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AMD XC6SLX25T-3CSG324C
- Part No.:
- XC6SLX25T-3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25T-3CSG324C.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,002
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Product details
Overview
XC6SLX25T-3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It operates at -3 speed grade (1.2 V core, 1.2 ns LUT delay), supporting embedded control, industrial interface bridging, and video processing at moderate complexity.
For engineers reviewing the XC6SLX25T-3CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade compatibility, thermal profile in CSGA packaging, and availability of dedicated DSP48A1 slices for arithmetic acceleration.
Technical Context
The XC6SLX25T-3CSG324C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and 120 DSP48A1 slices supporting 18×25-bit multiply-accumulate operations. It integrates six clock management tiles (CMTs) with DCMs and PLLs for multi-domain clock synthesis and phase alignment.
Configuration is supported via Master Serial (SPI flash), JTAG, or SelectMAP interfaces. The device supports LVCMOS, LVDS, SSTL, and HSTL I/O standards across banks with independent voltage supply per bank (1.2 V to 3.3 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 18 Kbits - distributed as 72 × 256-bit RAM blocks usable as dual-port memory or FIFO buffers |
| DSP Slices | 120 × DSP48A1 - each performs 18×25-bit multiply + 48-bit accumulate in one cycle for signal processing |
| User I/O Pins | 186 - configurable across 12 I/O banks with independent voltage support and slew rate control |
| Speed Grade | -3 - guarantees timing closure at 1.2 ns LUT propagation delay under worst-case industrial conditions |
| Core Voltage | 1.2 V ±3% - fixed supply requirement for internal logic and CLB operation |
| Package | 324-pin CSGA (Chip Scale Grid Array) - 15×15 mm body, 0.8 mm pitch, JEDEC MO-240 compliant |
Pinout & Package
The XC6SLX25T-3CSG324C is housed in a 324-pin Chip Scale Grid Array (CSGA) package with 15×15 ball layout, 0.8 mm pitch, and exposed thermal pad. Pinout follows Xilinx UG385 v1.11 (Spartan-6 FPGA Packaging and Pinout Specifications), with dedicated configuration, clock, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply (configurable 1.2–3.3 V) |
| K1 | GCLK1 | Global clock input pin routed to all CMTs and CLBs |
| M1 | PROGRAM_B | Active-low asynchronous reset and configuration reinitiation trigger |
| P1 | TCK | JTAG test clock input for boundary scan and debug access |
| R1 | VCCAUX | 1.8 V auxiliary supply for configuration circuitry and transceivers |
| T1 | VCCINT | 1.2 V core logic supply - must be stable within ±3% during operation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Six CMTs (each with DCM + PLL) enable precise clock division, multiplication, phase shifting, and jitter reduction across multiple domains |
| Multi-Standard I/O Support | Per-bank voltage selection allows simultaneous LVCMOS, LVDS, and SSTL signaling without level shifters |
| Dedicated DSP Resources | 120 DSP48A1 slices deliver deterministic 18×25-bit MAC throughput for real-time filtering and FFT stages |
| Configurable Memory Blocks | 72 × 256-bit block RAMs support true dual-port read/write with independent clocks for buffering and data staging |
| Low-Power Architecture | 1.2 V core and selective power gating reduce dynamic and static power versus prior Spartan families |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation (Modbus RTU to EtherCAT) in compact PLC backplanes. IC Role / Device Role / Timing Role: FPGA fabric handles parallel bit mapping, CRC generation, and deterministic timing arbitration between fieldbus and controller interfaces. Use Value: 186 user I/Os and -3 speed grade ensure sub-10 µs response latency while supporting mixed-voltage sensor/actuator interfacing. | Use Scenario: Converting HDMI 1.3a pixel streams to MIPI D-PHY for embedded display subsystems in medical imaging devices. IC Role / Device Role / Timing Role: XC6SLX25T-3CSG324C implements serializer/deserializer logic, color space conversion, and frame buffering using block RAM and DSP slices. Use Value: Integrated LVDS I/O and 120 DSP48A1 slices enable pixel-rate arithmetic without external co-processors. |
| Automotive Diagnostic Tool | Test Equipment Pattern Generator |
Use Scenario: Portable OBD-II/J2534 pass-through device performing CAN message filtering, logging, and firmware update proxy functions. IC Role / Device Role / Timing Role: XC6SLX25T-3CSG324C manages dual-CAN controller interfaces, USB 2.0 PHY handshaking, and secure boot verification logic. Use Value: Independent I/O banks allow concurrent 3.3 V CAN transceiver and 1.8 V USB PHY signaling; CMTs synchronize timestamping across buses. | Use Scenario: Generating high-fidelity digital stimulus waveforms (up to 100 MHz) for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: FPGA fabric implements pattern sequencer, jitter-controlled clock divider, and parallel-to-serial conversion for multi-channel output. Use Value: -3 speed grade and 1.2 ns LUT delay guarantee setup/hold compliance at 100 MHz output rates with minimal skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324C | 14,579 logic cells, 90 DSP48A1 slices, 102 user I/Os - smaller resource footprint and lower static power | Lower gate count limits complex video pipelines or multi-protocol stacks | Select when design fits within reduced CLB/DSP/I/O budget and thermal envelope is tighter |
| XC6SLX45-3CSG324C | 43,661 logic cells, 216 DSP48A1 slices, 218 user I/Os - higher density and I/O count in same package | Enables full HD video scaling or dual Ethernet MAC + PCIe endpoint integration | Choose when additional logic, memory, or I/O is required without changing PCB layout |
Compared with XC6SLX16-3CSG324C and XC6SLX45-3CSG324C, the XC6SLX25T-3CSG324C delivers balanced logic, DSP, and I/O capacity for mid-tier industrial and video applications - avoiding overdesign while maintaining headroom for feature expansion.
Availability
XC6SLX25T-3CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and automotive diagnostics requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25T-3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, low-latency applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and flexible I/O - targeting industrial control, video, and embedded connectivity.
FAQ
What is the maximum operating frequency of the XC6SLX25T-3CSG324C?
The XC6SLX25T-3CSG324C supports a maximum system clock frequency of 500 MHz when using its internal PLLs and DCMs. This is achievable for critical paths meeting the -3 speed grade timing constraints, including 1.2 ns LUT delay and 0.35 ns carry chain delay. Actual performance depends on design placement, routing, and I/O standard selection. The XC6SLX25T-3CSG324C datasheet specifies timing parameters under industrial temperature and voltage conditions.
Does the XC6SLX25T-3CSG324C support JTAG programming?
Yes, the XC6SLX25T-3CSG324C supports IEEE 1149.1 JTAG boundary-scan programming and debugging via dedicated TCK, TMS, TDI, and TDO pins. JTAG enables in-system configuration, SRAM initialization, and real-time debug access to internal registers and CLBs. The XC6SLX25T-3CSG324C requires proper pull-up/pull-down on TMS and TDI for reliable JTAG state machine entry.
What I/O standards are supported by the XC6SLX25T-3CSG324C?
The XC6SLX25T-3CSG324C supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, and HSTL across its 12 I/O banks. Each bank has independent VCCO and VREF supplies, enabling mixed-voltage operation. The XC6SLX25T-3CSG324C does not support PCI-X or DDR4 signaling natively but supports DDR2/DDR3 with appropriate PHY logic.
Is the XC6SLX25T-3CSG324C RoHS compliant?
Yes, the XC6SLX25T-3CSG324C is RoHS-6 compliant and lead-free per JEDEC J-STD-020. It meets EU Directive 2011/65/EU requirements and carries the "Pb-free" marking on the package. The XC6SLX25T-3CSG324C also complies with REACH SVHC and conflict minerals reporting obligations as defined in AMD's product declarations.
Can the XC6SLX25T-3CSG324C be configured via SPI flash?
Yes, the XC6SLX25T-3CSG324C supports Master Serial mode using industry-standard SPI flash devices (e.g., Micron, Winbond, Macronix). Configuration occurs automatically on power-up when MODE pins are set to 001. The XC6SLX25T-3CSG324C reads bitstream from flash into internal SRAM, enabling single-image or multi-boot configurations with fallback support.
XC6SLX25T-3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25T-3CSG324C FAQ
1.How can I place an order for XC6SLX25T-3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-3CSG324C reliable?
The price and inventory of XC6SLX25T-3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-3CSG324C?
XC6SLX25T-3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-3CSG324C?
For technical support, including XC6SLX25T-3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-3CSG324C requirements.
6.How does Aetrix verify that XC6SLX25T-3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-3CSG324C?
All XC6SLX25T-3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX25T-3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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