AMD XC6SLX45-2FG676I
- Part No.:
- XC6SLX45-2FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX45-2FG676I.pdf
- Description:
- IC FPGA 358 I/O 676FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6SLX45-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2,183 Kbits of block RAM, and 216 DSP48A1 slices, operating at -2 speed grade with Industrial temperature range (-40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX45-2FG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), LVDS-compatible banks, single-ended signaling support, and configuration via SPI/BPI/JTAG interfaces.
Technical Context
The XC6SLX45-2FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-voltage I/O banks (1.2V/1.8V/2.5V/3.3V) and includes integrated clock management with DCMs for frequency synthesis and phase alignment.
Configuration is performed via Master Serial (SPI), Slave Serial, or Boundary Scan (JTAG) modes. The device supports bitstream encryption using AES-256 and configuration fallback for robust field updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2,183 Kbits - enables on-chip data buffering, FIFOs, and small memory tables without external SRAM |
| DSP Slices | 216 × DSP48A1 - provides hardwired multiply-accumulate capability for filtering and math-intensive algorithms |
| User I/O Pins | 480 - supports high-density interface bridging, sensor aggregation, and multi-protocol connectivity |
| Speed Grade | -2 - guarantees timing closure up to 595 MHz internal clocking and 1,050 Mbps differential I/O rates |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating or thermal margin constraints |
| Configuration Mode | Master Serial (SPI), JTAG, Slave SelectMAP - enables flexible, secure, and field-upgradable programming |
Pinout & Package
The XC6SLX45-2FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 35×35 mm body size and 1.0 mm ball pitch. Pin assignment follows Xilinx UG382 v1.11 and includes dedicated configuration, clock, and configuration pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserts to reset configuration logic and reload bitstream from external flash |
| CCLK | Configuration Clock | Drives serial bitstream loading in Master Serial mode; sourced internally or externally |
| DIN | Serial Data Input | Receives configuration data during Master Serial programming via SPI flash |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan Interface | Enables IEEE 1149.1-compliant debugging, testing, and indirect configuration |
| IO_LxxN/IO_LxxP | Differential I/O Pair | Supports LVDS, RSDS, or BLVDS signaling with internal termination and adjustable drive strength |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Independent 1.2V/1.8V/2.5V/3.3V operation per bank enables mixed-signal interface consolidation |
| AES-256 Bitstream Encryption | Prevents unauthorized bitstream readback and cloning in deployed systems |
| DCM Clock Management | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication without external PLLs |
| Partial Reconfiguration Support | Allows dynamic module swapping during runtime to reduce resource footprint and enable adaptive functionality |
| ISE Design Suite Compatibility | Full toolchain support through Xilinx ISE 14.7 for synthesis, place-and-route, and timing analysis |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback and PWM generation for multi-axis drives. IC Role / Device Role / Timing Role: FPGA fabric executes position loop calculations, generates synchronized PWM outputs, and manages encoder capture with sub-microsecond latency. Use Value: 480 user I/Os allow direct connection to multiple encoders, analog inputs, and gate drivers; -2 speed grade ensures deterministic timing for 20 kHz PWM switching. | Use Scenario: High-speed digital pattern generation and response analysis across multiple DUT interfaces. IC Role / Device Role / Timing Role: Configurable I/O banks interface with LVDS, TTL, and HSTL devices while internal logic validates signal integrity and timing margins. Use Value: 216 DSP48A1 slices accelerate real-time pass/fail decision logic; block RAM buffers test vectors and results without host intervention. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of parallel CMOS image sensor streams before compression or transmission. IC Role / Device Role / Timing Role: Synchronizes multiple sensor clocks, applies pixel-level correction, and formats data for PCIe or Camera Link output. Use Value: Multi-voltage I/O banks interface directly with 1.8V sensors and 3.3V FPD-Link transmitters; 2,183 Kbits block RAM stores frame buffers for pipelined processing. | Use Scenario: Consolidation of ARINC 429, MIL-STD-1553, and discrete I/O signals into a unified Ethernet backbone. IC Role / Device Role / Timing Role: Implements protocol-specific state machines, performs time-stamped message routing, and enforces deterministic latency budgets. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliability in uncontrolled avionics bays; AES encryption secures configuration against tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FG676C | Faster -3 speed grade; commercial temp range (0°C to +85°C); identical logic resources and pinout | Suitable for lab prototypes and non-industrial deployments where extended temperature is not required | Select when higher timing margin is needed and ambient conditions remain within commercial limits |
| XC7S25-2FTGB196I | Artix-7 family; 25K logic cells; smaller 196-pin FTGB package; lower power; no DCM (uses MMCM) | Better suited for space-constrained, low-power embedded vision or IoT edge nodes with moderate logic density needs | Choose for new designs prioritizing power efficiency and smaller footprint over legacy toolchain compatibility |
Compared with XC6SLX45-2FG676I, the -3FG676C offers tighter timing but lacks industrial qualification, while the XC7S25-2FTGB196I reduces size and power at the cost of logic capacity and I/O count-making it appropriate only for scaled-down implementations.
Availability
XC6SLX45-2FG676I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX45-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation-including industrial automation, video processing, and communications infrastructure.
FAQ
What is the maximum supported I/O standard for XC6SLX45-2FG676I?
The XC6SLX45-2FG676I supports LVDS, RSDS, BLVDS, SSTL, HSTL, and single-ended standards including LVTTL and LVCMOS across its 12 I/O banks. Each bank operates independently at 1.2V, 1.8V, 2.5V, or 3.3V, enabling mixed-voltage interface design without level shifters. This capability is documented in Xilinx UG381 v1.11.
Does XC6SLX45-2FG676I support partial reconfiguration?
Yes, XC6SLX45-2FG676I supports partial reconfiguration through the Xilinx ISE 14.7 toolflow using modular design methodology. This allows dynamic replacement of functional modules during operation-critical for adaptive systems like software-defined radios or reconfigurable test instruments-without resetting the entire device.
What configuration modes are available for XC6SLX45-2FG676I?
XC6SLX45-2FG676I supports Master Serial (SPI flash), Slave Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial is most common for production systems due to its simplicity and integration with standard SPI NOR flash devices. JTAG is used for debugging and initial programming.
Is XC6SLX45-2FG676I RoHS compliant and lead-free?
Yes, XC6SLX45-2FG676I is RoHS compliant and features a lead-free, halogen-free FBGA package per Xilinx specification DS162 v3.2. The "I" suffix denotes Industrial temperature grade and also confirms compliance with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
What clock management resources does XC6SLX45-2FG676I include?
XC6SLX45-2FG676I integrates two Digital Clock Managers (DCMs) per device. Each DCM provides frequency synthesis, phase shifting, duty cycle correction, and clock doubling/multiplication. These resources eliminate the need for external clock ICs in many timing-critical applications such as video pixel clock generation or ADC sampling synchronization.
XC6SLX45-2FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 358
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX45-2FG676I FAQ
1.How can I place an order for XC6SLX45-2FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-2FG676I reliable?
The price and inventory of XC6SLX45-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-2FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-2FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-2FG676I transactions.
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XC6SLX45-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-2FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-2FG676I?
For technical support, including XC6SLX45-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-2FG676I requirements.
6.How does Aetrix verify that XC6SLX45-2FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-2FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-2FG676I?
All XC6SLX45-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-2FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-2FG676I part is unused and in its original packaging.
Return procedure for XC6SLX45-2FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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