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AMD XC6SLX45-3FGG484C
- Part No.:
- XC6SLX45-3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-3FGG484C.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,533
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Product details
Overview
XC6SLX45-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2,184 Kbits of block RAM, and operates at -3 speed grade (1.2 V core, industrial temperature range). It integrates dual 18×18 multipliers, DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards for embedded control and interface bridging in industrial automation systems.
For engineers reviewing the XC6SLX45-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded memory capacity, and support for high-speed differential signaling in resource-constrained programmable logic designs.
Technical Context
The XC6SLX45-3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes 58 DSP48A1 slices supporting 18×18 signed multiplication and accumulation, and 220 user I/O pins with programmable drive strength and slew rate control.
Configuration is performed via Master SPI or JTAG, with support for fallback configuration and bitstream encryption using AES-256. The device uses SelectIO technology to support single-ended and differential standards including LVDS (3.125 Gbps), SSTL-2, and HSTL-I across multiple banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2,184 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| DSP Slices | 58 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 220 - supports parallel interfaces, sensor buses, and multi-protocol connectivity with bank-wise voltage assignment |
| Speed Grade | -3 - guarantees timing closure at 1.2 V core supply and industrial temperature (-40°C to +100°C) |
| I/O Standards | LVDS, SSTL-2, HSTL-I, LVCMOS - allows direct interfacing with ADCs, FPGAs, microprocessors, and memory devices |
Pinout & Package
XC6SLX45-3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 220 user-configurable I/O terminals distributed across 10 I/O banks. Thermal pad design supports conduction cooling in enclosed industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCO | Power supply reference per I/O bank | Enables mixed-voltage operation: each bank independently set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V |
| CCLK / DONE / INIT_B | Configuration control signals | Supports Master SPI mode startup; DONE indicates successful bitstream loading; INIT_B signals configuration error |
| IO_Lx_y | Configurable bidirectional I/O | Programmable as input, output, or bidirectional with selectable termination, drive strength, and slew rate |
| M0–M2 | Mode select pins | Determine configuration source (JTAG, Master SPI, Slave SelectMAP) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Block RAM | 2,184 Kbits distributed across 112 BRAM blocks - eliminates need for external memory in data buffering applications |
| DSP48A1 Slices | 58 dedicated arithmetic units - accelerates filtering, correlation, and motor control algorithms without CPU overhead |
| SelectIO Technology | Per-bank I/O voltage and standard selection - simplifies integration with heterogeneous peripheral voltage domains |
| AES-256 Bitstream Encryption | Hardware-accelerated encryption engine - protects intellectual property against reverse engineering and cloning |
| Fallback Configuration | Dual-bitstream support with automatic failover - ensures system continuity after corrupted configuration load |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (PROFIBUS, CANopen) and controller backplane. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom state machines, serial-to-parallel conversion, and timing-critical interrupt handling. Use Value: Enables deterministic sub-microsecond response latency and supports hot-swap detection via programmable I/O banks. | Use Scenario: Converting MIPI CSI-2 camera streams to parallel RGB or BT.656 video for FPGA-based vision processors. IC Role / Device Role / Timing Role: Deserialization, clock domain crossing, and pixel reformatting using dedicated I/O and logic resources. Use Value: Leverages LVDS-capable I/O banks and internal BRAM for frame buffering without external memory. |
| Motor Control Encoder Interface | Communications Backplane Adapter |
Use Scenario: High-resolution quadrature decoding and commutation timing for servo drives operating at >20 kHz PWM frequency. IC Role / Device Role / Timing Role: Dedicated counter logic, phase interpolation, and real-time fault monitoring implemented in LUTs and registers. Use Value: Achieves 16-bit encoder resolution with <10 ns jitter using carry chain and synchronous logic paths. | Use Scenario: Protocol adaptation between PCIe host interface and legacy parallel bus peripherals in test equipment chassis. IC Role / Device Role / Timing Role: Glue logic for address decoding, burst arbitration, and handshaking signal generation. Use Value: Reduces ASIC development cost while maintaining 100+ MHz synchronous bus timing margins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2FGG484C | Slower -2 speed grade; lower maximum clock frequency and higher timing margin requirements | Suitable for less timing-critical control logic where thermal headroom is constrained | Select when system clocking budget allows relaxed setup/hold times and reduced power consumption is prioritized |
| XC6SLX75-3FGG484C | Higher-density variant with 74,637 logic cells and 3,328 Kbits block RAM | Required for designs needing larger state machines, more embedded memory, or additional DSP slices | Choose when XC6SLX45-3FGG484C logic or memory resources are insufficient for full functionality |
Compared with XC6SLX45-2FGG484C, the XC6SLX45-3FGG484C delivers tighter timing closure at higher frequencies but consumes more dynamic power; compared with XC6SLX75-3FGG484C, it offers identical speed grade and package compatibility while reducing cost and footprint for mid-complexity designs.
Availability
XC6SLX45-3FGG484C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and motor control applications requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX45-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable performance in industrial and automotive environments.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45-3FGG484C?
The XC6SLX45-3FGG484C supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration for SSTL-2 (1.8 V), HSTL-I (1.5 V), LVCMOS (1.2/1.5/1.8/2.5/3.3 V), and LVDS (2.5 V common-mode). Each of the 10 I/O banks can be independently assigned a VCCO voltage, enabling mixed-voltage system interfacing without level shifters.
Does XC6SLX45-3FGG484C support JTAG boundary scan testing?
Yes, XC6SLX45-3FGG484C fully supports IEEE 1149.1 JTAG boundary scan for PCB-level interconnect testing and in-system programming. The TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and device-specific instructions (ISC_ENABLE, ISC_PROGRAM, ISC_NOOP) for configuration and diagnostics during manufacturing and field service.
How many configuration modes does XC6SLX45-3FGG484C support?
XC6SLX45-3FGG484C supports three primary configuration modes: Master SPI (internal oscillator drives serial flash), Slave SelectMAP (external controller writes bitstream), and JTAG (debug and programming via boundary scan). Mode selection is controlled by M0–M2 pins at power-up, and fallback configuration is enabled when dual bitstreams are stored in external flash.
What is the operating temperature range for XC6SLX45-3FGG484C?
The XC6SLX45-3FGG484C is rated for industrial temperature operation from –40°C to +100°C ambient. This rating applies to the -3 speed grade and is validated under specified core voltage (1.14–1.26 V) and I/O voltage conditions. Thermal derating is not required within this range when mounted per Xilinx UG381 PCB layout guidelines.
Can XC6SLX45-3FGG484C implement PCI Express endpoints?
No, XC6SLX45-3FGG484C does not include hard PCIe blocks or certified PHY layers. While basic parallel bus interfaces can be implemented in logic fabric, it lacks native PCIe Gen1 x1 endpoint capability. For PCIe connectivity, Xilinx recommends Spartan-6 LX150 or later families such as Artix-7 with integrated PCIe blocks.
XC6SLX45-3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-3FGG484C FAQ
1.How can I place an order for XC6SLX45-3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-3FGG484C reliable?
The price and inventory of XC6SLX45-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45-3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-3FGG484C?
XC6SLX45-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-3FGG484C?
For technical support, including XC6SLX45-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3FGG484C requirements.
6.How does Aetrix verify that XC6SLX45-3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45-3FGG484C?
All XC6SLX45-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX45-3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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