AMD XC6SLX25-L1CSG324I
- Part No.:
- XC6SLX25-L1CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25-L1CSG324I.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,366
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX25-L1CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 912 I/O pins, and embedded block RAM totaling 784 kbits. It operates at -1 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 324-pin CSGA package, used in industrial control logic, motor drive interface, and real-time protocol bridging.
For engineers reviewing the XC6SLX25-L1CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2/1.8/2.5/3.3 V), distributed RAM depth, clock management tile count, and configuration mode compatibility with SPI/BPI masters.
Technical Context
The XC6SLX25-L1CSG324I implements a hierarchical FPGA architecture with six-clock regions, integrated DCMs for clock synthesis and phase alignment, and SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS standards. Its logic fabric includes 4-input LUTs with optional flip-flop registration and dedicated carry chains for arithmetic functions.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. Bitstream security is supported through AES encryption and HMAC authentication, with dual-boot capability enabled by internal configuration memory partitioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| I/O Pins | 912 - supports high-density peripheral interfacing with banked voltage domains |
| Block RAM | 784 kbits - enables on-chip FIFOs, buffers, and lookup tables without external memory |
| Speed Grade | -1 - specifies maximum operating frequency (e.g., 667 Mbps DDR3 I/O, 375 MHz system clock) |
| Operating Temp | -40°C to +100°C - qualifies for extended industrial environments without derating |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and low-power operation envelope |
Pinout & Package
XC6SLX25-L1CSG324I is housed in a 324-ball fine-pitch CSGA (Chip-Scale Grid Array) package with 1.0 mm ball pitch, 15 × 15 mm body size, and Pb-free RoHS-compliant finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage level and input threshold for associated pins |
| K1 | CLK0 | Dedicated global clock input - connects directly to DCM for low-skew distribution |
| M2 | PROGRAM_B | Active-low configuration initiator - triggers reconfiguration from external source |
| T1 | INIT_B | Open-drain status indicator - signals configuration completion or error state |
| U1 | CCLK | Configuration clock - drives serial bitstream loading in Master Serial mode |
| V1 | DONE | Open-drain configuration status - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - enable jitter reduction, frequency synthesis, and phase shifting without external PLL ICs |
| SelectIO Technology | Supports 1.2–3.3 V I/O standards - allows direct interfacing with legacy and modern peripherals without level shifters |
| AES-256 Encryption | On-chip bitstream decryption - prevents unauthorized access to configured logic and IP blocks |
| Dual-Boot Capability | Internal configuration memory partitioning - enables fail-safe firmware updates and field-recoverable designs |
Applications
| Industrial Motor Control | Protocol Bridge Module |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop timing-critical control logic with sub-microsecond latency. Use Value: XC6SLX25-L1CSG324I delivers deterministic response and configurable I/O timing to meet IEC 61800-3 functional safety timing constraints. | Use Scenario: Translation between CAN FD and Ethernet-based fieldbus protocols in factory automation gateways. IC Role / Device Role / Timing Role: XC6SLX25-L1CSG324I acts as protocol translation engine with independent clock domains for each interface. Use Value: On-chip block RAM and DSP slices enable concurrent packet buffering and CRC computation without external co-processors. |
| Embedded Vision Preprocessing | Test Equipment Logic Controller |
Use Scenario: Pixel-level filtering and Bayer demosaicing prior to image compression in machine vision cameras. IC Role / Device Role / Timing Role: XC6SLX25-L1CSG324I processes parallel pixel streams using distributed RAM and pipelined LUT logic. Use Value: 912 I/O pins allow direct connection to CMOS image sensors and MIPI CSI-2 transmitters, reducing BOM count. | Use Scenario: High-speed digital pattern generation and response analysis in automated test systems. IC Role / Device Role / Timing Role: XC6SLX25-L1CSG324I serves as deterministic stimulus sequencer with precise cycle-accurate timing control. Use Value: Built-in DCMs provide stable, low-jitter clocks for 100+ MHz digital vector rates across multiple I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-L1CSG324I | 43,661 logic cells, same package and speed grade - higher density with identical pinout and thermal profile | Supports larger state machines and multi-channel data paths without PCB redesign | Choose when design requires >24K logic cells but must retain footprint and thermal management |
| XC7S25-1CSGA324C | Artix-7 architecture, 23,000 logic cells, 1.0 V core, commercial temp - newer process node, lower static power | Lacks AES encryption and dual-boot; supports PCIe Gen1 endpoint via GTY transceivers | Prefer for new designs targeting lower power and future-proof I/O, accepting reduced security features |
Compared with XC6SLX25-L1CSG324I, the XC6SLX45-L1CSG324I offers scalable logic capacity within identical mechanical and thermal constraints, while the XC7S25-1CSGA324C trades mature security features for improved power efficiency and transceiver integration in next-generation platforms.
Availability
XC6SLX25-L1CSG324I is available at Aetrix Electronics and suitable for industrial motor control, protocol bridge modules, and embedded vision preprocessing requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX25-L1CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable I/O flexibility, moderate logic density, and industrial-grade reliability - particularly in motor control, industrial networking, and video interface systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25-L1CSG324I?
The XC6SLX25-L1CSG324I supports I/O voltages from 1.2 V to 3.3 V across its 12 I/O banks, enabling direct interface with LVCMOS, SSTL, HSTL, and LVDS peripherals. Each bank is independently configurable, and VCCO must match the selected standard's required supply - for example, 1.8 V for SSTL18_I or 3.3 V for LVCMOS33. This flexibility eliminates external level-shifting components in mixed-voltage systems.
Does XC6SLX25-L1CSG324I support JTAG boundary-scan testing?
Yes, XC6SLX25-L1CSG324I fully supports IEEE 1149.1 JTAG boundary-scan for PCB interconnect testing and in-system programming. The TDI, TDO, TMS, and TCK pins are dedicated and mapped to specific balls in the CSGA324 package. JTAG mode enables configuration verification, logic state capture, and debug access without requiring additional test fixtures or probe points.
Can XC6SLX25-L1CSG324I be configured using a microcontroller over SPI?
Yes, XC6SLX25-L1CSG324I supports Slave Serial configuration mode, allowing a host microcontroller to load the bitstream via SPI-compatible signals (DIN, DOUT, CCLK, and CS_B). The microcontroller must assert PROGRAM_B first, then drive CCLK synchronously while shifting bits into DIN. This method is widely used in field-upgradable systems where configuration memory resides in MCU flash.
What is the purpose of the INIT_B pin on XC6SLX25-L1CSG324I?
The INIT_B pin on XC6SLX25-L1CSG324I is an open-drain, active-low output that indicates configuration status. It remains low during configuration initiation and goes high upon successful completion. If configuration fails due to CRC error or sync word mismatch, INIT_B pulses low again. This signal is essential for system-level fault detection and automatic recovery sequencing in industrial controllers.
Is XC6SLX25-L1CSG324I qualified for automotive applications?
No, XC6SLX25-L1CSG324I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in harsh environments, it lacks automotive-specific screening, failure-in-time (FIT) reporting, and qualification documentation required for passenger vehicle ECUs. For automotive use, AMD recommends the XA Spartan-6 family variants with full AEC-Q100 Grade 2 certification.
XC6SLX25-L1CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25-L1CSG324I FAQ
1.How can I place an order for XC6SLX25-L1CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-L1CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-L1CSG324I reliable?
The price and inventory of XC6SLX25-L1CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-L1CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-L1CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-L1CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-L1CSG324I?
XC6SLX25-L1CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-L1CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-L1CSG324I?
For technical support, including XC6SLX25-L1CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-L1CSG324I requirements.
6.How does Aetrix verify that XC6SLX25-L1CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-L1CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-L1CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-L1CSG324I?
All XC6SLX25-L1CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-L1CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-L1CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX25-L1CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX25-L1CSG324I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
