AMD XC6SLX45-3FGG676C

Overview

XC6SLX45-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2,184 Kbits of block RAM, 180 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and used in industrial control logic, video interface bridging, and embedded vision preprocessing.

For engineers reviewing the XC6SLX45-3FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), LVDS support, SelectIO™ standards compatibility, and availability of dedicated clock management resources including DCMs and PLLs.

Technical Context

The XC6SLX45-3FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with integrated block RAM (up to 36 Kbits per block) and distributed RAM. It includes dual-clock domain management via two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL), supporting frequency synthesis and jitter reduction.

It supports SelectIO™ standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, Mini-LVDS, RSDS, and BLVDS. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces.

Key Specifications

Pinout & Package

XC6SLX45-3FGG676C is packaged in a 676-ball Fine-Pitch Ball Grid Array (FGG676) with 27×27 array, 1.0 mm ball pitch, and thermal pad. Pin functions are defined per bank-based I/O standards and dedicated configuration/clock/power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.

Compared with XC6SLX45-3FGG676C, the -2 variant trades performance for cost while maintaining identical pinout and configuration, whereas the XC6SLX75-3FGG676C offers scalable logic capacity within the same FGG676 package-enabling upgrade paths without PCB redesign.

Availability

XC6SLX45-3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and avionics data acquisition requiring stable component supply across long product lifecycles.

Supply support for XC6SLX45-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial, automotive, and video infrastructure markets.

FAQ

What is the operating temperature range for XC6SLX45-3FGG676C?

The XC6SLX45-3FGG676C is rated for commercial temperature range (0°C to +85°C). Its FGG676 package and -3 speed grade support stable operation within this range under specified voltage and loading conditions. Thermal management must account for power dissipation across VCCINT, VCCAUX, and VCCO rails during peak logic utilization. The XC6SLX45-3FGG676C does not support industrial or extended temperature grades.

Does XC6SLX45-3FGG676C support JTAG boundary-scan testing?

Yes, XC6SLX45-3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TCK, TMS, and TRST pins are dedicated and mapped to specific balls in the FGG676 package. This capability enables verification of solder joints and signal integrity prior to configuration. The XC6SLX45-3FGG676C implements standard JTAG instruction register and boundary-scan register architecture.

Can XC6SLX45-3FGG676C configure from a serial NOR flash device?

Yes, XC6SLX45-3FGG676C supports Master Serial configuration mode using standard SPI-based serial NOR flash devices. Configuration bitstream is loaded automatically on power-up when MODE pins are set to 001. The XC6SLX45-3FGG676C drives the flash clock and reads data synchronously, supporting densities up to 128 Mbits. External pull-ups on INIT_B and CCLK are required for reliable boot.

How many clock regions does XC6SLX45-3FGG676C have?

The XC6SLX45-3FGG676C contains four independent clock regions, each served by dedicated global clock buffers and routing networks. This allows concurrent use of multiple asynchronous clock domains-for example, one for video pixel clock, another for system control, and two for ADC/DAC sampling clocks. Each region supports local clock enables and phase shifting via its associated DCM or PLL. The XC6SLX45-3FGG676C's clock region architecture ensures low-skew distribution within each domain.

Is XC6SLX45-3FGG676C compatible with Vivado Design Suite?

No, XC6SLX45-3FGG676C is supported exclusively by Xilinx ISE Design Suite 14.7 and earlier versions. Vivado does not support Spartan-6 architecture. Users must use ISE for synthesis, implementation, and bitstream generation. The XC6SLX45-3FGG676C requires ISE WebPACK or licensed version with Spartan-6 device support enabled. Migration to newer AMD tools is not possible without architectural redesign.