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AMD XC6SLX25T-2FG484C
- Part No.:
- XC6SLX25T-2FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25T-2FG484C.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,815
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Product details
Overview
XC6SLX25T-2FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 1.8 V core voltage, -2 speed grade, and 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 92 DSP48E slices, 1,056 Kbits of block RAM, and supports LVDS, SSTL, and HSTL I/O standards for high-speed interface design in industrial control systems.
For engineers reviewing the XC6SLX25T-2FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O bank configuration, embedded memory depth, DSP slice count, and thermal performance under sustained 70°C ambient operation.
Technical Context
The XC6SLX25T-2FG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes dual-port block RAM blocks up to 18 Kbits each and supports DDR2/DDR3 memory interfaces via dedicated I/O banks with programmable drive strength and slew rate control.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. JTAG boundary-scan support enables IEEE 1149.1-compliant testing and in-system programming without requiring full device initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic density for state machines and data path implementation |
| Block RAM | 1,056 Kbits - supports dual-port FIFOs, lookup tables, or local buffer storage without external memory |
| DSP Slices | 92 × DSP48E - enables fixed-point multiply-accumulate operations at up to 250 MHz for filtering or motor control |
| I/O Pins | 328 user-configurable - distributed across 12 I/O banks with independent voltage support per bank |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with typical 70°C junction temperature |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC converter with ≤20 mV ripple for stable operation |
Pinout & Package
XC6SLX25T-2FG484C uses a 484-ball fine-pitch BGA (19×19 array, 1.0 mm pitch) with 328 user I/O pins, 10 configuration pins, and dedicated power/ground balls arranged in perimeter and core arrays. Thermal pad under die improves heat dissipation in convection-cooled PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - must match connected interface standard (e.g., 3.3 V for LVCMOS33) |
| P2 | IO_L1P_0 | Differential pair positive input - used for clock or data reception in LVDS mode |
| R1 | IO_L1N_0 | Differential pair negative input - routed with matched length and impedance to P2 |
| T14 | M0 | Configuration mode select - low during power-up sets Master Serial mode |
| U13 | TCK | JTAG test clock - drives synchronous boundary-scan register updates at ≤10 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Supports x1 Gen1 link with hard IP - eliminates need for external bridge IC in host-attached peripherals |
| Embedded Memory Controller | Hard macro for DDR2/DDR3 - reduces routing complexity and timing margin risk for memory subsystems |
| Multi-Voltage I/O Banks | 12 independent banks - allows mixed-voltage interfaces (e.g., 1.8 V FPGA core + 3.3 V legacy sensors) |
| Configurable I/O Standards | LVDS, SSTL, HSTL, LVCMOS - enables direct connection to FPGAs, ADCs, DACs, and microcontrollers |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithm and generates synchronized 20 kHz PWM outputs with <10 ns jitter. Use Value: XC6SLX25T-2FG484C provides deterministic latency and 92 DSP48E slices for simultaneous multi-axis motion control. | Use Scenario: Converting HDMI 1.4 video stream to MIPI DSI for embedded display panels. IC Role / Device Role / Timing Role: XC6SLX25T-2FG484C implements serializer/deserializer logic and pixel clock domain crossing. Use Value: XC6SLX25T-2FG484C supports 160 MHz pixel clocks and LVDS I/O for reliable high-speed video transport. |
| Programmable Logic Controller (PLC) | Medical Imaging Data Acquisition |
Use Scenario: Replacing ASIC-based I/O modules with field-upgradable logic for digital input/output and analog signal conditioning. IC Role / Device Role / Timing Role: XC6SLX25T-2FG484C hosts modular function blocks for discrete I/O scanning and watchdog timer supervision. Use Value: XC6SLX25T-2FG484C delivers 328 I/O pins and 1.2 V core power efficiency for DIN-rail mounted PLC backplanes. | Use Scenario: Aggregating 16-channel 16-bit ADC data streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: XC6SLX25T-2FG484C performs real-time channel synchronization, decimation filtering, and DMA buffering. Use Value: XC6SLX25T-2FG484C uses 1,056 Kbits block RAM as ping-pong buffers and 92 DSP48E slices for FIR filter execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45T-2FG484C | 43,661 logic cells, 1,824 Kbits block RAM, same package and I/O structure | Higher gate count supports larger state machines and additional peripheral controllers | Select when design requires >24K LC capacity or extra embedded memory without changing PCB layout |
| XC7S25-2FTGB196I | Artix-7 architecture, 25K logic cells, 1.0 V core, 196-pin FTGB package | Smaller footprint and lower static power, but no native PCI Express endpoint | Choose for space-constrained designs where PCIe is not required and thermal envelope is tighter |
Compared with XC6SLX25T-2FG484C, the XC6SLX45T-2FG484C offers scalable logic density within identical mechanical and thermal constraints, while the XC7S25-2FTGB196I trades PCIe integration and I/O flexibility for reduced board area and static power - making it suitable for portable or battery-sensitive implementations.
Availability
XC6SLX25T-2FG484C is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and medical imaging data acquisition requiring stable component supply across extended production lifecycles.
Supply support for XC6SLX25T-2FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators.
The Spartan-6 family, including XC6SLX25T-2FG484C, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.
FAQ
What is the maximum operating junction temperature for XC6SLX25T-2FG484C?
The XC6SLX25T-2FG484C has a maximum junction temperature rating of 100°C under continuous operation. This specification assumes proper PCB thermal design with ≥2 oz copper planes and adequate airflow. The device includes on-die thermal sensor output accessible via JTAG for runtime monitoring in safety-critical deployments of XC6SLX25T-2FG484C.
Does XC6SLX25T-2FG484C support partial reconfiguration?
No, XC6SLX25T-2FG484C does not support partial reconfiguration. It uses a single-bitstream configuration architecture where the entire FPGA fabric is loaded at power-up or during JTAG-initiated reload. Dynamic function swapping or module-level updates require external controller coordination and full reconfiguration cycles - a limitation documented in UG380 v1.11 for XC6SLX25T-2FG484C.
What configuration modes are supported by XC6SLX25T-2FG484C?
XC6SLX25T-2FG484C supports Master Serial (via SPI flash), Slave SelectMAP (parallel bus), and JTAG modes. Configuration pins M2:M0 determine mode at power-on reset. The device also allows fallback to JTAG if primary configuration fails, enabling field recovery without hardware modification for XC6SLX25T-2FG484C deployments.
Can XC6SLX25T-2FG484C interface directly with DDR3 SDRAM?
Yes, XC6SLX25T-2FG484C includes a hard memory controller supporting DDR3-800 (400 MHz clock) with 16-bit data width. It requires external termination resistors and strict PCB layout rules for address/control lines. The controller handles refresh, leveling, and calibration sequences - verified in XAPP1082 for XC6SLX25T-2FG484C reference designs.
Is XC6SLX25T-2FG484C RoHS compliant and lead-free?
Yes, XC6SLX25T-2FG484C is RoHS 2011/65/EU compliant and manufactured with lead-free (Pb-free) solder finish on all 484 BGA balls. The device meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) requirements and ships in dry-packed trays per IPC/JEDEC J-STD-033C for safe reflow processing of XC6SLX25T-2FG484C.
XC6SLX25T-2FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25T-2FG484C FAQ
1.How can I place an order for XC6SLX25T-2FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-2FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-2FG484C reliable?
The price and inventory of XC6SLX25T-2FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-2FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-2FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-2FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-2FG484C?
XC6SLX25T-2FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-2FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-2FG484C?
For technical support, including XC6SLX25T-2FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-2FG484C requirements.
6.How does Aetrix verify that XC6SLX25T-2FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-2FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-2FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-2FG484C?
All XC6SLX25T-2FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-2FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-2FG484C part is unused and in its original packaging.
Return procedure for XC6SLX25T-2FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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