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AMD XC6SLX45-2FG484I
- Part No.:
- XC6SLX45-2FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-2FG484I.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,407
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Product details
Overview
XC6SLX45-2FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with I/O voltage support up to 3.3 V. It targets cost-sensitive industrial control and embedded vision systems requiring deterministic timing and low static power.
For engineers reviewing the XC6SLX45-2FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-2), temperature range (-40°C to +100°C), I/O bank configuration, configuration mode support (Master SelectMAP, Slave Serial), and JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC6SLX45-2FG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/Os including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS.
Configuration is performed via SPI serial flash, SD card, or JTAG; startup time is 40–100 ms depending on mode and clock source. Built-in Digital Clock Managers (DCMs) provide clock synthesis, phase shifting, and frequency multiplication without external PLLs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Block RAM | 2.1 Mb - distributed across 116 x 18 Kb dual-port RAM blocks usable for FIFOs, buffers, or data storage |
| DSP Slices | 216 × DSP48A1 - fixed-point arithmetic units supporting 25×18 multiply, accumulate, and pre-add operations |
| I/O Pins | 341 user-configurable - supports mixed-voltage operation across 10 I/O banks with independent VCCO and VREF |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies defined in DS162 for all device resources |
| Operating Temp | -40°C to +100°C - industrial temperature range validated per Xilinx specification document DS162 |
| Configuration Mode | Master SelectMAP, Slave Serial, JTAG - determines boot source, interface protocol, and programming flexibility |
Pinout & Package
XC6SLX45-2FG484I is housed in a 23×23 mm, 484-ball Fine-Pitch BGA (FBGA) package with 0.8 mm pitch and Pb-free (RoHS-compliant) finish. Ball map follows Xilinx standard FG484 footprint with dedicated configuration, JTAG, and multiple I/O bank arrangements.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output signaling successful configuration completion; pulled high externally to enable downstream logic |
| H2 | INIT_B | Active-low open-drain output indicating configuration status; asserted low during initialization or error |
| J1 | PROGRAM_B | Active-low input initiating configuration reset and reloading bitstream from selected source |
| K2 | TCK | JTAG test clock input synchronized to TMS/TDI for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select input controlling state transitions in TAP controller |
| M2 | TDO | JTAG test data output carrying scan-out results during debug or verification |
| N1 | TDI | JTAG test data input feeding instruction and data into TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device providing jitter-tolerant clock synthesis, phase alignment, and frequency scaling without external components |
| SelectIO Technology | Support for 18 I/O standards across 10 banks enables direct interfacing with legacy and modern peripherals without level-shifting circuitry |
| Power-Optimized Architecture | Low-static-power design with shutdown modes and dynamic power gating reduces active and standby consumption in battery- or thermally-constrained systems |
| ISE Design Suite Support | Fully supported by Xilinx ISE 14.7 toolchain including synthesis, place-and-route, timing analysis, and bitstream generation |
| Embedded Memory Options | Configurable distributed RAM (LUT-based) and block RAM (18 Kb) allow flexible memory mapping for buffers, caches, or lookup tables |
Applications
| Industrial PLC Controller | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time motion control and I/O scanning in factory automation cabinets with strict cycle-time requirements. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic logic for servo axis coordination, encoder feedback processing, and safety interlock monitoring. Use Value: -2 speed grade ensures sub-microsecond logic propagation delay; 341 I/Os accommodate modular expansion backplanes and fieldbus interfaces. | Use Scenario: On-camera image enhancement and feature extraction prior to transmission over GigE Vision or USB3. IC Role / Device Role / Timing Role: Configurable logic implements pixel-level filtering, histogram equalization, and ROI cropping with pipeline parallelism. Use Value: 216 DSP48A1 slices accelerate convolution kernels; block RAM stores frame buffers for real-time processing without external DRAM. |
| Medical Imaging Interface Bridge | Avionics Data Concentrator |
Use Scenario: Protocol translation between legacy analog video (PAL/NTSC) and digital MIPI CSI-2 outputs in ultrasound or endoscopy systems. IC Role / Device Role / Timing Role: FPGA acts as a synchronous bridge with precise pixel-clock domain crossing and embedded sync detection logic. Use Value: SelectIO supports both 3.3 V LVCMOS video timing and 1.2 V MIPI I/O standards; DCMs align disparate clock domains reliably. | Use Scenario: Aggregation and routing of ARINC 429, discrete I/O, and CAN FD signals in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: FPGA serves as deterministic data concentrator with time-triggered scheduling and built-in CRC validation engines. Use Value: Industrial temperature rating (-40°C to +100°C) meets DO-160 Section 22 environmental stress requirements; JTAG enables in-system verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FG484C | Faster speed grade (-3), commercial temperature range (0°C to +85°C), identical logic resources and pinout | Suitable for non-industrial environments where higher timing margin is needed but extended temperature is not required | Select when timing closure is marginal with -2 grade and ambient conditions remain within commercial range |
| XC6SLX25-2FTG256I | Smaller density (24,051 logic cells), 256-ball FTBGA package, reduced I/O count (186), same -2 speed and industrial temp | Targeted at space-constrained designs with lower gate-count requirements and simplified PCB layout | Choose when system logic fits within 25K LUTs and board area or layer count limits preclude 484-ball BGA |
Compared with XC6SLX45-2FG484I, the -3C variant trades temperature robustness for timing headroom, while the LX25-2FTG256I offers footprint and cost reduction at the expense of logic capacity and I/O scalability-both require revalidation of timing constraints and thermal design.
Availability
XC6SLX45-2FG484I is available at Aetrix Electronics and suitable for industrial control, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX45-2FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was designed for cost-optimized, high-volume applications demanding low power, small footprint, and seamless integration with microprocessors and analog subsystems.
FAQ
What is the maximum operating frequency supported by XC6SLX45-2FG484I?
The XC6SLX45-2FG484I supports a maximum system clock frequency of 841 MHz for internal logic paths under worst-case conditions, as guaranteed by its -2 speed grade per DS162. Actual achievable frequency depends on design complexity, routing, and I/O standard selection. The DCMs can generate clocks up to 500 MHz with phase alignment and jitter filtering.
Does XC6SLX45-2FG484I support JTAG boundary-scan testing?
Yes, XC6SLX45-2FG484I fully complies with IEEE 1149.1 (JTAG) for boundary-scan testing. It includes dedicated TCK, TMS, TDI, and TDO pins, and supports INTEST and EXTEST instructions. The JTAG interface enables device programming, debugging, and board-level interconnect verification without requiring additional test fixtures.
Can XC6SLX45-2FG484I be configured using SPI flash memory?
Yes, XC6SLX45-2FG484I supports Master SPI Serial configuration mode, allowing direct boot from industry-standard SPI flash devices such as Micron MT25QL or Winbond W25Q series. Configuration occurs automatically on power-up when MODE pins are set to 001, and the bitstream is loaded at up to 50 MHz.
What I/O standards are supported by XC6SLX45-2FG484I?
XC6SLX45-2FG484I supports 18 I/O standards including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, SSTL18_I/II, SSTL2_I/II, HSTL_I/II, and differential standards LVDS, Mini-LVDS, RSDS, and TMDS. Each of the 10 I/O banks operates independently with configurable VCCO and optional VREF.
Is XC6SLX45-2FG484I RoHS compliant and lead-free?
Yes, XC6SLX45-2FG484I is RoHS compliant and manufactured with a lead-free (Pb-free) finish per JEDEC J-STD-020. The FBGA package uses matte tin surface finish on solder balls, and the device meets EU Directive 2011/65/EU requirements without exemptions.
XC6SLX45-2FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-2FG484I FAQ
1.How can I place an order for XC6SLX45-2FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-2FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-2FG484I reliable?
The price and inventory of XC6SLX45-2FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-2FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-2FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-2FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-2FG484I?
XC6SLX45-2FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-2FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-2FG484I?
For technical support, including XC6SLX45-2FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-2FG484I requirements.
6.How does Aetrix verify that XC6SLX45-2FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-2FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-2FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-2FG484I?
All XC6SLX45-2FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-2FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-2FG484I part is unused and in its original packaging.
Return procedure for XC6SLX45-2FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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