AMD XC6SLX45-2CSG324I
- Part No.:
- XC6SLX45-2CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX45-2CSG324I.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,345
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX45-2CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 324-pin CSGA package with -2 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, video processing, and communication interface bridging in space-constrained industrial systems.
For engineers reviewing the XC6SLX45-2CSG324I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (214 user I/Os), LVDS support (up to 108 differential pairs), internal clocking resources (four DCMs), and compliance with JESD78 Class II latch-up immunity.
Technical Context
The XC6SLX45-2CSG324I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates four Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction across multiple clock domains.
Its I/O bank structure supports mixed-voltage operation (1.2 V to 3.3 V), with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω). The device includes SelectIO™ technology enabling LVCMOS, LVTTL, SSTL, HSTL, and LVDS signaling standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total available LUT-based logic resources for combinational and sequential logic implementation |
| Block RAM | 2.1 Mb - distributed across 116 BRAM blocks, each configurable as 18 Kb dual-port memory |
| DSP Slices | 216 DSP48A1 - fixed-point arithmetic units supporting multiply-accumulate at up to 250 MHz |
| User I/O Pins | 214 - configurable single-ended or differential signals with per-bank voltage support |
| DCMs | 4 - digital clock managers providing jitter filtering, frequency synthesis, and phase alignment |
| Speed Grade | -2 - guarantees timing closure for designs operating at maximum specified frequencies per data sheet |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
Pinout & Package
XC6SLX45-2CSG324I is housed in a 324-ball fine-pitch CSP (Chip Scale Grid Array) package with 1.0 mm ball pitch, 15 × 15 mm body size, and Pb-free/ROHS-compliant finish. The package supports thermal dissipation via exposed thermal pad and provides signal integrity advantages for high-speed I/O routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Supply | Configures voltage level (1.2–3.3 V) for Bank 0 I/Os; must match connected interface standard |
| CLKIN | Primary Clock Input | Accepts single-ended or differential clock source feeding DCM0 for system timing generation |
| PROGRAM_B | Configuration Initiation | Active-low signal that resets configuration logic and initiates reconfiguration from external PROM or processor |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness |
| M0/M1/M2 | Mode Selection | Three-pin strap controlling boot mode (e.g., Master SPI, Slave SelectMAP, JTAG) |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces static power consumption by ~50% vs. previous 65 nm Spartan families, enabling fanless industrial deployment |
| Integrated PCI Express® endpoint | Supports x1 Gen1 PCIe interface without external bridge IC, reducing BOM count and latency |
| Multi-standard SelectIO™ | Enables direct interfacing to DDR2/SDR SDRAM, USB PHYs, and Gigabit transceivers without level-shifting components |
| ISE Design Suite support | Full toolchain compatibility including synthesis, place-and-route, and bitstream generation up to ISE 14.7 |
| JTAG boundary-scan | IEEE 1149.1-compliant test access port for board-level verification and in-system programming |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives with safety monitoring. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms and managing dual-axis motion coordination. Use Value: 214 user I/Os enable simultaneous connection to analog ADCs, digital encoders, and isolated gate drivers; DCMs synchronize sampling and actuation timing. | Use Scenario: Converting HDMI 1.4a video streams to MIPI D-PHY for embedded display modules in medical imaging devices. IC Role / Device Role / Timing Role: Protocol translator and timing adapter implementing pixel clock domain crossing and packetized data reformatting. Use Value: LVDS-capable I/O banks support 1.6 Gbps pixel clock recovery; block RAM buffers handle frame-rate mismatches between source and sink. |
| Communications Backplane Interface | Test & Measurement Instrumentation |
Use Scenario: Implementing custom SerDes framing logic and CRC validation for proprietary backplane protocols in telecom line cards. IC Role / Device Role / Timing Role: High-speed serial interface controller with deterministic latency and error detection logic. Use Value: 216 DSP48A1 slices perform real-time CRC-32 computation at 200+ MHz; SelectIO™ supports 1.25 Gbps NRZ signaling on backplane traces. | Use Scenario: Digitizing and post-processing multi-channel analog sensor data in portable oscilloscopes with FFT-based spectral analysis. IC Role / Device Role / Timing Role: Data acquisition engine handling ADC interface, trigger logic, and on-the-fly spectral computation. Use Value: 2.1 Mb block RAM stores full waveform captures; DSP slices execute 1024-point FFT in <1 µs per frame. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3CSG324C | Faster -3 speed grade; higher maximum clock frequency but increased power consumption | Better suited for timing-critical designs requiring >250 MHz system clocks | Select when design fails timing closure at -2 grade and thermal budget allows higher static power |
| XC6SLX25-2CSG324I | Reduced logic capacity (24,051 LUTs) and fewer DSP slices (112), same package and speed grade | Lower-cost option for less complex control or interface functions with identical footprint | Choose when design fits within smaller resource budget and requires no additional logic headroom |
Compared with XC6SLX45-2CSG324I, the -3C variant trades higher performance for greater power draw, while the LX25-2C offers cost savings at the expense of logic and DSP resources-both retain identical pinout and industrial temperature rating.
Availability
XC6SLX45-2CSG324I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and communications backplane interface applications requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX45-2CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family, including XC6SLX45-2CSG324I, was designed for cost-sensitive, high-volume applications demanding low power, small form factor, and reliable I/O interfacing in industrial and automotive environments.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45-2CSG324I?
XC6SLX45-2CSG324I supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO supply for each I/O bank. This enables mixed-voltage operation-for example, interfacing 1.8 V sensors and 3.3 V legacy peripherals simultaneously-without external level shifters. Each bank's voltage must be set before configuration and remains fixed during operation.
Does XC6SLX45-2CSG324I include built-in configuration memory?
No, XC6SLX45-2CSG324I does not include on-chip nonvolatile configuration memory. It relies on external serial PROM (e.g., XCFxxP series) or processor-controlled configuration via slave selectMAP or JTAG. Configuration occurs on power-up or after PROGRAM_B assertion, loading the bitstream into volatile SRAM-based CLBs and routing resources.
Can XC6SLX45-2CSG324I implement a PCIe endpoint without external components?
Yes, XC6SLX45-2CSG324I integrates a hard PCIe endpoint block compliant with PCI Express Base Specification 1.1 (x1 lane, Gen1). It handles link training, transaction layer packet (TLP) generation, and error reporting internally-no external PHY or bridge IC is required, though external AC coupling capacitors and reference clock conditioning remain necessary.
What is the purpose of the M0/M1/M2 pins on XC6SLX45-2CSG324I?
The M0/M1/M2 pins on XC6SLX45-2CSG324I are dedicated mode selection inputs sampled at power-up to determine the configuration source. Valid combinations include Master SPI (M[2:0]=001), Slave SelectMAP (M[2:0]=010), and JTAG (M[2:0]=111). These pins must be pulled to defined logic levels using resistors; floating states may cause unpredictable configuration behavior.
Is XC6SLX45-2CSG324I qualified for automotive AEC-Q100 testing?
No, XC6SLX45-2CSG324I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in harsh environments, it lacks automotive-specific qualification such as HTOL, ESD, and vibration testing. For automotive applications, AMD recommends the XA Spartan-6 family (e.g., XA6SLX45), which carries full AEC-Q100 Grade 3 certification.
XC6SLX45-2CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX45-2CSG324I FAQ
1.How can I place an order for XC6SLX45-2CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-2CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-2CSG324I reliable?
The price and inventory of XC6SLX45-2CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-2CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-2CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-2CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-2CSG324I?
XC6SLX45-2CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-2CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-2CSG324I?
For technical support, including XC6SLX45-2CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-2CSG324I requirements.
6.How does Aetrix verify that XC6SLX45-2CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-2CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-2CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-2CSG324I?
All XC6SLX45-2CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-2CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-2CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX45-2CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX45-2CSG324I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
