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AMD XC6SLX25T-2CSG324I
- Part No.:
- XC6SLX25T-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25T-2CSG324I.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:126
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Product details
Overview
XC6SLX25T-2CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and a -2 speed grade operating at up to 766 MHz system clock frequency. It features 214 user I/O pins in a 324-pin CSG package and supports LVCMOS, LVTTL, SSTL, and differential signaling standards for embedded control and interface bridging applications.
For engineers reviewing the XC6SLX25T-2CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O voltage flexibility, embedded DSP slice count, and industrial temperature range (-40°C to +100°C) support.
Technical Context
The XC6SLX25T-2CSG324I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated 18×18 multipliers. It integrates six Digital Clock Managers (DCMs) and phase-locked loops (PLLs) for clock synthesis and jitter reduction across multiple domains.
It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination (up to 150 Ω), enabling direct interfacing with DDR2/DDR3 memory, PCI Express endpoints, and industrial serial protocols without external level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic density for control state machines and data path implementation |
| Block RAM | 18 Kbits - supports small buffers, FIFOs, and lookup tables without external memory |
| Max System Clock | 766 MHz - enables high-speed synchronous design with tight timing closure margins |
| User I/O Pins | 214 - provides scalable connectivity for parallel buses, sensor arrays, and peripheral interfaces |
| Speed Grade | -2 - guarantees timing performance under worst-case industrial temperature and voltage conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial and transportation environments |
| DSP Slices | 64 - accelerates fixed-point arithmetic for motor control, filtering, and real-time signal processing |
Pinout & Package
XC6SLX25T-2CSG324I is housed in a 324-ball fine-pitch CSPBGA (Chip Scale Ball Grid Array) package with 1.0 mm ball pitch and 16 × 16 array configuration. The package supports reflow soldering and meets JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies configurable output voltage (1.2–3.3 V) for Bank 0 I/Os |
| GND | Ground Reference | Provides low-impedance return path for all signal and power domains |
| CLKIN | Primary Clock Input | Accepts single-ended or differential clock source for DCM/PLL input |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears SRAM contents |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs & PLLs | Enables multi-domain clock generation, frequency synthesis, and phase alignment without external clock ICs |
| SelectIO™ Technology | Allows per-bank I/O voltage assignment and on-die termination tuning to match diverse interface standards |
| Embedded DSP Slices | Delivers 18×18 signed multiplication with optional accumulator for real-time control loop computation |
| Configurable Logic Blocks | Each CLB contains four 6-input LUTs and eight flip-flops, supporting efficient pipelining and resource sharing |
| Multi-Boot Support | Permits dual-bitstream storage and runtime selection for field-upgradable firmware and fail-safe recovery |
Applications
| Industrial PLC I/O Module | Automotive ADAS Sensor Hub |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response for ladder logic execution and analog channel scanning. IC Role / Device Role / Timing Role: FPGA fabric executes custom I/O protocol translation and time-critical interrupt handling with sub-microsecond latency. Use Value: 214 user I/Os and -40°C to +100°C operation enable direct integration into DIN-rail mounted controllers without thermal derating. | Use Scenario: Aggregation and preprocessing of camera, radar, and ultrasonic sensor data before forwarding to host SoC. IC Role / Device Role / Timing Role: XC6SLX25T-2CSG324I acts as a sensor interface bridge with parallel LVDS capture and DDR2 memory buffering. Use Value: Six DCMs provide independent clock domains for sensor sampling, memory access, and PCIe upstream transmission. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: High-speed ADC/DAC interface and real-time waveform shaping in portable ultrasound systems. IC Role / Device Role / Timing Role: XC6SLX25T-2CSG324I implements digital beamforming and FIR filtering using embedded DSP slices. Use Value: 64 DSP slices and 18 Kbits block RAM allow coefficient storage and pipeline-optimized convolution kernels. | Use Scenario: Flexible pattern generation, signal acquisition, and protocol analysis in automated test equipment. IC Role / Device Role / Timing Role: Configurable logic implements custom trigger engines, deep sample buffers, and serial bus analyzers (SPI/I²C/UART). Use Value: SelectIO™ supports mixed-voltage probing and on-die termination matching for accurate signal integrity at 200+ MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45T-2FGG484I | 43,661 logic cells, 484-pin FBGA, higher I/O count (348), larger package footprint | Suitable for designs requiring expanded logic density and additional high-speed transceivers | Select when migrating from XC6SLX25T-2CSG324I to accommodate increased algorithm complexity or multi-interface concurrency |
| XC7S25-1CSGA225I | Artix-7 architecture, 25K logic cells, 225-pin CSBGA, lower static power, no DCMs (uses MMCM only) | Better suited for battery-powered or thermally constrained applications where dynamic power efficiency is critical | Prefer for new designs targeting reduced power envelope and enhanced DSP throughput per watt, not drop-in replacement |
Compared with XC6SLX25T-2CSG324I, XC6SLX45T-2FGG484I offers scalability for logic-intensive upgrades, while XC7S25-1CSGA225I shifts trade-offs toward power efficiency and modern toolchain support-neither is pin-compatible, requiring PCB redesign and timing revalidation.
Availability
XC6SLX25T-2CSG324I is available at Aetrix Electronics and suitable for industrial automation, automotive sensor fusion, and medical device manufacturing requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX25T-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 FPGA family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-volume embedded systems requiring predictable timing, low static power, and broad I/O standard support without high-end transceiver complexity.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX25T-2CSG324I?
XC6SLX25T-2CSG324I supports I/O voltages from 1.2 V to 3.3 V per bank, with each of its eight I/O banks independently configurable. This allows simultaneous interfacing with 1.8 V sensors, 3.3 V legacy peripherals, and 2.5 V memory interfaces-all within a single XC6SLX25T-2CSG324I device without level shifters.
Does XC6SLX25T-2CSG324I include built-in configuration memory?
No, XC6SLX25T-2CSG324I uses external non-volatile memory (e.g., SPI Flash) for configuration bitstream storage. The device loads configuration on power-up via Master Serial or Slave SelectMAP mode. Internal SRAM holds the active configuration but is volatile and requires reload after power cycle.
Can XC6SLX25T-2CSG324I directly drive DDR2 memory interfaces?
Yes, XC6SLX25T-2CSG324I supports DDR2 SDRAM interfaces through its SelectIO™ I/Os with programmable drive strength, slew rate, and on-die termination. It meets JEDEC DDR2 timing specifications when used with appropriate board layout and clock routing, and is validated in Xilinx UG382 for 400 Mbps data rates.
What clock resources are integrated into XC6SLX25T-2CSG324I?
XC6SLX25T-2CSG324I integrates six Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs). Each DCM provides frequency synthesis, phase shifting, duty cycle correction, and clock doubling; PLLs offer wider frequency ranges and lower jitter for high-speed domain generation. All are accessible via Xilinx ISE tools.
Is XC6SLX25T-2CSG324I qualified for automotive applications?
XC6SLX25T-2CSG324I is rated for industrial temperature range (-40°C to +100°C) and meets AEC-Q100 stress test requirements for some variants, but the specific XC6SLX25T-2CSG324I part number is not AEC-Q100 certified. For automotive use, designers must perform full system-level qualification and consult AMD's automotive qualification roadmap for compatible derivatives.
XC6SLX25T-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25T-2CSG324I FAQ
1.How can I place an order for XC6SLX25T-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-2CSG324I reliable?
The price and inventory of XC6SLX25T-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-2CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-2CSG324I?
XC6SLX25T-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-2CSG324I?
For technical support, including XC6SLX25T-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-2CSG324I requirements.
6.How does Aetrix verify that XC6SLX25T-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-2CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-2CSG324I?
All XC6SLX25T-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-2CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX25T-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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