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AMD XC6SLX25-N3CSG324C
- Part No.:
- XC6SLX25-N3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25-N3CSG324C.pdf
- Description:
- IC FPGA 226 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,197
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Product details
Overview
XC6SLX25-N3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range) and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC6SLX25-N3CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, differential signaling support (LVDS), and industrial-grade thermal reliability for programmable logic deployment in space-constrained industrial controllers.
Technical Context
The XC6SLX25-N3CSG324C implements a hierarchical FPGA architecture with six-input LUTs, dedicated carry logic, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dual-clock domain management and supports configuration via SPIx4, BPI, or JTAG.
It features SelectIO technology supporting LVCMOS, LVTTL, SSTL, HSTL, and LVDS standards across its 186 user I/Os, with programmable drive strength and slew rate control per bank. Configuration security includes bitstream encryption and CRC error checking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - usable LUT-based fabric for combinational and sequential logic implementation |
| Block RAM | 18 Kbits - distributed memory capacity for FIFOs, buffers, or small lookup tables |
| User I/Os | 186 - configurable single-ended and differential signal interfaces per bank |
| Speed Grade | -3 - maximum operating frequency of 841 MHz for internal logic (DCM output) |
| Core Voltage | 1.2 V ±3% - fixed supply requirement for logic fabric and CLBs |
| Operating Temp | -40°C to +100°C - industrial temperature range suitable for non-derated operation in harsh environments |
| Package | 324-pin CSBGA (15×15 mm, 0.8 mm pitch) - surface-mount package with thermal pad for PCB-level heat dissipation |
Pinout & Package
The XC6SLX25-N3CSG324C is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package with exposed thermal pad, designed for high-density PCB layouts and thermal management in compact industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; voltage sets compatible signaling standard |
| VRN_0 / VRP_0 | Differential Reference | Provides termination reference for LVDS and other differential I/O standards in Bank 0 |
| CLKIN | Primary Clock Input | Accepts external clock source feeding DCM for internal clock synthesis and jitter reduction |
| PROGRAM_B | Configuration Reset | Active-low signal initiating FPGA reconfiguration from external PROM or processor |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or failure during startup |
| GND / VCCINT | Power Ground / Core Supply | Decoupled power delivery network required for stable 1.2 V core operation and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 12 dedicated arithmetic units enabling 18×18-bit signed multiplication with pipeline registers |
| SelectIO Technology | Per-bank voltage and standard flexibility supporting mixed-voltage I/O interfacing without level shifters |
| Embedded Block RAM | 18 Kbits organized as 36 × 512-bit blocks, configurable as dual-port RAM or ROM |
| DCM Clock Management | Two Digital Clock Managers providing frequency synthesis, phase shifting, and duty cycle correction |
| Configuration Security | Bitstream encryption using AES-128 and CRC-based integrity verification prevent unauthorized cloning |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion in modular programmable logic controllers with fieldbus connectivity. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for sensor data aggregation, protocol translation (Modbus RTU to EtherCAT), and deterministic I/O timing control. Use Value: 186 user I/Os and industrial temperature rating enable direct integration into DIN-rail mounted control cabinets without derating. | Use Scenario: Converting parallel RGB video signals to serialized LVDS streams for panel interconnect in medical imaging displays. IC Role / Device Role / Timing Role: XC6SLX25-N3CSG324C performs pixel clock domain crossing, data serialization, and embedded sync insertion using SelectIO LVDS transmitters. Use Value: Integrated LVDS drivers and DCM-based clock alignment eliminate external serializer ICs and reduce board area by 35%. |
| Motor Control Encoder Interface | Communications Protocol Gateway |
Use Scenario: High-resolution quadrature decoding and commutation timing generation for brushless DC motor drives. IC Role / Device Role / Timing Role: FPGA logic processes A/B/Z encoder inputs, computes position/speed, and generates precise PWM waveforms with dead-time insertion. Use Value: 24,051 logic cells support real-time PID loop execution alongside encoder processing, reducing MCU load and latency. | Use Scenario: Translating CAN FD messages to UART-based telemetry for remote asset monitoring in energy infrastructure. IC Role / Device Role / Timing Role: XC6SLX25-N3CSG324C implements CAN FD controller logic, message filtering, and UART framing with hardware CRC offload. Use Value: On-chip block RAM stores message buffers and filter tables, enabling 2 Mbps CAN FD throughput with <1.2 µs interrupt latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-3CSG324I | Same logic resources and I/O count, but -3I speed grade rated for industrial temp (−40°C to +100°C) with tighter timing margins | Identical use cases; preferred where guaranteed setup/hold timing at max frequency is critical | Select XC6SLX25-3CSG324I when DCM output frequencies exceed 750 MHz under worst-case voltage/temperature conditions |
| XC6SLX16-3CSG324C | Reduced logic cells (14,579), same package and I/O count, lower block RAM (9 Kbits) | Suitable for simpler control logic or smaller protocol stacks where resource headroom is not required | Choose XC6SLX16-3CSG324C to reduce BOM cost when design fits within 60% of XC6SLX25-N3CSG324C's logic utilization |
Compared with XC6SLX25-3CSG324I, the XC6SLX25-N3CSG324C offers identical packaging and I/O but relaxed timing guarantees; versus XC6SLX16-3CSG324C, it delivers 65% more logic and double the block RAM for complex state machines and buffering-critical for multi-protocol gateways and real-time motion control.
Availability
XC6SLX25-N3CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and motor control electronics requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-N3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family, including XC6SLX25-N3CSG324C, was designed for cost-optimized, low-power embedded applications requiring flexible logic, I/O, and DSP resources in industrial and automotive-qualified environments.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25-N3CSG324C?
The XC6SLX25-N3CSG324C supports I/O voltages from 1.2 V to 3.3 V per bank, enabling mixed-voltage operation across its 186 user I/Os. Each I/O bank has independent VCCO supply, allowing concurrent LVCMOS25, LVCMOS33, and SSTL18 signaling without external level shifters. The XC6SLX25-N3CSG324C datasheet specifies absolute maximum VCCO as 3.465 V.
Does XC6SLX25-N3CSG324C support JTAG boundary-scan testing?
Yes, XC6SLX25-N3CSG324C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate at VCCAUX (2.5 V). The XC6SLX25-N3CSG324C supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions per the JTAG standard.
Can XC6SLX25-N3CSG324C be configured using SPI flash memory?
Yes, XC6SLX25-N3CSG324C supports master SPI configuration mode, allowing direct boot from standard quad-SPI flash devices such as Micron MT25QL series. In this mode, the XC6SLX25-N3CSG324C drives the SPI bus and reads the configuration bitstream automatically after power-up or PROGRAM_B assertion.
What thermal management considerations apply to XC6SLX25-N3CSG324C?
The XC6SLX25-N3CSG324C uses a 324-pin CSBGA package with an exposed thermal pad requiring solder connection to a PCB thermal plane. For industrial operation up to +100°C ambient, a minimum 4-layer board with internal ground/power planes and ≥4 thermal vias under the pad is recommended. The XC6SLX25-N3CSG324C thermal resistance (θJA) is 22.5°C/W under standard JEDEC test conditions.
Is bitstream encryption supported on XC6SLX25-N3CSG324C?
Yes, XC6SLX25-N3CSG324C supports AES-128 bitstream encryption using a 128-bit key stored in on-chip battery-backed RAM or external eFUSE. Encryption is enabled during bitstream generation in Vivado or ISE tools and verified during configuration via CRC and decryption key authentication. The XC6SLX25-N3CSG324C does not support HMAC-based authentication.
XC6SLX25-N3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 226
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25-N3CSG324C FAQ
1.How can I place an order for XC6SLX25-N3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-N3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-N3CSG324C reliable?
The price and inventory of XC6SLX25-N3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-N3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-N3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-N3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-N3CSG324C?
XC6SLX25-N3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-N3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-N3CSG324C?
For technical support, including XC6SLX25-N3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-N3CSG324C requirements.
6.How does Aetrix verify that XC6SLX25-N3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-N3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-N3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-N3CSG324C?
All XC6SLX25-N3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-N3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-N3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX25-N3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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