AMD XC6SLX25T-N3FG484C

Overview

XC6SLX25T-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and operates at -3 speed grade with commercial temperature range (0°C to 85°C), commonly used in industrial control and embedded vision interface designs.

For engineers reviewing the XC6SLX25T-N3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and support for DDR2/DDR3 memory interfaces in cost-sensitive reconfigurable systems.

Technical Context

The XC6SLX25T-N3FG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices for arithmetic acceleration. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for precise clock synthesis and phase alignment.

It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination (up to 150 Ω), enabling reliable signal integrity across mixed-voltage I/O banks. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization.

Key Specifications

Pinout & Package

XC6SLX25T-N3FG484C is housed in a 484-ball Fine-Pitch BGA (FG484) package with 25 × 25 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG386.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC6SLX25T-N3FG484C, XC6SLX16-2CSG324C offers lower cost and footprint but sacrifices I/O flexibility and memory bandwidth, while XC7S25-1CSGA225C delivers architectural upgrades and extended support but requires PCB redesign and toolchain migration.

Availability

XC6SLX25T-N3FG484C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, medical imaging, and test equipment requiring stable component supply across long-lifecycle programs.

Supply support for XC6SLX25T-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-6 family, including XC6SLX25T-N3FG484C, was designed for cost-optimized, low-power reconfigurable logic in industrial, automotive, and consumer applications with long-term availability requirements.

FAQ

What is the maximum supported DDR3 memory interface speed for XC6SLX25T-N3FG484C?

The XC6SLX25T-N3FG484C supports DDR3 SDRAM interfaces up to 800 Mbps data rate (400 MHz clock) using its dedicated I/O timing resources and DCM/PLL clock management. This capability is verified in Xilinx UG382 v1.11 and applies specifically to the -3 speed grade under commercial temperature conditions. The XC6SLX25T-N3FG484C achieves this with calibrated output delays and input deskew logic in I/O banks configured for SSTL15.

Does XC6SLX25T-N3FG484C support JTAG boundary-scan testing?

Yes, XC6SLX25T-N3FG484C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. All 484 balls are accessible through the JTAG chain when TDI, TDO, TCK, and TMS pins are routed per Xilinx UG386 layout guidelines. The XC6SLX25T-N3FG484C also supports internal logic analyzer integration via ChipScope Pro for runtime signal visibility.

What configuration modes are supported by XC6SLX25T-N3FG484C?

XC6SLX25T-N3FG484C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Mode selection is controlled by M0–M2 pin strapping at power-up. External configuration PROMs (e.g., XCFxx series) are commonly used for Master SPI, while processors may drive Slave Serial mode via GPIO. The XC6SLX25T-N3FG484C does not support BPI or NAND flash boot modes.

Is XC6SLX25T-N3FG484C RoHS compliant and lead-free?

Yes, XC6SLX25T-N3FG484C is manufactured in a lead-free, RoHS-compliant process with matte tin finish on all solder balls. It meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) and requires bake conditioning if exposed to ambient >30°C/60% RH for more than 168 hours. The XC6SLX25T-N3FG484C part marking includes "N3" to denote lead-free packaging per Xilinx specification.

Can XC6SLX25T-N3FG484C be reprogrammed in-system after soldering?

Yes, XC6SLX25T-N3FG484C supports in-system programming (ISP) via JTAG or Slave Serial interfaces without requiring removal from the PCB. Configuration bitstreams can be updated dynamically using Xilinx iMPACT or Vivado tools, provided the required configuration pins (e.g., INIT_B, PROGRAM_B, DONE) are accessible and properly decoupled. The XC6SLX25T-N3FG484C retains configuration only while powered; SRAM-based logic requires reload on power cycle.