AMD XC6SLX45-3FG484C
- Part No.:
- XC6SLX45-3FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-3FG484C.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,692
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX45-3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2,183 Kbits of block RAM, and 186 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade (fastest in Spartan-6 family) and supports 1.2 V core voltage for low-power embedded control and industrial interface applications.
For engineers reviewing the XC6SLX45-3FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, block RAM depth for buffering, and compatibility with Spartan-6 design tools and configuration interfaces.
Technical Context
The XC6SLX45-3FG484C implements a fully programmable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dedicated clock management tiles with DCMs (Digital Clock Managers) for frequency synthesis and phase alignment.
Configuration is performed via Master SPI or JTAG, with support for fallback dual-image bitstreams. The device integrates SelectIO™ technology enabling LVCMOS, LVDS, and SSTL I/O standards across its 186 user pins, with programmable drive strength and slew rate control per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2,183 Kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 186 - supports high-density peripheral interfacing with bank-wise voltage and standard flexibility |
| Speed Grade | -3 - guarantees worst-case timing performance at highest operating frequency in Spartan-6 family |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic/static power consumption |
| Package | 484-pin FBGA (F/G suffix) - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant, requires reflow assembly |
Pinout & Package
XC6SLX45-3FG484C uses a 484-ball fine-pitch BGA (package code FG484) with 186 user-configurable I/Os distributed across 10 I/O banks. Power and ground balls are allocated per bank to minimize noise coupling; configuration pins (e.g., INIT_B, PROGRAM_B, DONE) and dedicated clock inputs (e.g., CLKIN_0, CLKIN_1) are fixed-function and non-reconfigurable.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low triggers full reconfiguration from external SPI flash or host processor |
| INIT_B | Open-Drain Status Output | Indicates configuration memory clearing status; pulled high during normal operation |
| DONE | Open-Drain Configuration Completion | Drives high when bitstream loading and startup sequence complete successfully |
| CLKIN_0 / CLKIN_1 | Dedicated Single-Ended Clock Inputs | Feed DCMs for internal clock generation; require 0–350 MHz input range and proper termination |
| VCCO_0–VCCO_9 | I/O Bank Supply Voltages | Set output voltage level and compatible I/O standards per bank (e.g., 3.3 V, 2.5 V, 1.8 V) |
Key Features
| Feature | Design Value |
|---|---|
| DCM-based clock management | Enables precise clock multiplication, division, phase shifting, and jitter reduction without external PLL ICs |
| SelectIO™ technology | Allows mixed-voltage I/O operation across banks, supporting legacy and modern interface standards simultaneously |
| DSP48A1 slices | Delivers deterministic 18×18-bit signed multiplication with 48-bit accumulator for real-time filtering or motor control |
| Embedded Block RAM | Provides true dual-port RAM with independent read/write clocks per block, usable as FIFO or buffer memory |
| MultiBoot configuration | Supports up to two independent bitstreams stored in SPI flash, enabling field-upgradable firmware with fallback safety |
Applications
| Industrial PLC I/O Module | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time acquisition and preprocessing of analog sensor data from multiple channels in programmable logic controllers. IC Role / Device Role / Timing Role: FPGA acts as parallel I/O aggregator and protocol translator between fieldbus (e.g., Profibus) and ARM-based controller. Use Value: 186 user I/Os enable direct connection to 32+ digital inputs/outputs and 8+ analog front-end interfaces without glue logic. | Use Scenario: High-speed pixel data routing and synchronization between image sensors and processing SoCs in ultrasound or endoscopy systems. IC Role / Device Role / Timing Role: FPGA serves as a timing-critical bridge handling LVDS camera links and DDR2 memory buffering. Use Value: DCMs ensure sub-nanosecond skew control across 12+ LVDS pairs, meeting MIPI CSI-2 timing constraints. |
| Avionics Data Concentrator | Test & Measurement Pattern Generator |
Use Scenario: Consolidating ARINC 429, discrete I/O, and MIL-STD-1553B signals into a unified Ethernet backbone in flight control systems. IC Role / Device Role / Timing Role: FPGA implements protocol-specific state machines and time-stamped packetization logic. Use Value: -3 speed grade ensures deterministic <12 ns propagation delay for critical bus arbitration logic. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for semiconductor ATE systems. IC Role / Device Role / Timing Role: FPGA functions as a high-resolution pattern sequencer with precise edge placement. Use Value: Embedded block RAM stores >1 Mbit of test vectors; DSP48A1 enables real-time waveform modulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2FG484C | Slower -2 speed grade; ~15% lower max clock frequency in timing-critical paths | Suitable for cost-sensitive designs where full -3 timing margin is not required | Select when system-level timing slack allows relaxed setup/hold margins and lower power consumption is prioritized |
| XC6SLX75-3FG484C | Higher logic density (74,637 LUTs), +30% block RAM, same package footprint and pinout | Used when additional logic resources or larger on-chip memory buffers are needed for expanded functionality | Choose for scalable designs requiring headroom for future feature upgrades without PCB revision |
Compared with XC6SLX45-3FG484C, the -2 variant trades speed for lower static power and cost, while the XC6SLX75-3FG484C offers pin-compatible scalability-both retain identical I/O banking structure and configuration interface, enabling reuse of board layout and firmware infrastructure.
Availability
XC6SLX45-3FG484C is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX45-3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.
The Spartan-6 family, including XC6SLX45-3FG484C, was designed for cost-sensitive, power-efficient logic integration in industrial control, video surveillance, and communications infrastructure.
FAQ
What is the maximum operating frequency supported by XC6SLX45-3FG484C?
The XC6SLX45-3FG484C supports a maximum system clock frequency of 750 MHz for internal logic paths under worst-case conditions, as guaranteed by its -3 speed grade. This applies to critical timing paths routed through LUTs and registers; actual achievable frequency depends on design complexity, placement, and routing. The DCMs support input frequencies up to 350 MHz and can generate higher-frequency clocks internally.
Does XC6SLX45-3FG484C support JTAG boundary-scan testing?
Yes, XC6SLX45-3FG484C includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. All 186 user I/Os support INTEST and EXTEST instructions, and the TDO pin is dedicated for scan-out. JTAG is active during and after configuration, enabling in-system verification without halting operation.
Can XC6SLX45-3FG484C be configured using a microcontroller?
Yes, XC6SLX45-3FG484C supports master serial (SPI) configuration mode, allowing an external microcontroller to load the bitstream from attached flash memory. The microcontroller controls PROGRAM_B and monitors INIT_B/DONE to manage configuration sequencing. No additional level-shifting is required if both devices share compatible I/O voltages.
What I/O standards are supported by XC6SLX45-3FG484C?
XC6SLX45-3FG484C supports LVCMOS (1.2 V to 3.3 V), LVDS, Mini-LVDS, RSDS, BLVDS, and SSTL (I and II) standards across its 10 I/O banks. Each bank is independently configurable for voltage and standard, but all pins in a bank must use the same VCCO. Differential standards require adjacent pin pairing and proper termination.
Is XC6SLX45-3FG484C qualified for automotive applications?
No, XC6SLX45-3FG484C is not AEC-Q100 qualified and is not recommended for automotive safety-critical systems. It is rated for commercial (0°C to +85°C) and industrial (-40°C to +100°C) temperature ranges. For automotive use, AMD offers the Spartan-6Q family with extended temperature and qualification support-XC6SLX45-3FG484C does not meet those requirements.
XC6SLX45-3FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-3FG484C FAQ
1.How can I place an order for XC6SLX45-3FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-3FG484C reliable?
The price and inventory of XC6SLX45-3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45-3FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-3FG484C?
XC6SLX45-3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-3FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-3FG484C?
For technical support, including XC6SLX45-3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3FG484C requirements.
6.How does Aetrix verify that XC6SLX45-3FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45-3FG484C?
All XC6SLX45-3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-3FG484C part is unused and in its original packaging.
Return procedure for XC6SLX45-3FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX45-3FG484C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

