pin supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS, and TMDS with per-bank voltage control |
Applications
| Industrial PLC Logic | Machine Vision Preprocessing |
|---|---|
Use Scenario: Real-time deterministic control of servo axes and I/O modules in modular PLC systems. IC Role / Device Role / Timing Role: Configurable logic fabric executes custom ladder logic and motion control algorithms with sub-microsecond latency. Use Value: 186 user I/Os enable direct connection to fieldbus transceivers and analog front-ends without glue logic. | Use Scenario: On-camera image filtering, Bayer demosaicing, and edge detection before transmission to host processor. IC Role / Device Role / Timing Role: Parallel pixel processing engine leveraging DSP48A1 slices for fixed-point convolution kernels. Use Value: Embedded block RAM provides line buffers for 1080p@30fps video streams with zero external memory access. |
| Automotive ADAS Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregation and time-synchronized preprocessing of radar, camera, and ultrasonic sensor data in Level 2 ADAS systems. IC Role / Device Role / Timing Role: High-reliability interface bridge with configurable SERDES lanes and ECC-protected configuration memory. Use Value: Industrial temperature rating (-40°C to +100°C) and SEU mitigation features meet AEC-Q100 Class 2 requirements. | Use Scenario: Generation of high-speed digital stimulus patterns for IC functional validation and boundary-scan testing. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with programmable timing resolution down to 1 ns per step. Use Value: -3 speed grade ensures stable 766 MHz output toggle rate on dedicated clock routing resources. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484I | 43,661 logic cells, 484-pin FBGA, higher I/O count (218), larger die area and power envelope | Suitable for designs requiring >24K LUTs or >186 I/Os, e.g., multi-protocol gateway with Ethernet + CAN + PCIe | Select when additional logic density or I/O bandwidth is required; not pin-compatible with XC6SLX25-3FTG256I |
| XC7S25-2CSGA225I | Artix-7 architecture, 23,000 logic cells, 225-pin CSBGA, native support for DDR3 and PCIe Gen2 x1 | Better suited for new designs targeting lower static power and higher serial transceiver performance | Choose for migration path with improved power efficiency and newer IP cores; requires PCB redesign due to different package and pinout |
Compared with XC6SLX25-3FTG256I, XC6SLX45-3FGG484I offers greater logic capacity but demands more board space and power, while XC7S25-2CSGA225I delivers architectural improvements at the cost of layout compatibility and legacy toolchain support.
Availability
XC6SLX25-3FTG256I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and test equipment requiring stable component supply across long production lifecycles.
Supply support for XC6SLX25-3FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable I/O expansion, logic consolidation, and embedded processing with low power consumption.
FAQ
What is the maximum operating frequency of XC6SLX25-3FTG256I?
The XC6SLX25-3FTG256I has a -3 speed grade, the highest bin in the Spartan-6 family. Its I/O registers can achieve 766 MHz toggle rates, and internal logic paths support up to 500 MHz depending on design placement and routing. Timing closure must be verified per implementation using Xilinx ISE 14.7 or Vivado 2019.1 legacy mode.
Does XC6SLX25-3FTG256I support DDR3 memory interfaces?
XC6SLX25-3FTG256I does not include native DDR3 controller hard IP. It supports DDR2 up to 400 MHz via its integrated memory controller. DDR3 interfacing requires soft-core controllers implemented in fabric, with careful attention to timing closure and board-level signal integrity.
What configuration methods are supported by XC6SLX25-3FTG256I?
XC6SLX25-3FTG256I supports Master Serial (SPI flash), Slave SelectMAP (parallel bus from microcontroller), and JTAG programming. Configuration mode is selected via M[2:0] pins at power-up. Internal oscillator provides CCLK during Master Serial mode if no external clock is supplied.
Is XC6SLX25-3FTG256I RoHS compliant and lead-free?
Yes, XC6SLX25-3FTG256I is RoHS compliant and manufactured with lead-free (Pb-free) finish on all solder balls. The FTG256 package uses matte tin plating over copper pillars and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
Can XC6SLX25-3FTG256I be used in automotive applications?
XC6SLX25-3FTG256I is rated for industrial temperature (-40°C to +100°C) and includes configuration memory CRC and single-event upset (SEU) mitigation features. While not AEC-Q100 certified, it has been deployed in non-safety-critical automotive subsystems such as infotainment and sensor hubs where qualification is customer-responsible.
XC6SLX25-3FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-3FTG256I FAQ
1.How can I place an order for XC6SLX25-3FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-3FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-3FTG256I reliable?
The price and inventory of XC6SLX25-3FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-3FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-3FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-3FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-3FTG256I?
XC6SLX25-3FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-3FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-3FTG256I?
For technical support, including XC6SLX25-3FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-3FTG256I requirements.
6.How does Aetrix verify that XC6SLX25-3FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-3FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-3FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-3FTG256I?
All XC6SLX25-3FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-3FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-3FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX25-3FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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