My Inquiry
My Account
AMD XC6SLX25-N3FTG256I
- Part No.:
- XC6SLX25-N3FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC6SLX25-N3FTG256I.pdf
- Description:
- IC FPGA 186 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,566
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX25-N3FTG256I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and support for LVDS, SSTL, and HSTL I/O standards. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and is used in industrial control interfaces requiring deterministic timing and moderate logic density.
For engineers reviewing the XC6SLX25-N3FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2V/1.8V/2.5V/3.3V), embedded DSP48A1 slices for arithmetic acceleration, and dual-boot configuration capability via SPI/BPI.
Technical Context
The XC6SLX25-N3FTG256I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic chains. It integrates twelve 18×18 multipliers and supports DDR2/DDR3 memory interfaces up to 800 Mbps data rate.
Configuration is performed via Master Serial (SPI), Slave Serial, or SelectMAP modes using internal or external PROM. The device includes internal oscillator, JTAG boundary-scan, and partial reconfiguration support through ICAP interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent to ~150K ASIC gates for medium-complexity digital logic |
| Block RAM | 18 Kbits - supports small FIFOs, lookup tables, or local data buffering without external memory |
| DSP Slices | 12 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| I/O Standards | LVDS, SSTL-2, SSTL-18, HSTL-I, LVCMOS - allows direct interfacing with DDR2/DDR3, ADCs, and FPGAs |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for use in uncooled industrial enclosures and outdoor equipment |
Pinout & Package
XC6SLX25-N3FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm pitch and 17×17 mm body size. Pin assignment follows Xilinx SP605 reference layout for consistent PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0N_0 | Dedicated I/O bank 0, differential pair negative | Supports LVDS input termination and 3.3V/2.5V/1.8V/1.2V I/O voltage per bank |
| M0–M2 | Mode configuration pins | Determine boot source (SPI/BPI/Slave Serial) at power-up; pulled high by default |
| CCLK | Configuration clock output | Drives external PROM during Master Serial mode; frequency programmable up to 50 MHz |
| DONE | Configuration status indicator | Open-drain output asserted high when bitstream loading completes successfully |
| PROG_B | Configuration reset input | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Boot Configuration | Enables field-upgradable firmware images stored in external SPI flash with fail-safe fallback to backup image |
| Embedded Block RAM | 18 Kbits distributed across 32 BRAM primitives, each configurable as 18K × 1, 9K × 2, or 36K × 1 |
| Multi-Voltage I/O Banks | Eight independent I/O banks allow mixed-voltage operation (1.2V/1.5V/1.8V/2.5V/3.3V) on same device |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port supports in-circuit verification and programming without dedicated debug headers |
| Internal Oscillator | ~50 MHz RC oscillator for configuration and low-speed clocking; not suitable for timing-critical logic |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus (CANopen, Profibus) and host controller. IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O bridge with sub-microsecond latency and synchronized sampling clocks. Use Value: XC6SLX25-N3FTG256I delivers sufficient logic resources and I/O flexibility to replace multiple ASICs while supporting industrial temperature operation. | Use Scenario: Pixel data aggregation from parallel CMOS sensors and serialization into Camera Link or LVDS streams. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, line buffering, and 8b/10b encoding for high-reliability transmission. Use Value: XC6SLX25-N3FTG256I provides 12 DSP slices and LVDS transceivers capable of 840 Mbps per lane required for real-time imaging pipelines. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone. IC Role / Device Role / Timing Role: FPGA serves as time-triggered communication gateway with hardware timestamping and error detection logic. Use Value: XC6SLX25-N3FTG256I supports dual-boot and ECC-capable configuration memory for DO-254 compliance in safety-critical avionics. | Use Scenario: Generating high-fidelity digital stimulus waveforms for ATE systems testing SoCs and memory devices. IC Role / Device Role / Timing Role: FPGA implements deep pattern memory, variable clock dividers, and precise edge placement with jitter < 150 ps. Use Value: XC6SLX25-N3FTG256I offers 24K logic cells and fine-grained I/O delay control enabling sub-nanosecond timing resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX25-3CSG324C | Same logic capacity but in 324-pin CSBGA package with higher I/O count (204 vs. 186) and commercial temp range (0°C to +85°C) | Lacks industrial temperature rating; unsuitable for extended ambient environments | Select only for cost-sensitive commercial designs where thermal margin exceeds 20°C |
| XC7S25-1CSGA225I | Artix-7 successor with 23K logic cells, 12.5 Gbps transceivers, and -1 speed grade; requires different toolchain and pinout | Not pin-compatible; migration requires PCB redesign and Vivado-based reimplementation | Choose for new designs needing higher serial bandwidth or lower static power, not for drop-in replacement |
Compared with XC6SLX25-N3FTG256I, the XC6SLX25-3CSG324C trades industrial reliability for I/O scalability, while the XC7S25-1CSGA225I offers architectural upgrades at the cost of design continuity and toolchain compatibility.
Availability
XC6SLX25-N3FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and avionics subsystems requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX25-N3FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 family as a long-lifecycle offering for cost-sensitive, high-reliability applications.
The Spartan-6 FPGA product line was designed for embedded control, interface bridging, and logic consolidation in industrial, medical, and aerospace systems where power efficiency and predictable timing outweigh raw performance.
FAQ
What is the maximum supported I/O voltage for XC6SLX25-N3FTG256I?
The XC6SLX25-N3FTG256I supports I/O voltages of 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V per bank. Each of the eight I/O banks can be independently configured to one of these standards, enabling mixed-voltage interfaces on a single XC6SLX25-N3FTG256I device without level-shifting components.
Does XC6SLX25-N3FTG256I support partial reconfiguration?
Yes, XC6SLX25-N3FTG256I supports partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows dynamic logic updates in runtime-critical sections without resetting the entire device, provided the design is partitioned using Xilinx ISE tools and adheres to area constraints defined for reconfigurable modules in the XC6SLX25-N3FTG256I architecture.
What configuration modes are available for XC6SLX25-N3FTG256I?
XC6SLX25-N3FTG256I supports Master Serial (SPI), Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master Serial is most common for standalone operation using external SPI flash, while JTAG is used for debugging and initial programming of the XC6SLX25-N3FTG256I.
Is XC6SLX25-N3FTG256I RoHS compliant and lead-free?
Yes, XC6SLX25-N3FTG256I is RoHS compliant and features a lead-free, halogen-free package. The FTG256 package uses matte tin finish on all I/O balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requiring bake preconditioning before reflow if exposed to ambient beyond floor life limits specified for the XC6SLX25-N3FTG256I.
What is the purpose of the DONE pin on XC6SLX25-N3FTG256I?
The DONE pin on XC6SLX25-N3FTG256I is an open-drain output that signals successful completion of configuration. It transitions high after the entire bitstream is loaded and CRC-checked. External circuitry can monitor this pin to enable downstream logic or initiate system initialization once the XC6SLX25-N3FTG256I is fully operational and ready to execute user logic.
XC6SLX25-N3FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 186
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC6SLX25-N3FTG256I FAQ
1.How can I place an order for XC6SLX25-N3FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25-N3FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25-N3FTG256I reliable?
The price and inventory of XC6SLX25-N3FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25-N3FTG256I is usually 5 days.
3.What payment methods are accepted for XC6SLX25-N3FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25-N3FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25-N3FTG256I?
XC6SLX25-N3FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25-N3FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25-N3FTG256I?
For technical support, including XC6SLX25-N3FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25-N3FTG256I requirements.
6.How does Aetrix verify that XC6SLX25-N3FTG256I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25-N3FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25-N3FTG256I meets industry standards.
7.What is the process for return or replacement of XC6SLX25-N3FTG256I?
All XC6SLX25-N3FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25-N3FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25-N3FTG256I part is unused and in its original packaging.
Return procedure for XC6SLX25-N3FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX25-N3FTG256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
