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AMD XC6SLX25T-3CSG324I
- Part No.:
- XC6SLX25T-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25T-3CSG324I.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,289
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Product details
Overview
XC6SLX25T-3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards with differential signaling capability and operates at -40°C to +100°C industrial temperature range.
For engineers reviewing the XC6SLX25T-3CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory capacity, and industrial-grade thermal performance for reconfigurable control and interface bridging tasks.
Technical Context
The XC6SLX25T-3CSG324I implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×18-bit signed multiplication. It includes dual-clock domain management via dedicated clock routing and global clock buffers.
Configuration is supported through SPI serial flash or JTAG, with bitstream encryption and readback protection enabled. The device uses SelectIO technology for programmable drive strength, slew rate, and on-die termination across all I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 186 - supports multi-protocol interface bridging with bank-wise voltage isolation |
| I/O Standards | LVCMOS/LVTTL/SSTL/HSTL - enables direct connection to FPGAs, microcontrollers, DDR memory, and legacy peripherals |
| Operating Temp | -40°C to +100°C - certified for industrial environments without derating or forced cooling |
| Speed Grade | -3 - highest timing performance grade in Spartan-6 LX family, enabling higher clock frequencies |
Pinout & Package
XC6SLX25T-3CSG324I is housed in a 324-ball fine-pitch CSP (CSGA) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal efficiency in space-constrained industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Voltage | Supplies configurable I/O voltage (1.2–3.3 V) for Bank 0 signals |
| GND | Ground Reference | Provides low-impedance return path for all I/O and core logic currents |
| VCCAUX | Auxiliary Supply | Powers configuration circuitry, JTAG, and certain I/O features |
| CONFIG_IO | Configuration Input | Serial configuration data input during master SPI mode |
| PROGRAM_B | Reset Control | Active-low signal that clears configuration memory and initiates reload |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 12 units delivering 18×18-bit signed multiply-accumulate per slice for real-time filtering |
| SelectIO Technology | Per-bank programmable drive strength, slew rate, and on-die termination reduce signal integrity tuning effort |
| Embedded Memory | 18 Kbits of block RAM plus distributed RAM enable compact state-machine and buffer implementations |
| Multi-Standard I/O | Single bank supports mixed I/O standards (e.g., LVCMOS + SSTL) with independent VCCO control |
Applications
| Industrial PLC I/O Module | Automotive Camera Interface Bridge |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and controller bus. IC Role / Device Role / Timing Role: Reconfigurable logic engine handling GPIO expansion, PWM generation, and RS-485/Modbus framing. Use Value: 186 user I/Os and industrial temp rating allow direct integration into DIN-rail mounted controllers without heatsinking. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel LVDS or CMOS for ADAS vision processors. IC Role / Device Role / Timing Role: Protocol converter and clock domain crossing bridge with embedded FIFO buffering. Use Value: Block RAM and DSP48A1 slices support pixel-level preprocessing and timing alignment without external memory. |
| Medical Imaging Data Aggregator | Test & Measurement Pattern Generator |
Use Scenario: Consolidating analog-to-digital data streams from multiple ultrasound front-ends into a unified AXI stream. IC Role / Device Role / Timing Role: High-speed data multiplexer with real-time timestamping and error detection logic. Use Value: -3 speed grade ensures reliable 150 MHz sampling clock domain crossing across 186 I/Os. | Use Scenario: Generating precise stimulus waveforms and capturing response signatures in automated test equipment. IC Role / Device Role / Timing Role: Custom pattern sequencer with deterministic timing control and trigger synchronization. Use Value: SelectIO programmability allows direct driving of DUT pins at 1.8 V or 3.3 V without level-shifter components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324I | Fewer logic cells (14,579) and reduced block RAM (9 Kbits); same package and I/O count | Suitable for lower-complexity control logic but insufficient for multi-channel data aggregation | Select when design fits within 15K LC budget and requires identical footprint and thermal profile |
| XC6SLX45-3CSG324I | Higher logic density (43,661 LC) and more block RAM (36 Kbits); same package and speed grade | Supports larger state machines and deeper buffering but increases static power by ~35% | Choose when additional logic resources are needed for future firmware scalability or added peripheral support |
Compared with XC6SLX16-3CSG324I and XC6SLX45-3CSG324I, the XC6SLX25T-3CSG324I delivers optimal balance of logic capacity, memory, and power for mid-tier industrial interface consolidation-avoiding under-resourcing while minimizing unnecessary static power overhead.
Availability
XC6SLX25T-3CSG324I is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS subsystems, and medical data acquisition systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX25T-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded applications.
The Spartan-6 family was engineered for cost-sensitive, high-volume industrial and automotive applications demanding reliable reconfigurability, low power, and broad I/O compatibility.
FAQ
What is the maximum operating frequency of the XC6SLX25T-3CSG324I?
The XC6SLX25T-3CSG324I has a -3 speed grade, supporting system clock frequencies up to 500 MHz for internal logic paths and 1,080 Mbps for differential I/Os. Actual achievable frequency depends on design placement, routing, and timing constraints. The XC6SLX25T-3CSG324I datasheet specifies setup/hold times and propagation delays referenced to this grade.
Does the XC6SLX25T-3CSG324I support configuration via SPI flash?
Yes, the XC6SLX25T-3CSG324I supports master SPI configuration mode using standard quad-SPI or single-SPI flash devices. Configuration pins such as CONFIG_IO, CCLK, and DONE are dedicated for this purpose. The XC6SLX25T-3CSG324I also supports JTAG boundary-scan and slave selectMAP modes.
What I/O standards are supported by the XC6SLX25T-3CSG324I?
The XC6SLX25T-3CSG324I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, and RSDS across its 12 I/O banks. Each bank is independently configurable for voltage and standard. The XC6SLX25T-3CSG324I does not support PCI Express or DDR3 PHY-level compliance.
Is the XC6SLX25T-3CSG324I qualified for automotive applications?
The XC6SLX25T-3CSG324I is rated for industrial temperature (-40°C to +100°C) and meets AEC-Q100 stress test requirements only when explicitly ordered as an automotive-grade variant (e.g., XC6SLX25T-3CSG324C). The standard XC6SLX25T-3CSG324I is not automotive-qualified.
How much embedded memory does the XC6SLX25T-3CSG324I provide?
The XC6SLX25T-3CSG324I contains 18 Kbits of block RAM and additional distributed RAM implemented in LUTs. This memory is used for FIFOs, dual-port buffers, and small lookup tables. The XC6SLX25T-3CSG324I does not include external memory controllers or hard IP for DDR interfaces.
XC6SLX25T-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25T-3CSG324I FAQ
1.How can I place an order for XC6SLX25T-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-3CSG324I reliable?
The price and inventory of XC6SLX25T-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-3CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-3CSG324I?
XC6SLX25T-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-3CSG324I?
For technical support, including XC6SLX25T-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-3CSG324I requirements.
6.How does Aetrix verify that XC6SLX25T-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-3CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-3CSG324I?
All XC6SLX25T-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-3CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX25T-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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