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AMD XC6SLX25-N3FG484C
- Part No.:
- XC6SLX25-N3FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25-N3FG484C.pdf
- Description:
- IC FPGA 266 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,752
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Product details
Overview
XC6SLX25-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 186 I/O pins, and a -3 speed grade operating at 1.2 V core voltage. It integrates 93 BRAM blocks (18 Kb each), 180 DSP48A1 slices, and supports LVDS, SSTL, HSTL, and PCI Express Gen1 interfaces for embedded control and interface bridging.
For engineers reviewing the XC6SLX25-N3FG484C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage flexibility (1.2 V/1.8 V/2.5 V/3.3 V), distributed RAM capacity (737 Kb), and support for JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC6SLX25-N3FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes dual-port block RAM with byte-write enable and synchronous/asynchronous read modes.
Its clocking architecture features four DCMs (Digital Clock Managers) supporting phase shifting, frequency synthesis, and duty-cycle correction across up to 16 global clock networks. Configuration is performed via Master Serial, Slave Serial, or SelectMAP modes using external SPI flash or microprocessor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic density for custom digital functions |
| I/O Pins | 186 - supports multi-protocol interface routing with bank-wise voltage assignment |
| Block RAM | 93 × 18 Kb = 1,674 Kb - enables local data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - provides hardwired multiply-accumulate capability for filtering and math-intensive tasks |
| DCMs | 4 × Digital Clock Manager - delivers jitter-tolerant clock synthesis and phase alignment for multi-clock domain systems |
| Configuration Mode | Master/Slave Serial, SelectMAP - allows flexible boot sources including SPI flash or host processor control |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz for critical paths in worst-case industrial temperature |
Pinout & Package
XC6SLX25-N3FG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad exposed on underside improves power dissipation for sustained operation at 85°C ambient.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage level and input threshold for associated pins |
| P2 | IO_L1P_0 | Differential I/O pair positive - supports LVDS, TMDS, or RSDS signaling when paired with N2 |
| N2 | IO_L1N_0 | Differential I/O pair negative - must be routed with matched length and impedance to P2 |
| T12 | CCLK | Configuration clock - drives internal configuration logic during startup or reconfiguration |
| R15 | DONE | Configuration status indicator - goes high when bitstream loading completes successfully |
| U13 | INIT_B | Configuration initialization - active-low signal indicating readiness to accept new bitstream |
| Y16 | PROGRAM_B | Global reset - forces device into configuration mode when pulsed low |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Each of 10 I/O banks independently supports 1.2 V, 1.8 V, 2.5 V, or 3.3 V signaling - enables direct interfacing with mixed-voltage peripherals |
| Dedicated PCI Express Endpoint Logic | Hard IP for PCIe Gen1 x1 endpoint - eliminates need for soft-core implementation and reduces resource usage |
| Embedded Block RAM Flexibility | Configurable as single-port, dual-port, or simple dual-port with independent clocks - supports asynchronous FIFOs and ping-pong buffers |
| Low-Power Architecture | 1.2 V core voltage with dynamic power gating - reduces static power by up to 40% versus 1.8 V predecessors |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port - enables board-level interconnect testing without physical probe access |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (PROFIBUS, CANopen) and backplane Ethernet. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic controller and protocol gateway with sub-microsecond I/O response latency. Use Value: XC6SLX25-N3FG484C delivers 186 programmable I/Os and integrated DCMs to synchronize multiple sensor sampling clocks to a central timebase. | Use Scenario: High-speed pixel data aggregation from multiple CMOS image sensors to a GPU or video encoder ASIC. IC Role / Device Role / Timing Role: FPGA serves as parallel-to-serial serializer and timing adapter, aligning asynchronous sensor frame clocks. Use Value: XC6SLX25-N3FG484C provides 180 DSP48A1 slices for real-time pixel interpolation and 93 BRAM blocks for line buffer storage without external memory. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete digital signals into a unified Ethernet/IP stream for flight data recorders. IC Role / Device Role / Timing Role: FPGA implements deterministic bus controllers and time-stamped packet assembly with hardware timestamping. Use Value: XC6SLX25-N3FG484C supports 1.2 V core and extended temperature range (-40°C to +85°C), meeting DO-254 design assurance requirements. | Use Scenario: Generating precise, repeatable digital stimulus waveforms for IC functional validation and ATE systems. IC Role / Device Role / Timing Role: FPGA operates as high-resolution pattern sequencer with synchronized multi-channel output drivers. Use Value: XC6SLX25-N3FG484C offers 24,051 logic cells and 4 DCMs to generate multi-phase, jitter-controlled clocks driving 186 I/O pins at up to 1 GHz toggle rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CPG196I | Fewer logic cells (14,579), 118 I/O, smaller 196-pin CSBGA package - lower gate count and reduced board area | Suitable for cost-sensitive, space-constrained designs with simpler logic and fewer I/Os | Select when system requires ≤120 I/O and <15K logic cells; not drop-in compatible due to different package and pinout |
| XC7A35T-2CSG324C | Artix-7 architecture, 33,280 logic cells, 210 I/O, -2 speed grade, 1.0 V core - higher performance and lower power but newer generation | Better suited for designs requiring PCIe Gen2, DDR3 memory controller, or higher DSP throughput | Choose for new designs needing enhanced resources or future-proofing; requires full schematic and layout revision |
Compared with XC6SLX25-N3FG484C, XC6SLX16-3CPG196I trades I/O count and logic density for compactness and cost, while XC7A35T-2CSG324C offers architectural improvements and expanded peripheral support at the expense of legacy toolchain compatibility.
Availability
XC6SLX25-N3FG484C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, low-latency applications.
The Spartan-6 family, including XC6SLX25-N3FG484C, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.
FAQ
What is the maximum operating junction temperature for XC6SLX25-N3FG484C?
The XC6SLX25-N3FG484C has a maximum junction temperature of 100°C under industrial-grade thermal conditions. This rating applies when operated within its specified voltage and ambient temperature range (-40°C to +85°C). The device's thermal resistance (θJA) is 22.5°C/W in typical PCB layout conditions, and proper heat sinking or airflow is recommended for sustained high-utilization operation. XC6SLX25-N3FG484C thermal performance is validated per JEDEC JESD51 standards.
Does XC6SLX25-N3FG484C support configuration via JTAG only?
No, XC6SLX25-N3FG484C supports multiple configuration modes: JTAG, Master Serial (SPI flash), Slave Serial (host processor), and SelectMAP (parallel bus). JTAG is used primarily for debugging and programming during development, while Master Serial is common in production for autonomous boot. XC6SLX25-N3FG484C does not require external configuration PROM if using Slave Serial or SelectMAP, and all modes are mutually exclusive per power-on cycle.
Can XC6SLX25-N3FG484C interface directly with DDR2 memory?
XC6SLX25-N3FG484C does not include a hard DDR2 memory controller. However, it supports DDR2 SDRAM interfacing using Xilinx-provided soft IP cores (e.g., MIG v3.7) with appropriate I/O constraints and timing closure. XC6SLX25-N3FG484C I/O banks support SSTL-18 and SSTL-2 standards required for DDR2, and its DCMs provide clock phase alignment for write leveling. External PHY or level-shifting may be needed depending on memory module voltage.
Is XC6SLX25-N3FG484C RoHS compliant and halogen-free?
Yes, XC6SLX25-N3FG484C is RoHS 2015/863 compliant and certified halogen-free per IEC 61249-2-21. The FBGA package uses lead-free solder balls (SnAgCu) and green molding compound. Certificate of Compliance (CoC) and material declarations are available from AMD upon request. XC6SLX25-N3FG484C meets IPC-J-STD-609A Class 1 definition for halogen content limits.
What software tools are required to develop for XC6SLX25-N3FG484C?
XC6SLX25-N3FG484C requires Xilinx ISE Design Suite 14.7 as the official supported toolchain. This includes synthesis (XST), implementation (MAP, PAR), and bitstream generation (BITGEN), along with ChipScope Pro for in-system debugging. Vivado does not support Spartan-6 devices. XC6SLX25-N3FG484C bitstreams generated in ISE 14.7 are backward-compatible with earlier ISE versions down to 13.4, but newer features require the final release.
XC6SLX25-N3FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 266
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25-N3FG484C FAQ
1.How can I place an order for XC6SLX25-N3FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-N3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-N3FG484C reliable?
The price and inventory of XC6SLX25-N3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-N3FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-N3FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-N3FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-N3FG484C?
XC6SLX25-N3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-N3FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-N3FG484C?
For technical support, including XC6SLX25-N3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-N3FG484C requirements.
6.How does Aetrix verify that XC6SLX25-N3FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-N3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-N3FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-N3FG484C?
All XC6SLX25-N3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-N3FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-N3FG484C part is unused and in its original packaging.
Return procedure for XC6SLX25-N3FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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