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AMD XC6SLX4-3CPG196I

Part No.:
XC6SLX4-3CPG196I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
196-TFBGA, CSBGA
Datasheet:
AetrixXC6SLX4-3CPG196I.pdf
Description:
IC FPGA 106 I/O 196CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,108

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Product details

Overview

XC6SLX4-3CPG196I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 3,840 logic cells, 18 Kbits of block RAM, and a -3 speed grade operating at up to 750 MHz system clock. It features 196-pin CSBGA packaging, LVCMOS33/LVDS I/O support, and is used in industrial control logic and low-power embedded interface bridging.

For engineers reviewing the XC6SLX4-3CPG196I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, speed grade timing closure, and CSBGA thermal/mechanical compatibility in space-constrained PCBs.

Technical Context

The XC6SLX4-3CPG196I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry logic. It integrates up to 12 embedded DSP48A1 slices and supports SelectIO™ standards including SSTL18, HSTL, and LVDS.

Configuration is performed via Master Serial or JTAG mode using external SPI flash or PROM. The device includes internal oscillator, power-on reset, and multi-voltage I/O banks supporting independent VCCO settings per bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells3,840 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM18 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory
Speed Grade-3 - guarantees timing closure at 750 MHz system clock in worst-case industrial temperature conditions
I/O Pins140 user-configurable - supports mixed-voltage interfaces across 6 I/O banks with programmable drive strength
Package196-pin CSBGA (14×14 mm, 0.8 mm pitch) - enables high-density routing and thermal dissipation in compact industrial modules
Config MemorySupports serial NOR flash (x1/x2/x4) - allows single-image configuration without external processor intervention

Pinout & Package

XC6SLX4-3CPG196I uses a 196-pin Chip Scale Ball Grid Array (CSBGA) package with 14×14 array, 0.8 mm pitch, and exposed thermal pad. Pinout follows Xilinx Spartan-6 pinout standard for CPG196 package variant.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 supply - sets output voltage level (1.2–3.3 V) for pins A1–D12
K1GCLK1Global clock input - low-skew routing to all logic regions for synchronous design timing
M2PROGRAM_BActive-low configuration initiator - triggers reconfiguration from external flash on falling edge
R1TCKJTAG test clock - enables boundary-scan testing and in-system programming
T1VCCAUXAnalog auxiliary supply - powers configuration logic, PLLs, and transceivers (2.5 V nominal)

Key Features

FeatureDesign Value
Dedicated DSP48A1 slices12 units - accelerate multiply-accumulate operations for motor control or sensor preprocessing
SelectIO™ technologyPer-bank voltage control - enables direct interfacing with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals
Multi-boot supportUp to 4 configuration images - allows field-upgradable firmware and fail-safe fallback operation
Internal oscillator~50 MHz RC oscillator - provides clock source for configuration state machine and watchdog timers

Applications

Industrial PLC LogicAutomotive Camera Interface

Use Scenario: Real-time ladder logic execution and I/O scanning in DIN-rail mounted controllers.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan cycles with sub-millisecond latency.

Use Value: Eliminates need for ASIC or microcontroller-based logic with fixed peripherals, enabling field-reprogrammable control updates.

Use Scenario: Bridging MIPI CSI-2 camera sensors to parallel CMOS image processors in ADAS vision modules.

IC Role / Device Role / Timing Role: Protocol translation and clock domain crossing between 1.2 V MIPI and 3.3 V image processing subsystems.

Use Value: Provides precise skew-controlled deserialization and pixel data alignment without external PHY or glue logic.

Medical Sensor HubLow-Power IoT Gateway

Use Scenario: Aggregating and preprocessing analog/digital signals from ECG, SpO₂, and temperature sensors in portable monitors.

IC Role / Device Role / Timing Role: Time-multiplexed ADC interface controller with on-chip filtering and alarm generation logic.

Use Value: Reduces host MCU interrupt load and enables autonomous signal conditioning before wireless transmission.

Use Scenario: Protocol translation between LoRaWAN radio and Zigbee/Z-Wave home automation endpoints.

IC Role / Device Role / Timing Role: State-machine-based packet parsing, encryption offload, and GPIO-managed radio enable sequencing.

Use Value: Low static power (25 µA in suspend mode) extends battery life while maintaining secure, multi-protocol edge intelligence.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-2CPG196CHigher logic density (5,760 LC), same package, -2 speed gradeBetter timing margin for complex control loops; higher static powerChoose when additional LUTs or block RAM are required without changing PCB layout
LFE5U-25F-6BG256C25K LUTs, 1.2 V core, eFPGA architecture, different pinoutLower dynamic power, no native LVDS, requires full redesignConsider for new designs prioritizing ultra-low power over legacy toolchain compatibility

Compared with XC6SLX4-3CPG196I, XC6SLX9-2CPG196C offers more resources within identical mechanical constraints, while LFE5U-25F-6BG256C targets next-gen low-power architectures but demands full hardware and toolchain requalification.

Availability

XC6SLX4-3CPG196I is available at Aetrix Electronics and suitable for industrial PLCs, medical sensor hubs, and automotive camera interface modules requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX4-3CPG196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and AI accelerators for data center, embedded, and edge applications.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable logic density, low static power, and flexible I/O - targeting industrial automation, video surveillance, and communications infrastructure.

FAQ

What is the maximum operating junction temperature for XC6SLX4-3CPG196I?

The XC6SLX4-3CPG196I has a maximum junction temperature of 100°C, specified for industrial-grade operation (-40°C to +100°C ambient). This rating ensures reliable performance in enclosed enclosures with limited airflow, such as DIN-rail PLC housings. Thermal design must account for VCCAUX and VCCINT power dissipation under worst-case logic utilization. The XC6SLX4-3CPG196I datasheet defines derating curves above 85°C ambient.

Does XC6SLX4-3CPG196I support JTAG boundary-scan testing?

Yes, XC6SLX4-3CPG196I fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. It enables pre- and post-assembly verification of solder joints and interconnect integrity. The XC6SLX4-3CPG196I also supports INTEST and EXTEST instructions, and its BSDL file is published by AMD for test vector generation.

Can XC6SLX4-3CPG196I be configured using SPI flash memory?

Yes, XC6SLX4-3CPG196I supports Master Serial configuration mode with standard SPI NOR flash devices (x1/x2/x4 protocols). Configuration occurs automatically on power-up when INIT_B is released. The XC6SLX4-3CPG196I supports dual-boot and fallback images stored in separate flash sectors for robust field updates.

What I/O standards are supported by XC6SLX4-3CPG196I?

XC6SLX4-3CPG196I supports LVCMOS12/15/18/25/33, LVTTL, SSTL18_I/II, SSTL25_I/II, HSTL_I/II, and LVDS_25 across its six I/O banks. Each bank operates independently at its assigned VCCO voltage. The XC6SLX4-3CPG196I does not support differential standards beyond LVDS or true DDR3 SDRAM interfaces.

Is XC6SLX4-3CPG196I RoHS compliant and lead-free?

Yes, XC6SLX4-3CPG196I is RoHS-compliant and manufactured with lead-free (Pb-free) packaging. The CSBGA package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). The XC6SLX4-3CPG196I conforms to EU Directive 2011/65/EU and is marked with the RoHS symbol in AMD's official documentation.

XC6SLX4-3CPG196I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
196-TFBGA, CSBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
300
Number of Logic Elements/Cells:
3840
Total RAM Bits:
221184
Number of I/O:
106
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
196-CSPBGA (8x8)

XC6SLX4-3CPG196I FAQ

1.How can I place an order for XC6SLX4-3CPG196I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX4-3CPG196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX4-3CPG196I reliable?

The price and inventory of XC6SLX4-3CPG196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX4-3CPG196I is usually 5 days.

3.What payment methods are accepted for XC6SLX4-3CPG196I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX4-3CPG196I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX4-3CPG196I?

XC6SLX4-3CPG196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX4-3CPG196I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX4-3CPG196I?

For technical support, including XC6SLX4-3CPG196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX4-3CPG196I requirements.

6.How does Aetrix verify that XC6SLX4-3CPG196I is sourced from the original manufacturer or authorized distributors?

All XC6SLX4-3CPG196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX4-3CPG196I meets industry standards.

7.What is the process for return or replacement of XC6SLX4-3CPG196I?

All XC6SLX4-3CPG196I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX4-3CPG196I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX4-3CPG196I part is unused and in its original packaging.

Return procedure for XC6SLX4-3CPG196I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX4-3CPG196I Tags

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  • AMD XC6SLX4-3CPG196I
  • Buy XC6SLX4-3CPG196I
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