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AMD XC6SLX45-3FGG676I
- Part No.:
- XC6SLX45-3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX45-3FGG676I.pdf
- Description:
- IC FPGA 358 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,164
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Product details
Overview
XC6SLX45-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 186 DSP48A1 slices, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 3.3 V I/O support. It targets mid-range embedded control, industrial communication gateways, and video interface bridging applications.
For engineers reviewing the XC6SLX45-3FGG676I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), speed grade (-3), extended industrial temperature range (-40°C to +100°C), and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX45-3FGG676I implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O interfaces including LVDS, SSTL, HSTL, and PCI Express Gen1 endpoints. Its configuration memory is loaded via SPI or JTAG, supporting dual-boot and fallback modes.
It integrates 12 clock management tiles (CMTs), each containing a DCM and PLL, enabling precise clock synthesis, phase alignment, and jitter reduction across multiple synchronous domains. The device supports partial reconfiguration and bitstream encryption for secure deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total configurable logic resources for implementing state machines, data paths, and glue logic |
| Block RAM | 2.1 Mb - distributed as 180 × 18 Kb blocks for FIFOs, buffers, or lookup tables |
| DSP Slices | 186 × DSP48A1 - fixed-point multiply-accumulate units for filtering, FFT, and motor control |
| User I/O Pins | 480 - configurable as single-ended or differential standards (LVDS, SSTL-2, HSTL-I) |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, enabling 600 MHz system clocks |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FGG676 - 27×27 mm fine-pitch FBGA with 1.0 mm ball pitch and thermal pad |
Pinout & Package
XC6SLX45-3FGG676I is housed in a 676-ball FGG package with exposed thermal pad. Pin functions are defined by configuration mode (Master/Slave SelectMAP, JTAG) and bank voltage settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply (1.2–3.3 V selectable per bank) |
| P2 | IO_L1P_T0_0 | Differential pair positive input for bank 0, supports LVDS/SSTL |
| R1 | M0 | Configuration mode select (Master Serial mode when pulled High) |
| T1 | PROGRAM_B | Active-Low asynchronous reset initiating configuration reload |
| Y2 | CCLK | Configuration clock output during Master Serial mode |
| W1 | DONE | Open-drain status signal indicating successful configuration completion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Hard-wired DDR2/DDR3 controller supporting up to 400 MHz data rates with calibration logic |
| PCIe Endpoint Logic | Embedded Gen1 x1 endpoint block compliant with PCIe Base Spec 1.1, no external PHY required |
| Bitstream Encryption | AES-256 decryption engine protecting configuration bitstream against cloning or reverse engineering |
| Partial Reconfiguration | Dynamic replacement of logic modules without resetting the entire device or halting operation |
| Low-Power Architecture | Multiple power gating domains and sleep mode reducing static power to <10 mW in standby |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation (Modbus TCP ↔ CANopen) in compact PLC chassis. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic controller and protocol gateway with sub-1 µs I/O response latency. Use Value: Enables 480 user I/Os and integrated DDR2 controller to buffer fieldbus data without external memory. | Use Scenario: Converting HDMI 1.4a video streams to MIPI D-PHY for embedded display subsystems. IC Role / Device Role / Timing Role: Timing-critical pixel data retiming and format conversion using dedicated I/O banks and DSP slices. Use Value: Leverages 186 DSP48A1 slices for real-time color space conversion and LVDS transceivers for panel interface. |
| Medical Imaging Front-End | Avionics Data Concentrator |
Use Scenario: Acquiring and preprocessing ultrasound echo signals before transmission to host processor. IC Role / Device Role / Timing Role: High-speed ADC interface and beamforming logic implemented in deterministic LUT fabric. Use Value: 43,661 logic cells support parallel FIR filter chains; -40°C to +100°C rating ensures reliability in sterilized enclosures. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete sensor inputs in flight control computers. IC Role / Device Role / Timing Role: Synchronized multi-protocol interface hub with deterministic timing and error detection logic. Use Value: Integrated CMTs provide independent clock domains for each bus standard; AES encryption secures configuration integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2FGG676I | Lower speed grade (-2), 15% reduced maximum clock frequency and I/O toggle rate | Suitable for cost-sensitive designs where timing margin is relaxed | Select when target system operates below 500 MHz and thermal budget is constrained |
| XC6SLX75-3FGG676I | Higher logic density (74,637 LUTs), same package and pinout, +71% logic capacity | Required for larger state machines or multi-channel protocols exceeding XC6SLX45 capacity | Choose when design requires >43K LUTs but must retain identical PCB layout and thermal profile |
Compared with XC6SLX45-2FGG676I, the XC6SLX45-3FGG676I delivers higher timing closure margin for high-speed I/O and complex control loops; versus XC6SLX75-3FGG676I, it offers lower static power and reduced toolchain resource requirements while meeting mid-complexity system needs.
Availability
XC6SLX45-3FGG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging front-ends, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX45-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, low-power, high-volume applications requiring reliable I/O interfacing and moderate logic density - especially in industrial and automotive subsystems.
FAQ
What is the maximum operating junction temperature for XC6SLX45-3FGG676I?
The XC6SLX45-3FGG676I has a maximum junction temperature of +125°C and is rated for extended industrial operation from –40°C to +100°C ambient. Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation, verified using Xilinx XPE power estimator and thermal simulation tools specific to the FGG676 package.
Does XC6SLX45-3FGG676I support JTAG boundary-scan testing?
Yes, XC6SLX45-3FGG676I fully supports IEEE 1149.1 (JTAG) boundary-scan testing via dedicated TDI, TDO, TMS, and TCK pins. The device implements mandatory boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, INTEST) and supports BSDL files for test vector generation in commercial ATE systems.
Can XC6SLX45-3FGG676I be configured using SPI flash memory?
Yes, XC6SLX45-3FGG676I supports Master SPI configuration mode, allowing boot from industry-standard serial NOR flash devices (e.g., Micron, Winbond, Spansion). Configuration occurs automatically on power-up when M[2:0] pins are set to 001, with CCLK generated internally at up to 50 MHz.
Is XC6SLX45-3FGG676I compatible with Vivado Design Suite?
No, XC6SLX45-3FGG676I is supported exclusively by Xilinx ISE Design Suite v14.7 and earlier. Vivado does not support Spartan-6 architecture; attempting to synthesize or implement for XC6SLX45-3FGG676I in Vivado will result in tool incompatibility and failure to generate valid bitstreams.
What I/O standards are supported by XC6SLX45-3FGG676I banks?
XC6SLX45-3FGG676I supports LVCMOS, LVTTL, PCI, SSTL, HSTL, and LVDS across its 12 I/O banks. Each bank operates at a single VCCO voltage (1.2 V to 3.3 V), and differential standards require adjacent pin pairing per bank specification. Bank 0 supports all standards; others exclude PCI or LVDS depending on physical location.
XC6SLX45-3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 358
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX45-3FGG676I FAQ
1.How can I place an order for XC6SLX45-3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-3FGG676I reliable?
The price and inventory of XC6SLX45-3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-3FGG676I?
XC6SLX45-3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-3FGG676I?
For technical support, including XC6SLX45-3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-3FGG676I requirements.
6.How does Aetrix verify that XC6SLX45-3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-3FGG676I?
All XC6SLX45-3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX45-3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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