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AMD XC6SLX45-L1CSG324C

Part No.:
XC6SLX45-L1CSG324C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
324-LFBGA, CSPBGA
Datasheet:
AetrixXC6SLX45-L1CSG324C.pdf
Description:
IC FPGA 218 I/O 324CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,739

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Product details

Overview

XC6SLX45-L1CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, 186 DSP48A1 slices, and operates at -1 speed grade (1.2 V core, industrial temperature range). It is used in industrial control logic, video interface bridging, and embedded vision preprocessing.

For engineers reviewing the XC6SLX45-L1CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (204 user I/Os), LVDS support, SelectIO™ voltage flexibility (1.2–3.3 V), and integrated clock management (DCM + PLL).

Technical Context

The XC6SLX45-L1CSG324C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O and internal clock networks. It integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and jitter reduction.

It supports multiple I/O standards including LVCMOS, LVTTL, PCI, SSTL, HSTL, and differential standards such as LVDS, RSDS, and BLVDS. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells43,661 - total available LUT+FF pairs for combinational and sequential logic implementation
Block RAM2.1 Mb - distributed across 116 BRAM blocks (18 Kb each), supporting true dual-port operation
DSP Slices186 DSP48A1 - fixed-point multiply-accumulate units with 25×18-bit multipliers and 48-bit accumulators
User I/O Pins204 - configurable single-ended and differential I/Os with programmable drive strength and slew rate
Speed Grade-1 - guarantees timing performance at 1.2 V core supply and industrial temperature (-40°C to +100°C)
Configuration ModeMaster SPI / Slave Serial / JTAG - supports in-system programming and field updates without external processor

Pinout & Package

XC6SLX45-L1CSG324C is housed in a 324-pin CSG (Chip-Scale Grid Array) package with 204 user I/Os, 10 dedicated configuration pins, 8 global clock inputs, and power/ground distribution optimized for low-noise operation.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK7Global Clock InputDedicated low-skew routing to all clock-capable resources; supports DCM/PLL input
M0–M2Configuration Mode SelectSet boot mode (SPI, serial, or JTAG) at power-up; sampled during INIT_B assertion
CCLKConfiguration ClockDrives internal configuration logic; can be internally generated or externally supplied
DIN / DOUTSerial Configuration DataMaster SPI mode: DIN receives bitstream; DOUT outputs status or readback data
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and restarts boot sequence

Key Features

FeatureDesign Value
Integrated DCM + PLLEnables precise clock synthesis, frequency multiplication (up to 320 MHz), and phase alignment without external components
SelectIO™ TechnologySupports mixed-voltage I/O banks (1.2 V to 3.3 V) with independent VCCO per bank and programmable termination
PCI ComplianceFully compliant with 32-bit, 33 MHz PCI and PCI-X 1.0 specifications for plug-in card designs
Embedded Memory2.1 Mb block RAM + distributed RAM enables large FIFOs, frame buffers, and lookup tables without external memory
ISE Design Suite SupportFull toolchain compatibility with Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation

Applications

Industrial Motion ControlVideo Interface Bridging

Use Scenario: Real-time servo loop execution and encoder signal decoding in CNC machines and robotic arms.

IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines and time-critical PWM generation with sub-microsecond latency.

Use Value: 204 user I/Os enable direct connection to multiple encoders, analog inputs, and motor drivers; DCM ensures synchronized sampling clocks.

Use Scenario: Converting between HDMI 1.4 and LVDS display interfaces in medical imaging panels and digital signage.

IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion, and embedded sync stripping/reinsertion logic.

Use Value: LVDS I/O support and 186 DSP48A1 slices accelerate real-time video scaling and gamma correction without external processors.

Embedded Vision PreprocessingCommunications Protocol Gateway

Use Scenario: On-camera image filtering, edge detection, and Bayer demosaicing before transmission over GigE Vision or USB3 Vision.

IC Role / Device Role / Timing Role: Configurable logic executes parallel pixel pipelines; block RAM stores line buffers for 2D convolution kernels.

Use Value: 2.1 Mb block RAM supports up to 1920×1080@60fps line buffering; DSP slices accelerate Sobel operators at hardware speed.

Use Scenario: Translating Modbus RTU over RS-485 to TCP/IP for legacy industrial equipment integration into IIoT platforms.

IC Role / Device Role / Timing Role: Implements UART-to-Ethernet bridge logic with TCP stack offload and packet buffering.

Use Value: Dual 10/100 Ethernet MACs (via soft IP) and 204 I/Os allow concurrent RS-485, CAN, and Ethernet PHY interfacing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX45-2CSG324CHigher speed grade (-2) supports 125 MHz system clock vs. 100 MHz for -1 grade; requires tighter timing closureBetter suited for higher-frequency video pixel processing or faster control loopsSelect when design requires >100 MHz clock domains and timing margin is critical
XC6SLX25-L1CSG324CLower logic capacity (24,051 LUTs), reduced block RAM (1.8 Mb), and fewer DSP slices (118)Targeted at cost-sensitive, lower-complexity bridging or control tasksChoose when full XC6SLX45 resources are unused and BOM cost optimization is prioritized

Compared with XC6SLX45-2CSG324C, the XC6SLX45-L1CSG324C trades maximum clock frequency for relaxed timing constraints and lower power; compared with XC6SLX25-L1CSG324C, it delivers 81% more logic and 17% more RAM for scalable vision or protocol stack implementations.

Availability

XC6SLX45-L1CSG324C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and embedded vision preprocessing requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX45-L1CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family under the AMD Adaptive SoC portfolio.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation, video, and embedded systems.

FAQ

What is the operating temperature range for XC6SLX45-L1CSG324C?

The XC6SLX45-L1CSG324C is rated for industrial temperature operation from –40°C to +100°C. This range is guaranteed under the -1 speed grade specification and applies to all user I/Os, configuration interfaces, and internal logic resources. The device uses thermal monitoring circuitry to support safe operation in enclosed or convection-cooled environments. XC6SLX45-L1CSG324C must be operated within this range to meet timing and reliability specifications.

Does XC6SLX45-L1CSG324C support JTAG boundary-scan testing?

Yes, XC6SLX45-L1CSG324C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. TDI, TDO, TMS, TCK, and TCK are assigned to dedicated pins and function independently of user I/O banks. XC6SLX45-L1CSG324C also allows JTAG access to configuration memory for readback and verification. This capability is active across all supported configuration modes.

Can XC6SLX45-L1CSG324C implement a PCIe endpoint interface?

No, XC6SLX45-L1CSG324C does not include native PCIe hard IP blocks. While soft-core PCIe solutions exist in the Xilinx IP catalog, they require significant logic resources and do not achieve Gen1 x1 compliance without external PHY. XC6SLX45-L1CSG324C lacks the transceivers and dedicated PCIe endpoints found in later families like Artix-7 or Kintex-7. For PCIe connectivity, a different FPGA family is required.

What configuration memory options are compatible with XC6SLX45-L1CSG324C?

XC6SLX45-L1CSG324C supports standard SPI serial flash devices including Micron, Spansion, and Macronix parts with densities from 2 MB to 16 MB. It is validated with Xilinx-approved PROMs such as the XCFxx series. Configuration bitstream compression reduces effective storage requirements by ~30%. XC6SLX45-L1CSG324C reads configuration data in 32-bit words and supports dual-boot via M[2:0] pin settings.

Is XC6SLX45-L1CSG324C RoHS compliant and lead-free?

Yes, XC6SLX45-L1CSG324C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The CSG324 package uses matte tin finish on all solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available through AMD's Product Change Notification (PCN) system for XC6SLX45-L1CSG324C.

XC6SLX45-L1CSG324C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
324-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3411
Number of Logic Elements/Cells:
43661
Total RAM Bits:
2138112
Number of I/O:
218
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
324-CSPBGA (15x15)

XC6SLX45-L1CSG324C FAQ

1.How can I place an order for XC6SLX45-L1CSG324C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX45-L1CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX45-L1CSG324C reliable?

The price and inventory of XC6SLX45-L1CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-L1CSG324C is usually 5 days.

3.What payment methods are accepted for XC6SLX45-L1CSG324C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-L1CSG324C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX45-L1CSG324C?

XC6SLX45-L1CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX45-L1CSG324C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX45-L1CSG324C?

For technical support, including XC6SLX45-L1CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-L1CSG324C requirements.

6.How does Aetrix verify that XC6SLX45-L1CSG324C is sourced from the original manufacturer or authorized distributors?

All XC6SLX45-L1CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-L1CSG324C meets industry standards.

7.What is the process for return or replacement of XC6SLX45-L1CSG324C?

All XC6SLX45-L1CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-L1CSG324C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX45-L1CSG324C part is unused and in its original packaging.

Return procedure for XC6SLX45-L1CSG324C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX45-L1CSG324C Tags

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