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AMD XC6SLX45-3CSG324I
- Part No.:
- XC6SLX45-3CSG324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX45-3CSG324I.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:165
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Product details
Overview
XC6SLX45-3CSG324I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2.1 Mb of block RAM, 216 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX45-3CSG324I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (204 user I/Os), LVDS/PCIe-compatible transceivers, and support for JTAG boundary-scan testing in harsh environments.
Technical Context
The XC6SLX45-3CSG324I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO technology supporting 24 I/O standards including LVCMOS, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
It includes dual-register flip-flops for high-speed register packing, clock management via DCMs (Digital Clock Managers) with phase shifting and frequency synthesis, and supports configuration through SPI, BPI, or JTAG interfaces with AES bitstream encryption option.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 2,129,920 bits (2.1 Mb) - enables on-chip data buffering, FIFOs, and small memory tables without external SRAM |
| DSP Slices | 216 × DSP48A1 - provides hardwired multiply-accumulate capability for filtering and math-intensive algorithms |
| User I/O Pins | 204 - supports high-pin-count peripheral interfacing with bank-wise voltage and standard flexibility |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in uncontrolled industrial enclosures and outdoor equipment |
| Package | CSG324 - 324-pin CspBGA with 0.8 mm pitch, optimized for thermal dissipation and board-level reliability |
Pinout & Package
The XC6SLX45-3CSG324I is housed in a 324-pin Chip Scale Ball Grid Array (CSG324) package with 0.8 mm ball pitch, 17 × 17 array, and exposed thermal pad. Pinout follows Xilinx SP605 reference layout with dedicated configuration, clock, and JTAG pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for LVDS outputs |
| P1 | PROGRAM_B | Active-low configuration reset - asynchronous assertion forces reload from master SPI flash |
| T1 | TCK | JTAG test clock input - requires 10 kΩ pull-up for reliable boundary-scan during production test |
| V2 | M0 | Configuration mode select - sets boot source as SPI x4 when pulled high with M1/M2 |
| Y2 | INIT_B | Open-drain initialization status - goes high-Z after successful bitstream CRC check |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - enable jitter-reduced clock synthesis, phase alignment, and frequency division without external PLL ICs |
| SelectIO Technology | Per-bank I/O voltage (1.2–3.3 V) and standard selection - allows mixed-voltage interfacing to legacy and modern peripherals on same FPGA |
| Partial Reconfiguration | Supported via ICAP interface - enables dynamic function swapping in real-time without full system reset |
| AES Bitstream Encryption | Optional 256-bit AES key storage in eFUSE - prevents reverse engineering of proprietary logic in deployed units |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 - ensures compatibility with legacy industrial firmware toolchains and certification workflows |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital I/O conditioning and protocol bridging between fieldbus (PROFIBUS, CANopen) and EtherCAT backplane. IC Role / Device Role / Timing Role: FPGA acts as deterministic protocol gateway with sub-microsecond I/O response latency and synchronized timestamping. Use Value: XC6SLX45-3CSG324I delivers 204 user I/Os and dual DCMs to align multiple fieldbus clocks without external timing ICs. | Use Scenario: High-speed digital pattern generation and acquisition for semiconductor wafer probing. IC Role / Device Role / Timing Role: Configurable logic engine for parallel vector sequencing, error injection, and pass/fail decision logic at 100+ MHz. Use Value: XC6SLX45-3CSG324I provides 216 DSP48A1 slices and 2.1 Mb block RAM to implement on-the-fly signature analysis and compression. |
| Avionics Data Concentrator | Medical Imaging Interface Board |
Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in line-replaceable units (LRUs) for flight control systems. IC Role / Device Role / Timing Role: Timing-critical bus controller with deterministic arbitration and built-in CRC generation/checking per frame. Use Value: XC6SLX45-3CSG324I supports LVDS I/O and industrial temp range required for avionics EMI-hardened designs. | Use Scenario: Pixel data aggregation from multiple CMOS image sensors into a unified MIPI CSI-2 stream for ultrasound processing. IC Role / Device Role / Timing Role: High-bandwidth pixel pipeline synchronizer with frame-level buffering and format conversion. Use Value: XC6SLX45-3CSG324I's 2.1 Mb block RAM enables full-frame buffering of 12-bit 1024×768 sensor data before compression. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2CSG324C | Speed grade -2 (slower max frequency), commercial temp range (0°C to +85°C) | Not qualified for industrial or avionics use; limited to lab or benign-environment ATE | Select only if timing margin exceeds 15% and ambient temperature stays below 85°C |
| XC7S50-2CSGA324C | Artix-7 architecture, higher logic density (52,000 LUTs), no DCM (uses MMCM), 1.8 V core | Requires PCB redesign due to different power delivery, I/O banking, and configuration interface | Consider for new designs needing higher performance and lower static power; not drop-in compatible with XC6SLX45-3CSG324I |
Compared with XC6SLX45-2CSG324C and XC7S50-2CSGA324C, the XC6SLX45-3CSG324I uniquely balances industrial temperature operation, mature toolchain support, and proven reliability in long-lifecycle embedded deployments - making it preferred where certification traceability and unchanged hardware are mandatory.
Availability
XC6SLX45-3CSG324I is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, and medical imaging equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX45-3CSG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-term industrial and aerospace applications.
The Spartan-6 FPGA family was designed for cost-sensitive, high-volume embedded systems requiring low-power logic, flexible I/O, and predictable timing - especially where legacy design reuse and certification continuity matter.
FAQ
What is the maximum operating frequency supported by the XC6SLX45-3CSG324I?
The XC6SLX45-3CSG324I is rated at speed grade -3, guaranteeing timing closure up to 500 MHz for internal logic paths under industrial temperature conditions (-40°C to +100°C). Actual achievable frequency depends on design complexity, routing, and I/O standard selection - verified using Xilinx ISE 14.7 timing analyzer with worst-case corner models.
Does the XC6SLX45-3CSG324I support JTAG boundary-scan testing?
Yes, the XC6SLX45-3CSG324I fully supports IEEE 1149.1 JTAG boundary-scan for production test and debug. Pins TCK, TMS, TDI, TDO, and TRST_B are dedicated for this purpose, and the device implements mandatory instruction register and boundary-scan register logic per standard compliance.
Can the XC6SLX45-3CSG324I be configured via SPI flash?
Yes, the XC6SLX45-3CSG324I supports master SPI configuration mode using a standard quad-SPI flash device. Configuration is initiated automatically on power-up when M0–M2 pins are set to 110, and the FPGA reads the bitstream directly from the flash without external controller intervention.
Is AES bitstream encryption available on the XC6SLX45-3CSG324I?
Yes, AES-256 bitstream encryption is optional and enabled via eFUSE programming of a 256-bit key. Once programmed, the XC6SLX45-3CSG324I decrypts the configuration bitstream on-the-fly during startup, preventing unauthorized readback or cloning of the implemented logic design.
What development tools are compatible with the XC6SLX45-3CSG324I?
The XC6SLX45-3CSG324I is fully supported in Xilinx ISE Design Suite 14.7 - the final and only officially supported toolchain. It is not compatible with Vivado, as Spartan-6 devices were retired from that platform. Legacy IP cores, simulation models, and timing constraints remain validated exclusively in ISE 14.7.
XC6SLX45-3CSG324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX45-3CSG324I FAQ
1.How can I place an order for XC6SLX45-3CSG324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-3CSG324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-3CSG324I reliable?
The price and inventory of XC6SLX45-3CSG324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3CSG324I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-3CSG324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3CSG324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-3CSG324I?
XC6SLX45-3CSG324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-3CSG324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-3CSG324I?
For technical support, including XC6SLX45-3CSG324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3CSG324I requirements.
6.How does Aetrix verify that XC6SLX45-3CSG324I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-3CSG324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3CSG324I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-3CSG324I?
All XC6SLX45-3CSG324I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3CSG324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-3CSG324I part is unused and in its original packaging.
Return procedure for XC6SLX45-3CSG324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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