AMD XC6SLX45-L1FGG484I

Overview

XC6SLX45-L1FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 216 DSP48A1 slices, configured in a 484-pin Fine-Pitch BGA (FGG) package with -1 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for embedded control, interface bridging, and real-time signal processing in industrial automation systems.

For engineers reviewing the XC6SLX45-L1FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, integrated clock management (DCM and PLL), and compliance with JESD78 Class II latch-up immunity.

Technical Context

The XC6SLX45-L1FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and duty-cycle correction across multiple output clocks.

It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS, Mini-LVDS, and RSDS, with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω).

Key Specifications

Pinout & Package

XC6SLX45-L1FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 array, 1.0 mm ball pitch, and thermal pad. Pinout follows Xilinx DS162 specification: balls are organized into 12 I/O banks (Bank 0–11), each supporting independent VCCO and VREF voltages, plus dedicated configuration, clock, and JTAG pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Compared with XC6SLX45-L1FGG484I, the -2C variant trades temperature range for timing headroom, while the LX75-I offers scalable logic density and I/O within the same industrial qualification envelope-enabling migration paths without redesigning thermal or environmental validation.

Availability

XC6SLX45-L1FGG484I is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and automotive ADAS subsystems requiring stable component supply over extended product lifecycles.

Supply support for XC6SLX45-L1FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-6 family, including XC6SLX45-L1FGG484I, was designed for cost-sensitive, high-volume applications demanding low-power reconfigurable logic, embedded processing, and flexible I/O interfacing in industrial and automotive systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX45-L1FGG484I?

XC6SLX45-L1FGG484I supports I/O bank voltages from 1.2 V to 3.3 V, with each of the 12 I/O banks independently configurable. Bank-specific VCCO and VREF settings allow mixed-voltage operation-for example, interfacing with both 1.8 V sensors and 3.3 V legacy peripherals simultaneously using XC6SLX45-L1FGG484I's SelectIO architecture.

Does XC6SLX45-L1FGG484I include built-in configuration memory?

No, XC6SLX45-L1FGG484I is SRAM-based and requires external non-volatile configuration memory (e.g., SPI Flash) for automatic boot. Configuration occurs via Master Serial, Slave SelectMAP, or JTAG modes. The XC6SLX45-L1FGG484I itself retains no persistent state after power loss.

Can XC6SLX45-L1FGG484I implement a PCIe endpoint interface?

No, XC6SLX45-L1FGG484I does not include hard PCIe blocks. While soft-core PCIe implementations exist, they consume significant logic resources and lack guaranteed compliance. For native PCIe Gen1 x1 support, Xilinx recommends Spartan-6 LX100 or Virtex-6 families-not XC6SLX45-L1FGG484I.

What thermal pad requirements apply to XC6SLX45-L1FGG484I's FGG484 package?

The XC6SLX45-L1FGG484I FGG484 package includes an exposed thermal pad on the underside. Per Xilinx UG380, it must be soldered to a solid copper thermal plane on PCB Layer 2 or 3, with ≥60% solder coverage and thermal vias (≥12×0.3 mm diameter) connecting to internal ground planes to maintain junction temperature ≤100°C under full static load.

Is XC6SLX45-L1FGG484I compatible with Vivado Design Suite?

No, XC6SLX45-L1FGG484I is supported exclusively by Xilinx ISE Design Suite v14.7 (final release). Vivado does not support Spartan-6 devices. Users must use ISE for synthesis, place-and-route, and bitstream generation for XC6SLX45-L1FGG484I-no migration path exists to Vivado.