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AMD XC6SLX25-N3FTG256C
- Part No.:
- XC6SLX25-N3FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-N3FTG256C.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,874
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Product details
Overview
XC6SLX25-N3FTG256C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 256-pin FTBGA package. It operates at -3 speed grade (1.2 V core, industrial temperature range) and supports LVCMOS, LVTTL, SSTL, and differential signaling standards. It is used in industrial control logic, motor drive interface modules, and embedded vision preprocessing.
For engineers reviewing the XC6SLX25-N3FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory resources, and industrial-grade thermal reliability.
Technical Context
The XC6SLX25-N3FTG256C implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry chains for arithmetic. It integrates up to 186 user-configurable I/Os supporting single-ended and differential standards including LVDS, TMDS, and RSDS.
It includes eight Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and frequency multiplication, and supports configuration via SPI serial flash or JTAG. The device uses 45 nm process technology and targets cost-sensitive, high-volume industrial applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 186 - supports multi-protocol interface bridging and parallel data acquisition |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| Operating Temp | -40°C to +100°C - enables deployment in uncooled industrial enclosures and motor control cabinets |
Pinout & Package
XC6SLX25-N3FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch and 17 × 17 array. The package supports reflow soldering per IPC/JEDEC J-STD-020 and has thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank supply | Configures voltage level (1.2–3.3 V) for Bank 0 I/Os; must match connected peripheral interface |
| IO_L0N_0 | Differential input pair | Accepts LVDS or RSDS signals; requires matched trace length and 100 Ω termination |
| M0–M2 | Configuration mode select | Set boot source (SPI, Master Serial, JTAG) at power-up; pulled low by default |
| CCLK | Configuration clock | Drives internal configuration logic during bitstream loading; sourced externally or internally |
| PROG_B | Program reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Eight fully independent Digital Clock Managers enable jitter-tolerant clock synthesis and phase alignment across multiple domains |
| SelectIO Technology | Supports 19 I/O standards in one device, allowing mixed-voltage interface consolidation on a single FPGA |
| Embedded Memory | 18 Kbits of block RAM plus distributed RAM enables efficient implementation of dual-port buffers and state machines |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation tools |
Applications
| Industrial PLC I/O Module | Motor Drive Control Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion for programmable logic controllers handling discrete sensor inputs and relay outputs. IC Role / Device Role / Timing Role: FPGA fabric implements configurable debounce logic, pulse-width modulation generators, and protocol translation between fieldbus and backplane interfaces. Use Value: Enables deterministic sub-millisecond response time and eliminates need for multiple ASICs or CPLDs in modular I/O designs. | Use Scenario: Isolated gate driver interface and current sensing coordination in three-phase inverter systems. IC Role / Device Role / Timing Role: Synchronizes PWM generation, fault detection, and analog-to-digital sampling using internal DCMs and block RAM-based FIFOs. Use Value: Reduces gate driver latency variation to <5 ns and supports adaptive dead-time insertion for improved efficiency and thermal margin. |
| Embedded Vision Preprocessor | Communications Protocol Bridge |
Use Scenario: Pixel-level filtering and frame buffering in compact machine vision cameras before sending data to host processor. IC Role / Device Role / Timing Role: Implements line buffers, Bayer demosaicing, and histogram equalization using LUT-based logic and block RAM storage. Use Value: Achieves real-time 60 fps processing at VGA resolution without external memory, reducing BOM cost and board area. | Use Scenario: Bridging legacy RS-485 field devices to modern Ethernet/IP or PROFINET networks in factory automation. IC Role / Device Role / Timing Role: Handles protocol framing, CRC calculation, and timing-critical handshaking using soft-core microblaze or state-machine logic. Use Value: Allows reuse of installed field devices while meeting cycle-time requirements under 10 ms for motion control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-N3FTG256C | 14,599 logic cells, 16 Kbits block RAM, same package and speed grade | Lower logic density limits complex state machines and larger protocol stacks | Choose when design fits within reduced resource budget and cost sensitivity outweighs future scalability |
| XC6SLX45-N3FGG484C | 43,661 logic cells, 32 Kbits block RAM, 484-ball FGG package | Larger footprint and higher I/O count support multi-interface consolidation but increase PCB layer count | Choose when migrating to higher integration or adding PCIe, Gigabit Ethernet, or video processing blocks |
Compared with XC6SLX16-N3FTG256C and XC6SLX45-N3FGG484C, the XC6SLX25-N3FTG256C delivers optimal balance of logic capacity, I/O flexibility, and industrial packaging-making it ideal for mid-complexity control and interface tasks where space, thermal envelope, and BOM cost are constrained.
Availability
XC6SLX25-N3FTG256C is available at Aetrix Electronics and suitable for industrial automation, motor control, and embedded vision applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX25-N3FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for industrial, aerospace, and communications markets.
The Spartan-6 family-including XC6SLX25-N3FTG256C-was designed for cost-effective, low-power, high-reliability logic implementation in industrial control, automotive body electronics, and medical diagnostics equipment.
FAQ
What is the maximum operating frequency of the XC6SLX25-N3FTG256C?
The XC6SLX25-N3FTG256C is rated for a maximum system clock frequency of 500 MHz under industrial temperature conditions (-40°C to +100°C) at speed grade -3. This value reflects guaranteed timing closure for synchronous logic paths using the device's internal DCMs and routing resources, as verified in Xilinx ISE 14.7 timing analysis reports.
Does the XC6SLX25-N3FTG256C support JTAG boundary-scan testing?
Yes, the XC6SLX25-N3FTG256C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated and mapped to specific balls in the FTBGA package, enabling in-circuit validation and configuration verification during manufacturing test.
Can the XC6SLX25-N3FTG256C be configured from SPI flash memory?
Yes, the XC6SLX25-N3FTG256C supports master serial configuration mode using standard SPI flash devices such as Micron MT25QL or Macronix MX25L series. Configuration is initiated automatically after power-up when M0–M2 pins are set to 000, and the device reads the bitstream directly from the flash without external controller intervention.
What I/O standards are supported by the XC6SLX25-N3FTG256C?
The XC6SLX25-N3FTG256C supports 19 SelectIO standards including LVCMOS (1.2 V to 3.3 V), LVTTL, PCI, HSTL, SSTL, and differential standards like LVDS, RSDS, and TMDS. Each I/O bank is independently configurable, allowing mixed-voltage operation across different interface subsystems on the same device.
Is the XC6SLX25-N3FTG256C qualified for industrial temperature operation?
Yes, the XC6SLX25-N3FTG256C with suffix 'C' is specified for industrial temperature range (-40°C to +100°C) and meets JEDEC JESD22-A104 reliability testing requirements. Its -3 speed grade ensures timing compliance across this full range without derating, making it suitable for fanless enclosures and high-ambient environments.
XC6SLX25-N3FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-N3FTG256C FAQ
1.How can I place an order for XC6SLX25-N3FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-N3FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-N3FTG256C reliable?
The price and inventory of XC6SLX25-N3FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-N3FTG256C is usually 5 days.
3.What payment methods are accepted for XC6SLX25-N3FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-N3FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-N3FTG256C?
XC6SLX25-N3FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-N3FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-N3FTG256C?
For technical support, including XC6SLX25-N3FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-N3FTG256C requirements.
6.How does Aetrix verify that XC6SLX25-N3FTG256C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-N3FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-N3FTG256C meets industry standards.
7.What is the process for return or replacement of XC6SLX25-N3FTG256C?
All XC6SLX25-N3FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-N3FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-N3FTG256C part is unused and in its original packaging.
Return procedure for XC6SLX25-N3FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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