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AMD XC6SLX25T-3CSG324C

Part No.:
XC6SLX25T-3CSG324C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-LFBGA, CSPBGA
Datasheet:
AetrixXC6SLX25T-3CSG324C.pdf
Description:
IC FPGA 190 I/O 324CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,002

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Product details

Overview

XC6SLX25T-3CSG324C from AMD is a Spartan-6 FPGA device intended for configurable logic, embedded digital processing support, and interface concentration in embedded and communications systems. This orderable option combines the Spartan-6 architecture with 324-LFBGA, CSPBGA, which supports denser I/O concentration and richer interface integration, allowing the design team to place board-specific logic, buffering, and connectivity functions into one FPGA platform rather than spreading them across multiple fixed-function devices.

Spartan-6 devices provide a cost- and power-conscious FPGA platform with embedded memory, DSP options, and broad package coverage for industrial and embedded systems. For engineers reviewing the XC6SLX25T-3CSG324C datasheet, XC6SLX25T-3CSG324C pinout, XC6SLX25T-3CSG324C application, or XC6SLX25T-3CSG324C equivalent, this device is widely used in embedded processing platforms, digital interface bridges, industrial control systems, communications equipment, sensor aggregation hardware, and programmable accelerator subsystems.

Technical Context

In real hardware, XC6SLX25T-3CSG324C is used as an FPGA platform rather than a fixed-function controller. The selected Spartan-6 density and speed grade 3 orderable option. matter because logic capacity, memory blocks, DSP availability, and I/O reach all influence whether the device can absorb the intended control, buffering, and protocol workload.

The exact orderable code is important here: 324-LFBGA, CSPBGA affects escape routing and memory-interface planning, speed grade 3 orderable option. affects timing margin, and the commercial temperature option indicated by the suffix. determines whether the part can be approved for the target deployment range. That combination often decides which device is actually released into a production BOM.

Larger Spartan-6 density point for embedded processing support, memory interfaces, and logic-consolidation workloads. In practice, this means XC6SLX25T-3CSG324C is typically chosen when the system needs FPGA flexibility for control-heavy datapaths, local acceleration, interface bridging, or memory-connected logic while still respecting board-area and package constraints.

Key Specifications

Parameter Value and Actual Design Meaning
Device Type Spartan-6 FPGA.
Series Spartan-6
Package 324-LFBGA, CSPBGA package with tray packing.
Speed Grade Speed grade 3 orderable option.
Operating Range Commercial temperature option indicated by the suffix.
Architecture Role Field-programmable logic device for configurable digital processing, interface adaptation, and subsystem integration.
Integration Focus Used where programmable logic, memory connectivity, and board-specific digital control need to be consolidated.
Programming Model Configuration-based FPGA platform within the referenced AMD family.

Pinout & Package

The XC6SLX25T-3CSG324C pinout includes configurable user I/O, dedicated power rails, configuration and JTAG connections, clock-capable pins, and package-specific escape resources within 324-LFBGA, CSPBGA package.

For PCB design, the main concerns are clean power distribution, configuration-access planning, clock integrity, and package-aware escape routing around memory and high-activity interface banks.

Pin / Function PCB Design and Circuit Role
User I/O Pins Configurable pins used for subsystem interfaces, memory buses, control signals, and application-specific logic connectivity.
Clock Inputs Dedicated or clock-capable pins supporting timing distribution and synchronous FPGA operation.
Configuration / JTAG Pins Used for device programming, configuration control, and boundary-scan access.
Power Rails Support FPGA core, auxiliary, and I/O voltage domains required by the selected device family.
Ground Pins Provide return paths for stable power integrity and high-speed digital operation.

Key Features

  • Configurable FPGA fabric supports board-specific logic, control, and interface integration.
  • Package options scale I/O reach for compact through higher-density digital platforms.
  • Orderable speed grades help align the device with board timing and interface targets.
  • Suitable for consolidating subsystem logic, buffering, and programmable control functions.
  • Supports embedded system flexibility across industrial, communications, and computing use cases.
  • Field-programmable behavior preserves updateability across platform revisions.

Applications

Embedded Processing Platforms Industrial and Machine Control

Use Scenario: Used in digital systems that need FPGA-based control, buffering, or local acceleration around processors and custom logic.

IC Role: Provides configurable logic resources near embedded compute blocks.

Use Value: Improves flexibility for evolving control and interface requirements.

Use Scenario: Used in platforms that need programmable digital interfacing, timing coordination, and subsystem integration.

IC Role: Acts as the configurable logic layer between sensors, memory, and control paths.

Use Value: Supports maintainable and adaptable industrial hardware architectures.

Communications and Data Interfaces Signal Aggregation and System Glue

Use Scenario: Used where protocol bridging, framing logic, or board-level connectivity must stay field-programmable.

IC Role: Implements adaptable interface engines and control-plane logic.

Use Value: Helps avoid respins when interface requirements change.

Use Scenario: Used to collect subsystem control, memory-side logic, and data-routing functions into one programmable device.

IC Role: Centralizes digital support logic within the FPGA fabric.

Use Value: Reduces auxiliary logic count while preserving scalability.

Equivalent & Alternatives

When evaluating a XC6SLX25T-3CSG324C equivalent, engineers should compare family architecture, package, speed grade, operating range, memory-interface planning, and overall programmable logic fit.

Alternative Part Technical Difference Application Difference Selection Advice
XC6SLX25-2FTG256I Closely related orderable option in the same or adjacent family density with a different package, speed, or qualification emphasis. Used when the board stays in the same general FPGA family but requires a different orderable fit. Compare package, speed grade, temperature suffix, and validated system margins before substitution.
XC7S50-1FGGA484C Alternative programmable logic option that can serve a similar subsystem role with a different density or family emphasis. Used in comparable programmable-control or interface-heavy applications when the design tradeoff shifts. Choose according to logic capacity, package routing, memory needs, and platform continuity.

Compared with XC6SLX25-2FTG256I, XC6SLX25T-3CSG324C selection depends on exact package, speed grade, qualification suffix, and board-routing fit. XC6SLX25T-3CSG324C vs XC7S50-1FGGA484C selection depends on whether the design should remain in the same FPGA family path or shift to another density or architecture with different integration tradeoffs.

Quality

XC6SLX25T-3CSG324C should be sourced as original AMD programmable logic inventory through traceable supply channels. Quality checks may include package inspection, top-mark validation, configuration access checks, and board-level bring-up verification.

Production validation should include power-sequencing review, configuration reliability, timing-closure confirmation, clock integrity checks, and signal-integrity review on high-activity I/O paths.

Availability

XC6SLX25T-3CSG324C is suitable for configurable digital logic, subsystem integration, and FPGA-based interface or control functions in embedded, industrial, and communications platforms.

Supply support may include volume procurement planning, scheduled delivery arrangements, traceable sourcing management, and long-term supply support for OEM, industrial electronics, automotive electronics, and embedded product programs. Sample and NPI supply support, as well as urgent in-stock supply support, can also be arranged for prototype builds, pilot runs, and time-critical production needs.

For production builds, confirming package option, speed grade, operating-range suffix, lifecycle status, and sourcing continuity helps reduce programmable-logic procurement risk.

Manufacturer

AMD is a semiconductor manufacturer whose adaptive computing and programmable logic portfolio includes FPGA devices, CPLDs, configuration solutions, embedded processing platforms, and related development technologies for industrial, communication, computing, automotive, and embedded electronic systems.

Spartan-6 devices provide a cost- and power-conscious FPGA platform with embedded memory, DSP options, and broad package coverage for industrial and embedded systems. Larger Spartan-6 density point for embedded processing support, memory interfaces, and logic-consolidation workloads.

FAQ

What is XC6SLX25T-3CSG324C used for?

XC6SLX25T-3CSG324C is used for configurable logic, interface concentration, memory-side support, and embedded digital subsystem integration in FPGA-based hardware.

Where can I find the XC6SLX25T-3CSG324C datasheet download?

The XC6SLX25T-3CSG324C datasheet can be accessed from the confirmed source used for this FPGA family and orderable option.

What should be considered in XC6SLX25T-3CSG324C pinout design?

Designers should account for configuration access, power domains, clock planning, and package-driven escape routing around high-activity I/O and memory-related signals.

Is XC6SLX25T-3CSG324C a CPLD?

No. It is an FPGA orderable option in an AMD programmable logic family intended for broader configurable logic and subsystem integration tasks.

What are common XC6SLX25T-3CSG324C equivalent solutions?

Common candidates include XC6SLX25-2FTG256I and XC7S50-1FGGA484C depending on package, family architecture, logic density, and system-level integration needs.

XC6SLX25T-3CSG324C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LXT
Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1879
Number of Logic Elements/Cells:
24051
Total RAM Bits:
958464
Number of I/O:
190
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-CSPBGA (15x15)

XC6SLX25T-3CSG324C FAQ

1.How can I place an order for XC6SLX25T-3CSG324C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX25T-3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX25T-3CSG324C reliable?

The price and inventory of XC6SLX25T-3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-3CSG324C is usually 5 days.

3.What payment methods are accepted for XC6SLX25T-3CSG324C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-3CSG324C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX25T-3CSG324C?

XC6SLX25T-3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX25T-3CSG324C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX25T-3CSG324C?

For technical support, including XC6SLX25T-3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-3CSG324C requirements.

6.How does Aetrix verify that XC6SLX25T-3CSG324C is sourced from the original manufacturer or authorized distributors?

All XC6SLX25T-3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-3CSG324C meets industry standards.

7.What is the process for return or replacement of XC6SLX25T-3CSG324C?

All XC6SLX25T-3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-3CSG324C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX25T-3CSG324C part is unused and in its original packaging.

Return procedure for XC6SLX25T-3CSG324C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX25T-3CSG324C Tags

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  • XC6SLX25T-3CSG324C Images
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  • Buy XC6SLX25T-3CSG324C
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