AMD XC6SLX25T-3FGG484C

Overview

XC6SLX25T-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade (fastest in Spartan-6 family) with 1.2 V core voltage and supports LVCMOS, LVTTL, SSTL, and differential signaling standards.

For engineers reviewing the XC6SLX25T-3FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, supported I/O standards, and availability of configuration memory interfaces.

Technical Context

The XC6SLX25T-3FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices for arithmetic acceleration. It integrates dual-clock domain management and supports JTAG, SPI, and SelectMAP configuration modes.

Its I/O bank structure enables mixed-voltage operation across 12 banks, each supporting independent VCCO and VREF settings. The device includes integrated DCI (Digitally Controlled Impedance) for on-die termination and supports source-synchronous interfaces up to 500 Mbps per pin.

Key Specifications

Pinout & Package

XC6SLX25T-3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and 27 mm × 27 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC6SLX45T-3FGG484C and XC6SLX16-3CPG196C, the XC6SLX25T-3FGG484C balances logic density, I/O count, and thermal profile for mid-range reconfigurable logic tasks-offering optimal resource margin without oversizing PCB area or BOM cost.

Availability

XC6SLX25T-3FGG484C is available at Aetrix Electronics and suitable for industrial motor control, automotive camera interface, and medical imaging front-end applications requiring stable component supply and long-term production support.

Supply support for XC6SLX25T-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power programmable logic with robust I/O flexibility and predictable timing performance.

FAQ

What is the maximum operating frequency of the XC6SLX25T-3FGG484C?

The XC6SLX25T-3FGG484C has a -3 speed grade, supporting system clock frequencies up to 500 MHz in critical paths when implemented with optimal placement and routing. Its Digital Clock Managers (DCMs) achieve ±1% duty cycle correction and can synthesize clocks from 10 MHz to 500 MHz, depending on load and routing constraints. Actual achievable frequency depends on design complexity and I/O standard selection.

Does the XC6SLX25T-3FGG484C support JTAG boundary scan?

Yes, the XC6SLX25T-3FGG484C fully supports IEEE 1149.1 JTAG boundary scan for testing and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated to this function and operate at 1.2 V core voltage. Boundary scan chain includes all I/Os and internal logic, enabling verification of PCB interconnect integrity before configuration.

Can the XC6SLX25T-3FGG484C be configured via SPI flash memory?

Yes, the XC6SLX25T-3FGG484C supports master SPI configuration mode using on-chip oscillator and dedicated DIN/CCLK/CS_B pins. It is compatible with standard 4-wire SPI flash devices such as Micron MT25QL series. Configuration bitstream loads automatically on power-up when MODE pins are set to 001, eliminating need for external controllers.

What I/O standards are supported by the XC6SLX25T-3FGG484C banks?

The XC6SLX25T-3FGG484C supports LVCMOS (1.2 V to 3.3 V), LVTTL, SSTL18/I, SSTL2/I, HSTL18/I, and differential standards including LVDS, BLVDS, and RSDS across its 12 I/O banks. Each bank's VCCO and VREF are independently configurable, enabling simultaneous interfacing to multiple voltage domains without level shifters.

Is the XC6SLX25T-3FGG484C RoHS compliant and lead-free?

Yes, the XC6SLX25T-3FGG484C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FGG484 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's Product Change Notification (PCN) #XILINX-PCN-2018-001.