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AMD XC6SLX25T-N3CSG324I
- Part No.:
- XC6SLX25T-N3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX25T-N3CSG324I.pdf
- Description:
- IC FPGA 190 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,597
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Product details
Overview
XC6SLX25T-N3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 324-pin CSGA package. It supports LVCMOS/LVTTL, SSTL, and HSTL I/O standards and operates at -3 speed grade (industrial temperature range). It is used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC6SLX25T-N3CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded memory depth, and industrial-grade thermal reliability.
Technical Context
The XC6SLX25T-N3CSG324I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices for arithmetic acceleration. It includes dual-clock domain support and dedicated clock management tiles with DCMs for phase alignment and frequency synthesis.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. JTAG boundary-scan is supported for testing and programming across all operating conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external SRAM |
| User I/Os | 186 - supports multi-protocol interface bridging with programmable I/O standards |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in industrial temperature range (-40°C to +100°C) |
| Package | 324-pin CSGA - 15×15 mm body with 0.8 mm pitch, compatible with standard reflow profiles |
| DCMs | 2 - enables independent clock domain management for video pixel clocking and control logic synchronization |
Pinout & Package
XC6SLX25T-N3CSG324I is housed in a 324-pin Chip Scale Grid Array (CSGA) package with 18 × 18 I/O array and central power/ground ball pattern optimized for signal integrity and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level (1.2V/1.5V/1.8V/2.5V/3.3V) for associated pins |
| P2 | IO_L1P_0 | Differential input pair positive - supports LVDS, TMDS, or RSDS signaling when paired with N2 |
| N2 | IO_L1N_0 | Differential input pair negative - required companion pin for differential I/O operation in bank 0 |
| W19 | GCLK1 | Global clock input - low-skew routing to all logic regions for synchronous design timing integrity |
| T17 | M0 | Configuration mode select - defines boot source as Master Serial (SPI flash) when pulled high |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 18 - enables real-time multiply-accumulate operations for FIR filters or motor control algorithms |
| Embedded Memory | 18 Kbits block RAM + 64 Kbits distributed RAM - supports dual-port buffering and state-machine storage |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS - allows direct interfacing with DDR2 SDRAM, CMOS image sensors, and industrial buses |
| Configuration Security | Bitstream encryption option - prevents reverse engineering of programmed logic in deployed systems |
| Thermal Range | -40°C to +100°C - validated for continuous operation in enclosed industrial enclosures without forced cooling |
Applications
| Industrial PLC Logic | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time ladder logic execution and fieldbus protocol translation in modular automation controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan-cycle control with sub-microsecond I/O response. Use Value: Eliminates need for multiple ASICs or microcontrollers by integrating motion control, safety interlock, and EtherCAT slave logic in one device. | Use Scenario: Pixel-level filtering and ROI extraction from monochrome CMOS image sensors in smart cameras. IC Role / Device Role / Timing Role: Parallel processing engine synchronizing sensor frame capture, applying Sobel edge detection, and packing results into AXI-Stream packets. Use Value: Reduces host CPU load by offloading compute-intensive vision tasks while maintaining <100 µs latency between exposure and feature data ready. |
| Motor Drive Control | Communications Backplane Interface |
Use Scenario: Field-oriented control (FOC) loop execution and PWM waveform generation for 3-phase BLDC inverters. IC Role / Device Role / Timing Role: Real-time current sampling, Clarke/Park transform, PI regulation, and space-vector modulation with hardware-accelerated math units. Use Value: Achieves 20 kHz PWM switching with 50 ns jitter tolerance, enabling smoother torque delivery and reduced acoustic noise in HVAC compressors. | Use Scenario: Protocol bridging between legacy RS-485 field networks and modern Ethernet-based SCADA systems. IC Role / Device Role / Timing Role: Dual-interface controller managing Modbus RTU framing on one side and TCP/IP packet assembly on the other. Use Value: Enables brownfield plant upgrades without replacing installed field devices, preserving wiring infrastructure and maintenance procedures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-3CSG324I | 14,579 logic cells, 16 Kbits block RAM, same package and speed grade | Limited to single-camera preprocessing or simpler PLC rungs; insufficient for dual-axis FOC + comms stack | Select when BOM cost sensitivity outweighs logic margin requirements and no future expansion is planned |
| XC7S25-1CSGA225I | Artix-7 architecture, 23,000 logic cells, 1.2 V core, 225-pin CSP package | Higher static power, smaller I/O count (100), no native DDR2 controller; better for low-power portable designs | Choose only if migrating to 28 nm process benefits (e.g., lower dynamic power, higher clock rates) justify PCB redesign |
Compared with XC6SLX16-3CSG324I, XC6SLX25T-N3CSG324I delivers 65% more logic and 12.5% more block RAM for complex state machines; versus XC7S25-1CSGA225I, it retains mature toolchain support, DDR2 PHY compatibility, and larger I/O count for industrial backplane integration.
Availability
XC6SLX25T-N3CSG324I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, motor control, and communications backplane applications requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX25T-N3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 family as a long-lifecycle offering for industrial and aerospace applications.
The Spartan-6 FPGA family was designed for cost-sensitive, high-volume embedded systems requiring predictable timing, low static power, and broad I/O voltage support - especially where migration path stability matters.
FAQ
What is the maximum operating frequency of the XC6SLX25T-N3CSG324I?
The XC6SLX25T-N3CSG324I is rated for -3 speed grade, meaning its internal logic paths are guaranteed to meet timing at 500 MHz system clock frequency under industrial temperature conditions (-40°C to +100°C). Actual achievable frequency depends on design complexity, placement, and routing; typical real-world deployments achieve 300–450 MHz for balanced logic and I/O usage. The XC6SLX25T-N3CSG324I includes two Digital Clock Managers (DCMs) to generate and align derived clocks.
Does the XC6SLX25T-N3CSG324I support DDR2 memory interfaces?
Yes, the XC6SLX25T-N3CSG324I includes dedicated hardware support for DDR2 SDRAM interfaces through its I/O banks configured for SSTL-18 Class I standards and built-in write leveling calibration logic. It supports data rates up to 400 Mbps per pin and has documented reference designs for 16-bit and 32-bit DDR2 configurations. The XC6SLX25T-N3CSG324I does not support DDR3 or LPDDR.
What configuration methods are supported by the XC6SLX25T-N3CSG324I?
The XC6SLX25T-N3CSG324I supports Master Serial (via SPI flash), Slave SelectMAP (parallel bus from microcontroller), and JTAG programming. Configuration mode is selected using M0–M2 pins at power-up. Bitstream encryption is optional and requires external AES key storage. The XC6SLX25T-N3CSG324I does not support passive serial or BPI flash modes.
Is the XC6SLX25T-N3CSG324I RoHS compliant and lead-free?
Yes, the XC6SLX25T-N3CSG324I is manufactured in a lead-free, RoHS-compliant process with matte tin finish on all solder balls. It meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and is qualified for standard Pb-free reflow profiles. The XC6SLX25T-N3CSG324I carries full IPC-1752A material declaration documentation.
Can the XC6SLX25T-N3CSG324I be used in automotive applications?
The XC6SLX25T-N3CSG324I is specified for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. While it may operate in some under-hood or infotainment environments, AMD does not guarantee automotive qualification or provide failure-in-time (FIT) data for this part. For automotive use, the XC6SLX25T-N3CSG324I requires full system-level validation and is not recommended for safety-critical ADAS functions.
XC6SLX25T-N3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 190
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX25T-N3CSG324I FAQ
1.How can I place an order for XC6SLX25T-N3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-N3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-N3CSG324I reliable?
The price and inventory of XC6SLX25T-N3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-N3CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-N3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-N3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX25T-N3CSG324I?
XC6SLX25T-N3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-N3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-N3CSG324I?
For technical support, including XC6SLX25T-N3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-N3CSG324I requirements.
6.How does Aetrix verify that XC6SLX25T-N3CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-N3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-N3CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-N3CSG324I?
All XC6SLX25T-N3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-N3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-N3CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX25T-N3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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