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AMD XC6SLX25T-3FG484I
- Part No.:
- XC6SLX25T-3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25T-3FG484I.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,447
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Product details
Overview
XC6SLX25T-3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO standards including LVCMOS, LVTTL, and SSTL.
For engineers reviewing the XC6SLX25T-3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, industrial-grade thermal performance, and compatibility with Spartan-6 design toolchains and reference clocking architectures.
Technical Context
The XC6SLX25T-3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated DSP48A1 slices for arithmetic operations and integrated Clock Management Tiles (CMT) containing DCMs and PLLs for clock synthesis and phase alignment. It supports multi-standard differential I/O including LVDS, RSDS, and TMDS.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. Built-in JTAG boundary-scan supports IEEE 1149.1 compliance for test and debug across the 484-ball array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/O Pins | 186 - supports high-pin-count peripheral interfacing with voltage- and standard-flexible banks |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
| Package | 484-pin FBGA (23×23 mm, 1.0 mm pitch) - enables high-density PCB routing with thermal pad for power dissipation |
Pinout & Package
XC6SLX25T-3FG484I is housed in a 484-ball fine-pitch BGA (FG484) with exposed thermal pad. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and VREF settings. Configuration and JTAG pins are fixed per bank assignment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| H2 | INIT_B | Active-low bidirectional initialization and reconfiguration control |
| J1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and restarts boot |
| K2 | TCK | JTAG test clock input for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select controlling TAP controller state transitions |
| M2 | TDO | JTAG test data output carrying scan-out results |
| N1 | TDI | JTAG test data input driving scan-in data to internal registers |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DSP48A1 Slices | 12 units enabling 18×18-bit multiply-accumulate per cycle for real-time filtering or motor control |
| Integrated CMT with DCM & PLL | Provides jitter-reduced clock synthesis, frequency multiplication/division, and phase shifting for synchronous subsystems |
| SelectIO Technology | Supports 18 I/O standards including LVDS, SSTL-2, and HSTL with programmable drive strength and slew rate |
| MultiBoot Configuration | Allows dual-image storage and fail-safe field updates via external SPI flash without external logic |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation |
Applications
| Industrial PLC Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time deterministic logic execution in programmable logic controllers handling sensor inputs, motion sequencing, and safety interlocks. IC Role / Device Role / Timing Role: Configurable logic fabric executing custom ladder logic and PID loops with sub-microsecond latency. Use Value: 24K logic cells and industrial temp rating enable reliable operation in factory-floor cabinets without forced cooling. | Use Scenario: Converting parallel RGB/YUV video streams to embedded DisplayPort or HDMI serial format for medical imaging displays. IC Role / Device Role / Timing Role: Protocol translation engine with pixel-clock domain crossing and serialization using built-in LVDS transmitters. Use Value: 186 user I/Os and SelectIO support for TMDS/LVDS allow direct connection to display PHYs without level-shifting components. |
| Communications Backplane Interface | Test Equipment Pattern Generator |
Use Scenario: Implementing custom packet parsing, header modification, and CRC checking on high-speed backplane links in telecom line cards. IC Role / Device Role / Timing Role: Data-path accelerator offloading CPU tasks while maintaining strict timing alignment across multiple SERDES lanes. Use Value: -3 speed grade ensures setup/hold timing margins for 200+ MHz parallel bus interfaces tied to legacy backplane standards. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Deterministic waveform sequencer using block RAM for pattern storage and distributed clock networks for skew-controlled output timing. Use Value: Integrated CMTs deliver <150 ps jitter for precise edge placement across 186 I/Os, meeting ATE timing accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45T-3FG484I | 43,661 logic cells, 32 Kbits block RAM, same package and speed grade | Higher gate count supports larger state machines or additional protocol stacks | Choose when design requires >24K logic cells but must retain identical footprint and thermal profile |
| XC7S25-1CSGA225I | Artix-7 architecture, 25K logic cells, 12.5 Kbits BRAM, smaller 225-pin CSBGA package | Lower power, higher DSP density, but incompatible toolchain and no MultiBoot support | Choose for new designs prioritizing power efficiency and Vivado toolflow, not for drop-in replacement |
Compared with XC6SLX25T-3FG484I, the XC6SLX45T-3FG484I offers scalable logic capacity within identical thermal and mechanical constraints, while the XC7S25-1CSGA225I shifts to a newer architecture with reduced static power and enhanced DSP throughput-but requires full RTL and toolchain migration.
Availability
XC6SLX25T-3FG484I is available at Aetrix Electronics and suitable for industrial automation, video processing, and communications infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX25T-3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its acquisition of Xilinx.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable logic density, flexible I/O, and industrial temperature operation-targeting industrial control, vision systems, and legacy interface bridging.
FAQ
What is the maximum operating frequency supported by XC6SLX25T-3FG484I?
The XC6SLX25T-3FG484I is rated at speed grade -3, guaranteeing timing closure for system clocks up to 500 MHz under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection, but critical paths in typical implementations meet this specification with margin when using ISE 14.7 timing analysis tools.
Does XC6SLX25T-3FG484I support JTAG boundary-scan testing?
Yes, XC6SLX25T-3FG484I fully complies with IEEE 1149.1 JTAG boundary-scan. Its dedicated TCK, TMS, TDI, and TDO pins (pins K2, L1, N1, M2 respectively) enable board-level test access, device programming, and debug visibility across all 484 balls without requiring additional test circuitry.
Can XC6SLX25T-3FG484I be configured via SPI flash memory?
Yes, XC6SLX25T-3FG484I supports Master Serial configuration mode, allowing direct boot from industry-standard SPI flash devices such as Micron MT25QL or Winbond W25Q series. The configuration process is initiated automatically on power-up and requires no external controller intervention.
What I/O standards are supported by XC6SLX25T-3FG484I?
XC6SLX25T-3FG484I supports 18 SelectIO standards including LVCMOS (1.2 V to 3.3 V), LVTTL, SSTL-2, HSTL-I, and differential formats like LVDS, RSDS, and TMDS. Each of its 12 I/O banks allows independent VCCO and VREF settings, enabling mixed-voltage interface coexistence on a single device.
Is XC6SLX25T-3FG484I qualified for industrial temperature operation?
Yes, XC6SLX25T-3FG484I is specified for industrial temperature range (-40°C to +100°C) and undergoes extended burn-in and characterization across this range. Its FG484 package includes a thermal pad to facilitate heat dissipation in enclosed enclosures typical of industrial control cabinets.
XC6SLX25T-3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25T-3FG484I FAQ
1.How can I place an order for XC6SLX25T-3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-3FG484I reliable?
The price and inventory of XC6SLX25T-3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-3FG484I?
XC6SLX25T-3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-3FG484I?
For technical support, including XC6SLX25T-3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-3FG484I requirements.
6.How does Aetrix verify that XC6SLX25T-3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-3FG484I?
All XC6SLX25T-3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX25T-3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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