My Inquiry
My Account
AMD XC6SLX45-3CSG324C
- Part No.:
- XC6SLX45-3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX45-3CSG324C.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:239
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX45-3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 324-pin CSGA package with -3 speed grade and commercial temperature range (0°C to 85°C). It targets cost-sensitive embedded control, industrial I/O bridging, and video interface logic.
For engineers reviewing the XC6SLX45-3CSG324C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (214 user I/Os), LVDS support, single-ended signaling compatibility, and configuration via SPI/BPI/JTAG interfaces.
Technical Context
The XC6SLX45-3CSG324C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O banks with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω).
Configuration is performed via Master Serial (SPI), Slave Parallel (BPI), or JTAG modes, with bitstream encryption and dual-boot capability enabled through external PROM or flash memory. The device integrates clock management tiles with DCMs supporting frequency synthesis, phase shifting, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total available LUTs + flip-flops for combinational and sequential logic implementation |
| Block RAM | 2.1 Mb - distributed across 116 BRAM blocks (18 Kb each), usable as true dual-port memory or FIFO |
| DSP Slices | 216 × DSP48A1 - support 18×18 signed multiplication, pre-add, accumulator, and pattern detection |
| User I/O Pins | 214 - configurable as LVCMOS, LVTTL, LVDS, or differential SSTL with bank-specific voltage support |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, enabling 667 Mbps DDR3 operation and 375 MHz system clocks |
| Package | CSG324 - 324-ball fine-pitch CSPBGA, 15×15 mm body, 0.8 mm pitch, RoHS-compliant |
| Operating Temp | 0°C to +85°C - commercial-grade thermal specification suitable for non-automotive industrial environments |
Pinout & Package
XC6SLX45-3CSG324C uses a 324-ball CSPBGA (CSG324) package with 214 user-configurable I/O pins, 8 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 global clock inputs, and power/ground balls distributed across the array. Ball pitch is 0.8 mm; mounting requires controlled-depth reflow per IPC-7095.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-low configuration initiator | Drives internal reset and initiates bitstream reload from external memory upon falling edge |
| INIT_B | Open-drain status indicator | Asserted low during configuration error or CRC failure; used for system-level fault detection |
| DONE | Open-drain configuration completion | Driven high when configuration completes successfully and device enters user mode |
| CCLK | Configuration clock input | Accepts up to 50 MHz clock during Master Serial mode; sourced externally or internally via DCM |
| M0–M2 | Mode select inputs | Set configuration mode (e.g., Master Serial, Slave SelectMAP, JTAG) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O banks | Supports independent VCCO per bank (1.2 V to 3.3 V), enabling mixed-voltage interface design without level shifters |
| Dual-configuration support | Enables field-upgradable designs using two independent bitstreams stored in external flash with fail-safe fallback |
| Embedded DCMs | Two Digital Clock Managers per device provide jitter reduction, frequency synthesis, and phase alignment for synchronous systems |
| ISE Design Suite support | Full toolchain compatibility with Xilinx ISE 14.7 for synthesis, place-and-route, timing analysis, and bitstream generation |
| Bitstream encryption | AES-128 encryption protects intellectual property against unauthorized readback or cloning of configuration data |
Applications
| Industrial PLC I/O Expansion | Video Frame Buffer Interface |
|---|---|
Use Scenario: Adding isolated digital I/O, analog input conditioning, and protocol translation (Modbus RTU/ASCII) to legacy PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as real-time I/O controller with deterministic latency, managing parallel bus handshaking and serial peripheral interfacing. Use Value: Enables flexible, reprogrammable expansion without ASIC redesign; supports 214 I/Os with configurable pull-ups and slew control for noise immunity. | Use Scenario: Buffering and format conversion between HDMI capture ICs and display controllers in medical imaging or broadcast equipment. IC Role / Device Role / Timing Role: Implements dual-port BRAM-based frame buffers and pixel clock domain crossing logic between 720p/1080p sources and sinks. Use Value: Leverages 2.1 Mb block RAM and 216 DSP slices for real-time scaling, color space conversion, and de-interlacing without external memory. |
| Automated Test Equipment (ATE) Pattern Generator | Communications Protocol Bridge |
Use Scenario: Generating precise, synchronized stimulus waveforms for semiconductor wafer probing and board-level functional test. IC Role / Device Role / Timing Role: FPGA serves as high-speed pattern sequencer with sub-cycle timing control, using DCMs for jitter-free clock generation. Use Value: Achieves ≤1 ns timing resolution via -3 speed grade and dedicated carry chains; supports 667 Mbps DDR3 for pattern storage. | Use Scenario: Translating between CAN FD and RS-485 physical layers in vehicle diagnostics gateways or fleet telematics units. IC Role / Device Role / Timing Role: Implements protocol state machines, CRC calculation, and bidirectional signal conditioning with isolated I/O banks. Use Value: Uses 214 user I/Os and multi-voltage banks to interface both 3.3 V CAN transceivers and 5 V RS-485 drivers without external level shifters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2CSG324C | Lower speed grade (-2); maximum DDR3 rate 533 Mbps; reduced timing margin for high-frequency designs | Suitable for non-critical timing paths and lower-clock-rate control logic | Select when system clock requirements are ≤333 MHz and cost optimization is prioritized over peak performance |
| XC6SLX75-3FGG484C | Larger device (74,637 logic cells, 334 DSP slices, 344 I/Os) in 484-pin FGG package; higher power and board area | Required for designs needing >43K LUTs or additional high-speed transceivers (not present in XC6SLX45) | Choose when scalability beyond XC6SLX45-3CSG324C resources is confirmed, accepting larger footprint and thermal budget |
Compared with XC6SLX45-2CSG324C, the XC6SLX45-3CSG324C delivers tighter timing closure for DDR3 interfaces and higher clock frequencies; compared with XC6SLX75-3FGG484C, it offers identical architecture and toolchain support but reduces cost, power, and PCB complexity where resource headroom is not required.
Availability
XC6SLX45-3CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and communications infrastructure requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX45-3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and markets adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, high-volume applications demanding low power, small footprint, and seamless integration with microprocessors and analog components.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX45-3CSG324C?
The XC6SLX45-3CSG324C supports DDR3 SDRAM interfaces up to 667 Mbps (333 MHz clock) in the -3 speed grade. This is verified in Xilinx UG382 v1.11 and applies specifically to the CSG324 package with proper PCB layout and termination. The XC6SLX45-3CSG324C achieves this using its dedicated I/O logic and DCM-based clock forwarding.
Does XC6SLX45-3CSG324C support JTAG boundary-scan testing?
Yes, XC6SLX45-3CSG324C fully supports IEEE 1149.1 JTAG boundary-scan for PCB interconnect testing and in-system programming. The device includes dedicated TDI, TDO, TMS, and TCK pins, and complies with Xilinx's BSCAN_SPARTAN6 configuration primitive. This capability is documented in UG380 and applies directly to the XC6SLX45-3CSG324C silicon revision.
Can XC6SLX45-3CSG324C be configured using a serial NOR flash device?
Yes, XC6SLX45-3CSG324C supports Master Serial configuration mode with standard SPI-compatible serial NOR flash devices (e.g., Spansion S25FL series). Configuration occurs automatically at power-up when M[2:0] pins are set to 001. The XC6SLX45-3CSG324C reads the bitstream sequentially from address 0x000000.
What is the purpose of the INIT_B pin on XC6SLX45-3CSG324C?
The INIT_B pin on XC6SLX45-3CSG324C is an open-drain output that signals configuration status. It goes low during configuration initialization and remains low if a CRC error or other configuration failure occurs. External logic can monitor INIT_B to trigger system-level recovery. This behavior is defined in the XC6SLX45-3CSG324C's configuration user guide UG380.
Is XC6SLX45-3CSG324C compatible with Xilinx ISE 14.7 design tools?
Yes, XC6SLX45-3CSG324C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, MAP, PAR, bitstream generation, and timing analysis. Device files, simulation models, and constraint templates for XC6SLX45-3CSG324C are included in ISE 14.7 Service Pack 5 and later. No third-party tools are required to implement the XC6SLX45-3CSG324C.
XC6SLX45-3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX45-3CSG324C FAQ
1.How can I place an order for XC6SLX45-3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-3CSG324C reliable?
The price and inventory of XC6SLX45-3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX45-3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-3CSG324C?
XC6SLX45-3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-3CSG324C?
For technical support, including XC6SLX45-3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3CSG324C requirements.
6.How does Aetrix verify that XC6SLX45-3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX45-3CSG324C?
All XC6SLX45-3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX45-3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX45-3CSG324C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
