AMD XC6SLX45-2FGG484I
- Part No.:
- XC6SLX45-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-2FGG484I.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:122
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX45-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with industrial temperature range (–40°C to +100°C). It targets embedded vision preprocessing, industrial I/O bridging, and protocol conversion in space-constrained control systems.
For engineers reviewing the XC6SLX45-2FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (348 user I/Os), speed grade (-2 = 500 MHz system clock capability), LVDS/PCIe Gen1 support, and industrial-grade thermal reliability.
Technical Context
The XC6SLX45-2FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and differential SSTL, with programmable slew rate and drive strength per bank.
It integrates dual 10-bit ADCs for on-chip monitoring, six CMT clock management tiles (each with DCM and PLL), and supports JTAG, SPI, and BPI configuration modes. The -2 speed grade guarantees timing closure at 500 MHz for critical paths under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2.1 Mb - supports FIFOs, frame buffers, and lookup tables without external memory |
| DSP Slices | 216 × DSP48A1 - enables real-time filtering, FFT, and arithmetic-intensive signal processing |
| User I/O Pins | 348 - provides high-density interface flexibility across multiple voltage standards and protocols |
| Speed Grade | -2 - ensures 500 MHz system clock operation with guaranteed timing margins at –40°C to +100°C |
| Package | 484-pin FGG (Fine-Pitch BGA, 23×23 mm, 1.0 mm pitch) - enables compact PCB layout with thermal pad for industrial cooling |
| Configuration Memory | Supports 4-/8-/16-/32-bit parallel BPI, x1/x2/x4 serial SPI - allows flexible boot source selection and field updates |
Pinout & Package
XC6SLX45-2FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and exposed thermal pad. Pinout follows Xilinx Spartan-6 FPGA Pin Planning Guide UG381 (v1.12), with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain status output confirming successful configuration load and initialization |
| E20 | INIT_B | Active-low open-drain signal indicating device readiness for configuration or detecting CRC errors |
| H19 | PROGRAM_B | Active-low input that resets configuration memory and initiates reconfiguration sequence |
| A17, A18 | CLK0, CLK1 | Dedicated single-ended clock inputs supporting up to 500 MHz with low-jitter routing |
| P15–P18, R14–R17 | MGTREFCLK0/1 | Dedicated differential reference clock inputs for multi-gigabit transceivers (not present in LX45) |
| Y19, Y20, W19, W20 | VRN0/VRP0, VRN1/VRP1 | Differential I/O reference pins enabling LVDS and other differential signaling standards |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Dual 10-bit ADCs | Monitor on-chip temperature and supply voltages without external sensors or ADC components |
| Six CMT Clock Management Tiles | Each contains one DCM and one PLL for independent clock synthesis, phase alignment, and jitter reduction |
| SelectIO Technology | Per-bank programmable I/O standards (LVCMOS/LVDS/SSTL) with adjustable drive strength and slew rate |
| ISE Design Suite Support | Full toolchain compatibility including synthesis, place-and-route, and bitstream generation for legacy industrial designs |
| Industrial Temperature Range | Guaranteed operation from –40°C to +100°C ambient, validated per JEDEC JESD22-A104 |
Applications
| Industrial Motion Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder interface aggregation in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic PWM generation, quadrature decoding, and safety-critical logic with sub-microsecond latency. Use Value: 348 user I/Os enable direct connection to multiple encoders, analog sensors, and motor drivers without glue logic. | Use Scenario: Bayer demosaicing, histogram equalization, and ROI cropping prior to video compression in smart cameras. IC Role / Device Role / Timing Role: Configurable logic executes pixel-level operations in pipeline stages synchronized to image sensor clocks. Use Value: 216 DSP48A1 slices deliver 1.2 GOPS peak throughput for real-time image enhancement at 60 fps. |
| Protocol Translation Gateway | Test & Measurement Signal Generation |
Use Scenario: Bridging Modbus RTU over RS-485 to EtherCAT in factory automation controllers. IC Role / Device Role / Timing Role: Implements dual-protocol state machines, CRC engines, and timing-critical bus arbitration logic. Use Value: Dedicated clock management tiles ensure precise 1 µs jitter tolerance required for EtherCAT cycle synchronization. | Use Scenario: Generating calibrated analog waveforms and digital stimulus patterns for automated test equipment. IC Role / Device Role / Timing Role: Controls high-speed DACs and pattern generators via synchronous I/O with deterministic timing. Use Value: 500 MHz system clock capability supports 125 MSPS waveform sampling rates with tight setup/hold margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484C | Faster speed grade (-3) with higher static power and tighter timing margins; commercial temp range (0°C to +85°C) | Not qualified for extended industrial environments requiring –40°C startup or +100°C sustained operation | Select only if design operates within commercial temperature limits and requires margin for future frequency scaling |
| XC7S50-2FTG256I | Artix-7 successor with 52,000 logic cells, 2.5 Mb BRAM, and enhanced DSP efficiency; 256-pin FTBGA package | Smaller I/O count (170 vs. 348) and no integrated ADCs; requires migration of ISE projects to Vivado | Choose when upgrading legacy designs with available board redesign budget and need for lower dynamic power per logic cell |
Compared with XC6SLX45-2FGG484I, the XC6SLX45-3FGG484C offers higher clock frequency headroom but sacrifices industrial temperature compliance, while the XC7S50-2FTG256I delivers architectural improvements and power efficiency at the cost of I/O density and toolchain continuity.
Availability
XC6SLX45-2FGG484I is available at Aetrix Electronics and suitable for industrial motion control, embedded vision preprocessing, and protocol translation gateway applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX45-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-lifecycle industrial and aerospace applications.
The Spartan-6 family was designed for cost-sensitive, high-reliability embedded systems requiring predictable timing, low static power, and mature toolchain support - especially where ISE-based designs remain in production.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45-2FGG484I?
The XC6SLX45-2FGG484I supports I/O standards from 1.2 V to 3.3 V across its 12 I/O banks, with per-bank voltage selection. Each bank can be independently configured for LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, or differential standards like LVDS and SSTL. This flexibility allows mixed-voltage interfacing without level-shifters in XC6SLX45-2FGG484I-based systems.
Does XC6SLX45-2FGG484I include built-in analog-to-digital converters?
Yes, XC6SLX45-2FGG484I integrates two 10-bit, 1 MSPS auxiliary analog-to-digital converters (XADC) for monitoring on-die temperature and supply voltages (VCCINT, VCCAUX, VCCO). These ADCs operate independently of the FPGA fabric and require no external components, enabling real-time health monitoring in XC6SLX45-2FGG484I deployments without adding discrete sensors.
What configuration modes does XC6SLX45-2FGG484I support?
XC6SLX45-2FGG484I supports Master Serial (SPI x1/x2/x4), Slave Serial, Master SelectMAP (BPI x8/x16), Slave SelectMAP, and JTAG configuration modes. Bitstream loading can be initiated via PROGRAM_B, and status verified using INIT_B and CONFIG_DONE pins. All modes are fully documented in Xilinx UG380 for XC6SLX45-2FGG484I and compatible with industrial flash memory devices.
Is XC6SLX45-2FGG484I pin-compatible with other Spartan-6 devices in the same package?
No, XC6SLX45-2FGG484I is not fully pin-compatible with other Spartan-6 FPGAs in the FGG484 package, such as XC6SLX16 or XC6SLX100. While the physical footprint and ball map match, I/O bank assignments, configuration pin locations, and dedicated function pin mappings differ. Migration requires PCB layout verification and pin assignment review per UG381 for each specific XC6SLX45-2FGG484I variant.
What is the guaranteed operating temperature range for XC6SLX45-2FGG484I?
XC6SLX45-2FGG484I is rated for industrial temperature operation from –40°C to +100°C ambient, with full functionality and timing compliance across this range. This specification is validated per JEDEC JESD22-A104 and applies to all logic, I/O, clocking, and configuration resources. Thermal derating is not required for XC6SLX45-2FGG484I within these limits when used with appropriate PCB copper pour and airflow.
XC6SLX45-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-2FGG484I FAQ
1.How can I place an order for XC6SLX45-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-2FGG484I reliable?
The price and inventory of XC6SLX45-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-2FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-2FGG484I?
XC6SLX45-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-2FGG484I?
For technical support, including XC6SLX45-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-2FGG484I requirements.
6.How does Aetrix verify that XC6SLX45-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-2FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-2FGG484I?
All XC6SLX45-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-2FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX45-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX45-2FGG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

