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AMD XC6SLX45-2FGG484CES
- Part No.:
- XC6SLX45-2FGG484CES
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-2FGG484CES.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,811
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Product details
Overview
XC6SLX45-2FGG484CES from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with lead-free and RoHS-compliant finish. It targets mid-range embedded control, industrial interface bridging, and video processing at up to 800 Mbps LVDS data rates.
For engineers reviewing the XC6SLX45-2FGG484CES datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), -2 speed grade timing performance, and support for DDR2/DDR3 memory interfaces in cost-sensitive systems.
Technical Context
The XC6SLX45-2FGG484CES implements a hierarchical FPGA architecture with six primary I/O banks, each supporting independent VCCO and VREF settings. It integrates dual-register flip-flops per LUT, dedicated carry logic, and configurable I/O standards including LVCMOS, LVDS, and SSTL.
Configuration is performed via Master SPI or JTAG, with bitstream encryption supported through AES-256. The device includes internal clock management using DCMs (Digital Clock Managers) capable of frequency synthesis, phase shifting, and duty cycle correction across eight global clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 2.1 Mb - distributed across 116 BRAM blocks, each 18 Kb, usable as dual-port memory or FIFO buffers |
| DSP Slices | 216 × DSP48A1 - fixed-point arithmetic units supporting multiply-accumulate operations at up to 250 MHz |
| I/O Pins | 341 user I/O - configurable across six banks with independent voltage and termination control |
| Speed Grade | -2 - guarantees timing closure for designs operating at maximum specified frequencies per data sheet tables |
| Package | 484-pin FGG484 - 23×23 mm fine-pitch BGA with 1.0 mm ball pitch and Pb-free finish |
| Configuration Mode | Master SPI / JTAG - supports active serial configuration from external flash or boundary-scan programming |
Pinout & Package
XC6SLX45-2FGG484CES is housed in a 484-ball Fine-Pitch Ball Grid Array (FGG484) package with 23×23 array, 1.0 mm pitch, and RoHS-compliant matte tin finish. Pin functions are organized into six I/O banks (Bank 0–5), two configuration banks (Bank 14/15), and dedicated power/ground balls.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_IO_0 / INIT_B | Active-low configuration initialization signal; pulled high during normal operation, drives low on configuration error |
| H17 | PROGRAM_B | Active-low asynchronous reset for configuration logic; toggling reloads bitstream from master SPI flash |
| K19 | CCLK | Configuration clock input/output; driven by FPGA during master SPI mode, externally supplied in slave modes |
| M20 | DONE | Open-drain status output indicating successful configuration completion; requires external pull-up |
| P16 | VCCAUX | 1.8 V auxiliary supply for configuration logic, DCMs, and SelectIO circuitry |
| R18 | VCCO_0 | Output bank voltage for I/O Bank 0; sets logic threshold and drive strength for pins in that bank |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers providing jitter-tolerant clock synthesis, phase alignment, and frequency multiplication/division |
| SelectIO Technology | Support for 17 I/O standards including LVDS, SSTL-2, HSTL-I, and differential signaling with programmable slew rate and drive strength |
| Memory Interface Support | Hardened logic and timing models validated for DDR2-400 and DDR3-800 interfaces with fly-by topology |
| AES Bitstream Encryption | On-chip 256-bit AES decryption engine enabling secure configuration loading from external SPI flash |
| Low-Power Architecture | Multiple power domains (VCCINT, VCCAUX, VCCO) with dynamic power gating and sleep mode support |
Applications
| Industrial PLC I/O Module | Video Frame Grabber |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation (Modbus RTU to EtherCAT) in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines, parallel I/O handling, and deterministic timing for fieldbus synchronization. Use Value: 341 user I/O pins enable direct connection to multiple sensor/actuator interfaces without glue logic; -2 speed grade ensures sub-100 ns I/O-to-I/O path timing. | Use Scenario: Capturing and preprocessing HD video streams (1080p60) from CMOS image sensors before compression. IC Role / Device Role / Timing Role: FPGA acts as pixel pipeline processor, performing color space conversion, noise reduction, and DDR3 buffering. Use Value: 216 DSP48A1 slices accelerate real-time filtering algorithms; 2.1 Mb block RAM provides frame-level line buffers with zero external memory latency. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Bridging legacy analog/digital imaging subsystems (e.g., ultrasound front-end ADCs) to modern PCIe-based host processors. IC Role / Device Role / Timing Role: FPGA serves as protocol converter and timing adapter, aligning asynchronous sensor clocks to system reference. Use Value: Six independent I/O banks allow simultaneous 1.8 V LVDS (sensor interface) and 3.3 V CMOS (host interface) signaling without level shifters. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in airborne mission computers. IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered communication stacks and watchdog-controlled fail-safe logic. Use Value: Dual DCMs generate precise 1 MHz and 4 MHz clocks required for ARINC 429 bit timing and 1553 bus arbitration, respectively. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484C | Faster -3 speed grade; higher static power consumption; identical logic resources and I/O count | Better suited for designs requiring tighter setup/hold margins or higher clock frequencies beyond -2 limits | Select when timing closure fails at -2 grade or when targeting >350 MHz system clocks |
| XC6SLX25-2FTG256C | Smaller 25K logic cell count; 256-pin TQFP package; reduced block RAM (1.8 Mb) and DSP slices (112) | Lower-cost option for less complex control logic where I/O count and memory bandwidth are constrained | Choose for space-constrained PCBs or cost-sensitive applications with <200 user I/O requirement |
Compared with XC6SLX45-2FGG484CES, the -3 variant delivers improved timing margin at higher frequencies but increases power draw, while the XC6SLX25-2FTG256C reduces footprint and cost at the expense of logic density, memory, and I/O scalability.
Availability
XC6SLX45-2FGG484CES is available at Aetrix Electronics and suitable for industrial automation, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX45-2FGG484CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-6 family was originally designed by Xilinx to deliver cost-optimized, low-power FPGA solutions for high-volume industrial, automotive, and consumer applications with balanced logic, memory, and I/O resources.
FAQ
What is the maximum supported memory interface speed for XC6SLX45-2FGG484CES?
The XC6SLX45-2FGG484CES supports DDR2-400 (200 MHz clock, 400 Mbps data rate) and DDR3-800 (400 MHz clock, 800 Mbps data rate) interfaces with validated timing models and PHY calibration logic. These speeds assume proper board layout, termination, and VCCO = 1.5 V for DDR3 or 1.8 V for DDR2. The XC6SLX45-2FGG484CES does not support LPDDR or GDDR memory standards.
Does XC6SLX45-2FGG484CES support JTAG boundary-scan testing?
Yes, XC6SLX45-2FGG484CES fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TDI, TDO, TCK, TMS, and TRST pins are dedicated and electrically compliant. JTAG mode is enabled automatically when PROGRAM_B is held high and INIT_B is released, and it remains active until configuration completes via another method.
What configuration memory options are compatible with XC6SLX45-2FGG484CES?
XC6SLX45-2FGG484CES supports Master SPI configuration from standard quad-SPI or single-SPI flash devices such as Micron MT25QL series or Spansion S25FL series. It requires 3.3 V I/O-compatible flash with at least 16 MB capacity for full bitstream storage. Configuration via BPI or NAND flash is not supported on this device.
Can XC6SLX45-2FGG484CES operate with mixed I/O voltages on different banks?
Yes, XC6SLX45-2FGG484CES allows independent VCCO settings per I/O bank (Bank 0–5), enabling simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V signaling. Each bank must have its own decoupled VCCO supply, and VREF may be set externally or internally depending on standard. This capability is confirmed in Xilinx UG381 v1.11 Section 2.3.2.
Is XC6SLX45-2FGG484CES qualified for automotive applications?
No, XC6SLX45-2FGG484CES is not AEC-Q100 qualified and is rated for commercial (0°C to +85°C) or industrial (-40°C to +100°C) temperature ranges only. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and extended reliability testing. For automotive use, AMD recommends the XA Spartan-6 family variants such as XA6SLX45.
XC6SLX45-2FGG484CES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-2FGG484CES FAQ
1.How can I place an order for XC6SLX45-2FGG484CES through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-2FGG484CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-2FGG484CES reliable?
The price and inventory of XC6SLX45-2FGG484CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-2FGG484CES is usually 5 days.
3.What payment methods are accepted for XC6SLX45-2FGG484CES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-2FGG484CES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-2FGG484CES?
XC6SLX45-2FGG484CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-2FGG484CES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-2FGG484CES?
For technical support, including XC6SLX45-2FGG484CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-2FGG484CES requirements.
6.How does Aetrix verify that XC6SLX45-2FGG484CES is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-2FGG484CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-2FGG484CES meets industry standards.
7.What is the process for return or replacement of XC6SLX45-2FGG484CES?
All XC6SLX45-2FGG484CES units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-2FGG484CES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-2FGG484CES part is unused and in its original packaging.
Return procedure for XC6SLX45-2FGG484CES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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