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AMD XC6SLX45-3FG484C

Part No.:
XC6SLX45-3FG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX45-3FG484C.pdf
Description:
IC FPGA 316 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,692

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Product details

Overview

XC6SLX45-3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2,183 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade (fastest in Spartan-6 family) and supports 1.2 V core voltage for low-power embedded control and industrial interface applications.

For engineers reviewing the XC6SLX45-3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, block RAM depth for buffering, and compatibility with Spartan-6 design tools and configuration interfaces.

Technical Context

The XC6SLX45-3FG484C implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dedicated clock management tiles with DCMs (Digital Clock Managers) for frequency synthesis and phase alignment.

Configuration is performed via Master SPI or JTAG, with support for fallback dual-image bitstreams. The device integrates SelectIO™ technology enabling LVCMOS, LVDS, and SSTL I/O standards across its 186 user pins, with programmable drive strength and slew rate control per bank.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells43,661 - determines maximum combinational/sequential logic capacity for custom digital functions
Block RAM2,183 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory
User I/Os186 - supports high-density peripheral interfacing with bank-wise voltage and standard flexibility
Speed Grade-3 - guarantees worst-case timing performance at highest operating frequency in Spartan-6 family
Core Voltage1.2 V ±3% - defines power delivery requirements and impacts dynamic/static power consumption
Package484-pin FBGA (F/G suffix) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant, requires reflow assembly

Pinout & Package

XC6SLX45-3FG484C uses a 484-ball fine-pitch BGA (package code FG484) with 186 user-configurable I/Os distributed across 10 I/O banks. Power and ground balls are allocated per bank to minimize noise coupling; configuration pins (e.g., INIT_B, PROGRAM_B, DONE) and dedicated clock inputs (e.g., CLKIN_0, CLKIN_1) are fixed-function and non-reconfigurable.

Pin/TerminalCircuit RoleDesign Meaning
PROGRAM_BActive-Low Configuration InitiateAsserting low triggers full reconfiguration from external SPI flash or host processor
INIT_BOpen-Drain Status OutputIndicates configuration memory clearing status; pulled high during normal operation
DONEOpen-Drain Configuration CompletionDrives high when bitstream loading and startup sequence complete successfully
CLKIN_0 / CLKIN_1Dedicated Single-Ended Clock InputsFeed DCMs for internal clock generation; require 0–350 MHz input range and proper termination
VCCO_0–VCCO_9I/O Bank Supply VoltagesSet output voltage level and compatible I/O standards per bank (e.g., 3.3 V, 2.5 V, 1.8 V)

Key Features

FeatureDesign Value
DCM-based clock managementEnables precise clock multiplication, division, phase shifting, and jitter reduction without external PLL ICs
SelectIO™ technologyAllows mixed-voltage I/O operation across banks, supporting legacy and modern interface standards simultaneously
DSP48A1 slicesDelivers deterministic 18×18-bit signed multiplication with 48-bit accumulator for real-time filtering or motor control
Embedded Block RAMProvides true dual-port RAM with independent read/write clocks per block, usable as FIFO or buffer memory
MultiBoot configurationSupports up to two independent bitstreams stored in SPI flash, enabling field-upgradable firmware with fallback safety

Applications

Industrial PLC I/O ModuleMedical Imaging Interface

Use Scenario: Real-time acquisition and preprocessing of analog sensor data from multiple channels in programmable logic controllers.

IC Role / Device Role / Timing Role: FPGA acts as parallel I/O aggregator and protocol translator between fieldbus (e.g., Profibus) and ARM-based controller.

Use Value: 186 user I/Os enable direct connection to 32+ digital inputs/outputs and 8+ analog front-end interfaces without glue logic.

Use Scenario: High-speed pixel data routing and synchronization between image sensors and processing SoCs in ultrasound or endoscopy systems.

IC Role / Device Role / Timing Role: FPGA serves as a timing-critical bridge handling LVDS camera links and DDR2 memory buffering.

Use Value: DCMs ensure sub-nanosecond skew control across 12+ LVDS pairs, meeting MIPI CSI-2 timing constraints.

Avionics Data ConcentratorTest & Measurement Pattern Generator

Use Scenario: Consolidating ARINC 429, discrete I/O, and MIL-STD-1553B signals into a unified Ethernet backbone in flight control systems.

IC Role / Device Role / Timing Role: FPGA implements protocol-specific state machines and time-stamped packetization logic.

Use Value: -3 speed grade ensures deterministic <12 ns propagation delay for critical bus arbitration logic.

Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for semiconductor ATE systems.

IC Role / Device Role / Timing Role: FPGA functions as a high-resolution pattern sequencer with precise edge placement.

Use Value: Embedded block RAM stores >1 Mbit of test vectors; DSP48A1 enables real-time waveform modulation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX45-2FG484CSlower -2 speed grade; ~15% lower max clock frequency in timing-critical pathsSuitable for cost-sensitive designs where full -3 timing margin is not requiredSelect when system-level timing slack allows relaxed setup/hold margins and lower power consumption is prioritized
XC6SLX75-3FG484CHigher logic density (74,637 LUTs), +30% block RAM, same package footprint and pinoutUsed when additional logic resources or larger on-chip memory buffers are needed for expanded functionalityChoose for scalable designs requiring headroom for future feature upgrades without PCB revision

Compared with XC6SLX45-3FG484C, the -2 variant trades speed for lower static power and cost, while the XC6SLX75-3FG484C offers pin-compatible scalability-both retain identical I/O banking structure and configuration interface, enabling reuse of board layout and firmware infrastructure.

Availability

XC6SLX45-3FG484C is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics subsystems requiring stable component supply over extended production lifecycles.

Supply support for XC6SLX45-3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.

The Spartan-6 family, including XC6SLX45-3FG484C, was designed for cost-sensitive, power-efficient logic integration in industrial control, video surveillance, and communications infrastructure.

FAQ

What is the maximum operating frequency supported by XC6SLX45-3FG484C?

The XC6SLX45-3FG484C supports a maximum system clock frequency of 750 MHz for internal logic paths under worst-case conditions, as guaranteed by its -3 speed grade. This applies to critical timing paths routed through LUTs and registers; actual achievable frequency depends on design complexity, placement, and routing. The DCMs support input frequencies up to 350 MHz and can generate higher-frequency clocks internally.

Does XC6SLX45-3FG484C support JTAG boundary-scan testing?

Yes, XC6SLX45-3FG484C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. All 186 user I/Os support INTEST and EXTEST instructions, and the TDO pin is dedicated for scan-out. JTAG is active during and after configuration, enabling in-system verification without halting operation.

Can XC6SLX45-3FG484C be configured using a microcontroller?

Yes, XC6SLX45-3FG484C supports master serial (SPI) configuration mode, allowing an external microcontroller to load the bitstream from attached flash memory. The microcontroller controls PROGRAM_B and monitors INIT_B/DONE to manage configuration sequencing. No additional level-shifting is required if both devices share compatible I/O voltages.

What I/O standards are supported by XC6SLX45-3FG484C?

XC6SLX45-3FG484C supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, and SSTL (I and II) standards across its 10 I/O banks. Each bank is independently configurable for voltage and standard, but all pins in a bank must use the same VCCO. Differential standards require adjacent pin pairing and proper termination.

Is XC6SLX45-3FG484C qualified for automotive applications?

No, XC6SLX45-3FG484C is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. It is rated for commercial (0°C to +85°C) and industrial (-40°C to +100°C) temperature ranges. For automotive use, AMD offers the Spartan-6Q family with extended temperature and qualification support-XC6SLX45-3FG484C does not meet those requirements.

XC6SLX45-3FG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3411
Number of Logic Elements/Cells:
43661
Total RAM Bits:
2138112
Number of I/O:
316
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX45-3FG484C FAQ

1.How can I place an order for XC6SLX45-3FG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX45-3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX45-3FG484C reliable?

The price and inventory of XC6SLX45-3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3FG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX45-3FG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3FG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX45-3FG484C?

XC6SLX45-3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX45-3FG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX45-3FG484C?

For technical support, including XC6SLX45-3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3FG484C requirements.

6.How does Aetrix verify that XC6SLX45-3FG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX45-3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3FG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX45-3FG484C?

All XC6SLX45-3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3FG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX45-3FG484C part is unused and in its original packaging.

Return procedure for XC6SLX45-3FG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX45-3FG484C Tags

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