AMD XC6SLX25T-N3FGG484C
- Part No.:
- XC6SLX25T-N3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX25T-N3FGG484C.pdf
- Description:
- IC FPGA 250 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6SLX25T-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 24,051 logic cells, 18 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It supports LVCMOS, LVTTL, SSTL, and HSTL I/O standards and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC6SLX25T-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, embedded DSP48A1 slices for arithmetic acceleration, and support for PCI Express x1 Gen1 endpoints in endpoint mode.
Technical Context
The XC6SLX25T-N3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for high-speed arithmetic. It integrates twelve 18×18 multipliers and up to 712 Kbits of distributed RAM across CLBs.
Configuration is performed via Master SPI or JTAG, with support for dual-boot from two external SPI flash devices. The device includes internal oscillator, power-on reset, and brown-out detection circuitry for autonomous startup without external supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 24,051 - provides gate count equivalent for medium-complexity digital control and protocol bridging logic |
| Block RAM | 18 Kbits - supports small FIFOs, configuration storage, or data buffering without external memory |
| User I/Os | 186 - enables direct connection to multiple parallel buses or high-pin-count peripheral interfaces |
| DSP Slices | 12 × 18×18 multipliers - accelerates filtering, motor control math, or sensor fusion algorithms |
| I/O Standards | LVCMOS, LVTTL, SSTL-2/3, HSTL - allows interoperability with legacy and modern memory and interface ICs |
| Configuration Mode | Master SPI, JTAG - simplifies programming during production and field updates without dedicated configuration controller |
Pinout & Package
XC6SLX25T-N3FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 1.0 mm ball pitch, RoHS-compliant, and thermal pad exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply - sets output voltage level for pins in Bank 0 (e.g., GPIO, UART) |
| M1 | VCCAUX | Analog auxiliary supply - powers configuration logic, clock management, and JTAG circuitry |
| T1 | GND | Ground reference - required for signal integrity and thermal conduction through thermal pad |
| R2 | PROGRAM_B | Active-low configuration initiator - forces reconfiguration when asserted low |
| P3 | INIT_B | Open-drain status indicator - signals configuration completion or error during startup |
| U19 | CCLK | Configuration clock input - drives internal SPI configuration engine during master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Embedded DSP48A1 slices | Enables real-time multiply-accumulate operations for motor control loop execution within single clock cycle |
| Dual-boot configuration support | Allows fail-safe firmware update by storing primary and backup bitstreams in separate SPI flash sectors |
| Integrated clock management (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication without external PLL ICs |
| Multi-standard I/O banks | Permits mixed-voltage interfacing - e.g., 3.3 V control logic with 1.8 V memory bus on same device |
| Internal oscillator (1–100 MHz) | Eliminates need for external crystal during development or low-cost system bring-up |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic timing for ladder logic execution and sensor actuation. IC Role / Device Role / Timing Role: Configurable logic fabric implements custom state machines and protocol translators between fieldbus and microcontroller. Use Value: 186 user I/Os enable direct connection to 32-channel digital input/output modules without glue logic. | Use Scenario: High-speed digital pattern generation and acquisition synchronized to DUT clock domains. IC Role / Device Role / Timing Role: FPGA acts as programmable timing controller and data formatter between test head and host PC. Use Value: DSP48A1 slices accelerate real-time pass/fail decision logic at >100 MHz sample rates. |
| Medical Imaging Front-End | Avionics Data Concentrator |
Use Scenario: Acquisition and preprocessing of analog sensor data from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Implements digital down-conversion and beamforming logic prior to ADC interface. Use Value: Block RAM and distributed RAM support on-chip FIR filter coefficient storage and pipeline buffering. | Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control systems. IC Role / Device Role / Timing Role: FPGA serves as deterministic interconnect hub with time-triggered scheduling capability. Use Value: Multi-bank I/O supports simultaneous 3.3 V ARINC and 5 V discrete signaling without level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX16-2CSG324C | Fewer logic cells (14,579), smaller 324-pin CSBGA package, lower I/O count (102) | Better suited for space-constrained designs with reduced logic density requirements | Select when board area and cost are prioritized over I/O count and arithmetic throughput |
| XC6SLX45-2FGG484C | Higher logic capacity (43,661 cells), same FGG484 package, identical I/O count (186) | Supports larger state machines and more complex protocol stacks (e.g., dual Ethernet MACs) | Choose when future scalability or concurrent multi-interface operation is required |
Compared with XC6SLX25T-N3FGG484C, the XC6SLX16-2CSG324C reduces footprint and cost at the expense of arithmetic resources and I/O flexibility, while the XC6SLX45-2FGG484C retains full pin compatibility and expands logic capacity for evolving system requirements.
Availability
XC6SLX25T-N3FGG484C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX25T-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family for cost-optimized, high-reliability embedded applications.
The Spartan-6 family was designed for applications demanding low power, small form factor, and predictable timing - especially in industrial control, test equipment, and aerospace interface modules.
FAQ
What is the maximum operating temperature rating for XC6SLX25T-N3FGG484C?
The XC6SLX25T-N3FGG484C is rated for commercial temperature range (0°C to +85°C ambient). Its N3 speed grade guarantees timing performance under worst-case voltage and temperature conditions within this range, making it suitable for non-extended-environment industrial deployments where active cooling is available.
Does XC6SLX25T-N3FGG484C support JTAG boundary-scan testing?
Yes, XC6SLX25T-N3FGG484C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. The TDI, TDO, TMS, TCK, and TCK pins are dedicated and electrically isolated during normal operation, enabling in-circuit validation without requiring functional firmware load.
Can XC6SLX25T-N3FGG484C be configured using an external microcontroller?
Yes, XC6SLX25T-N3FGG484C supports slave serial and slave selectMAP configuration modes, allowing an external microcontroller to stream the configuration bitstream over SPI or parallel bus. This enables dynamic partial reconfiguration and field-upgradable logic functions without dedicated PROM programmers.
What clocking resources are integrated into XC6SLX25T-N3FGG484C?
XC6SLX25T-N3FGG484C includes two Digital Clock Managers (DCMs) per device, each supporting frequency synthesis, phase shifting, duty-cycle correction, and clock doubling. These DCMs accept input clocks from dedicated clock pins or internal sources like the 1–100 MHz oscillator, eliminating need for external clock ICs in most timing-critical applications.
Is XC6SLX25T-N3FGG484C RoHS compliant and lead-free?
Yes, XC6SLX25T-N3FGG484C is manufactured in a RoHS-compliant, lead-free process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FGG484 package uses matte tin finish on solder balls and conforms to IPC/JEDEC standard packaging specifications for automated assembly.
XC6SLX25T-N3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1879
- Number of Logic Elements/Cells:
- 24051
- Total RAM Bits:
- 958464
- Number of I/O:
- 250
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX25T-N3FGG484C FAQ
1.How can I place an order for XC6SLX25T-N3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX25T-N3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX25T-N3FGG484C reliable?
The price and inventory of XC6SLX25T-N3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX25T-N3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX25T-N3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX25T-N3FGG484C transactions.
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4.How is shipping managed for XC6SLX25T-N3FGG484C?
XC6SLX25T-N3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX25T-N3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX25T-N3FGG484C?
For technical support, including XC6SLX25T-N3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX25T-N3FGG484C requirements.
6.How does Aetrix verify that XC6SLX25T-N3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX25T-N3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX25T-N3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX25T-N3FGG484C?
All XC6SLX25T-N3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX25T-N3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX25T-N3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX25T-N3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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