AMD XC6SLX45-N3CSG324C
- Part No.:
- XC6SLX45-N3CSG324C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC6SLX45-N3CSG324C.pdf
- Description:
- IC FPGA 218 I/O 324CSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:126
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Product details
Overview
XC6SLX45-N3CSG324C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, and 186 DSP48A1 slices, configured in a 324-pin CSBGA package with -3 speed grade and commercial temperature range (0°C to 85°C). It targets mid-range embedded control, industrial I/O bridging, and video interface logic.
For engineers reviewing the XC6SLX45-N3CSG324C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (232 user I/Os), LVDS support, single-ended signaling compatibility, and configuration via SPI/BPI/JTAG interfaces.
Technical Context
The XC6SLX45-N3CSG324C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
Configuration is performed through Master SPI, Slave Serial, or JTAG modes; startup options include mode pin selection and internal oscillator-based delay. The device integrates clock management using DCMs (Digital Clock Managers) for frequency synthesis, phase shifting, and duty cycle correction across up to eight independent clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total available LUT-based logic resources for combinatorial and sequential logic implementation |
| Block RAM | 2.1 Mb - distributed as 180 × 18 Kb dual-port RAM blocks for data buffering and FIFOs |
| DSP Slices | 186 × DSP48A1 - fixed-point multiply-accumulate units supporting 18 × 18-bit multiplication with pipeline stages |
| User I/O Pins | 232 - configurable single-ended or differential I/Os grouped into 12 banks with independent VCCO |
| Speed Grade | -3 - highest performance grade in Spartan-6 family, enabling 667 Mbps DDR3 operation and 375 MHz system clock |
| Package | 324-pin CSBGA (19 × 19 mm, 0.8 mm pitch) - RoHS-compliant, thermally enhanced ball-grid array for industrial PCB assembly |
| Temperature Range | 0°C to +85°C - commercial-grade operation suitable for non-automotive, non-military indoor environments |
Pinout & Package
XC6SLX45-N3CSG324C uses a 324-pin Fine-Pitch CSP Ball Grid Array (CSBGA) with 19 × 19 ball arrangement, 0.8 mm pitch, and thermal pad on underside. Pinout follows Xilinx Spartan-6 pinout standard for SG324 package; I/O banks are organized in four quadrants with dedicated configuration, clock, and JTAG pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO / INIT_B | Active-low initialization status output during configuration; driven low if CRC error or configuration failure occurs |
| P17 | JTAG_TCK | Test clock input for boundary-scan and debug access; requires 10 kΩ pull-down for safe power-up |
| V16 | CLKIN_1 | Dedicated single-ended global clock input for Bank 15; supports up to 500 MHz with DCM locking |
| R14 | M0 | Mode pin for configuration source selection (SPI/BPI/Slave Serial); sampled at power-on reset |
| A18 | VCCO_0 | Output bank voltage supply for Bank 0; must be set to match connected interface standard (e.g., 3.3V or 1.8V) |
| E15 | GND | Signal ground reference for adjacent I/O banks and internal logic; multiple GND balls provide low-inductance return paths |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device enable jitter reduction, frequency synthesis, and phase alignment without external PLL ICs |
| SelectIO Technology | Per-bank I/O voltage support (1.2V–3.3V) allows mixed-voltage interfacing with legacy and modern peripherals |
| Configurable Logic Blocks | Each CLB contains four 6-input LUTs and eight flip-flops, optimized for high-density logic and pipelined datapaths |
| Embedded Memory | 180 × 18 Kb block RAMs support true dual-port operation, enabling simultaneous read/write for video frame buffers |
| PCI Express Endpoint | Hard IP not included; PCIe functionality requires soft-core implementation using LUTs and transceivers (not applicable to this LVDS-only variant) |
Applications
| Industrial PLC I/O Expansion | Video Format Conversion Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O, analog input conditioning, and fieldbus protocol translation to compact PLC controllers. IC Role / Device Role / Timing Role: FPGA fabric implements real-time logic for sensor sampling, watchdog timers, and Modbus RTU/ASCII framing. Use Value: 232 user I/Os and per-bank voltage flexibility allow direct connection to diverse sensors, actuators, and communication transceivers without level-shifter ICs. | Use Scenario: Converting HDMI 1.3a pixel data to parallel RGB+DE for LCD panel driving in medical displays. IC Role / Device Role / Timing Role: Timing-critical pixel clock domain crossing and color space conversion logic implemented in synchronous logic fabric. Use Value: 186 DSP48A1 slices accelerate YUV-to-RGB matrix math; 2.1 Mb block RAM enables line-buffered de-interlacing and frame synchronization. |
| Automated Test Equipment (ATE) Pattern Generator | Communications Protocol Gateway |
Use Scenario: Generating precise digital stimulus waveforms for semiconductor wafer probing and board-level functional test. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control using DCM-managed clocks and register-retimed outputs. Use Value: -3 speed grade guarantees sub-nanosecond output skew across 232 pins, critical for multi-site parallel test vector delivery. | Use Scenario: Translating CAN FD messages to UART-based telemetry streams in vehicle telematics gateways. IC Role / Device Role / Timing Role: Protocol state machine and buffer management core handling message parsing, filtering, and retransmission scheduling. Use Value: Block RAM provides deep message queues; logic cells implement concurrent CAN FD and UART controllers without external microcontroller intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484C | 484-pin FCBGA package, 328 user I/Os, larger footprint and higher thermal mass | Better suited for designs requiring more I/Os or thermal headroom; incompatible PCB layout | Select when additional I/O count or improved thermal dissipation is required; not pin-compatible with XC6SLX45-N3CSG324C |
| XC6SLX25-N3CSG324C | Fewer logic cells (24,051), reduced block RAM (1.8 Mb), same package and speed grade | Lower gate count limits complex video processing or multi-protocol handling; identical footprint and pinout | Choose for cost-sensitive applications with relaxed logic density requirements; pin-compatible drop-in replacement for XC6SLX45-N3CSG324C |
Compared with XC6SLX45-N3CSG324C, XC6SLX45-3FGG484C offers higher I/O count but requires PCB redesign, while XC6SLX25-N3CSG324C delivers identical packaging and pin compatibility at lower logic capacity-making it a true layout-conserving alternative for scaled-down implementations.
Availability
XC6SLX45-N3CSG324C is available at Aetrix Electronics and suitable for industrial automation, medical display subsystems, and automated test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX45-N3CSG324C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O interfacing-targeting industrial control, consumer video, and communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX45-N3CSG324C?
The XC6SLX45-N3CSG324C supports DDR3 SDRAM interfaces up to 667 Mbps data rate (333 MHz clock) when used with the -3 speed grade and appropriate PCB layout. This capability relies on calibrated I/O timing, proper termination, and DCM-based clock deskew. XC6SLX45-N3CSG324C does not include hardened memory controller IP; implementation requires Xilinx MIG v3.7 or later with manual constraint tuning.
Does XC6SLX45-N3CSG324C include built-in transceivers for high-speed serial protocols?
No, XC6SLX45-N3CSG324C does not integrate multi-gigabit transceivers. It belongs to the Spartan-6 LX series, which lacks high-speed serial I/O. All I/Os are limited to LVDS (840 Mbps) and single-ended standards. For PCIe, SATA, or Gigabit Ethernet, external PHYs or soft-core solutions must be implemented in XC6SLX45-N3CSG324C logic fabric.
Can XC6SLX45-N3CSG324C be configured using a microcontroller over SPI?
Yes, XC6SLX45-N3CSG324C supports Master SPI configuration mode, allowing a host microcontroller to load bitstream from external SPI flash. The FPGA initiates read cycles automatically after power-up when M0–M2 pins are set to 001. XC6SLX45-N3CSG324C requires no firmware driver beyond standard SPI byte writes; configuration status is monitored via INIT_B and DONE pins.
What is the purpose of the VCCAUX supply pin on XC6SLX45-N3CSG324C?
VCCAUX supplies 2.5 V to internal configuration circuitry, DCMs, and certain I/O input buffers in XC6SLX45-N3CSG324C. It must be decoupled with ≥10 µF ceramic capacitance and regulated within ±3% tolerance. Failure to maintain stable VCCAUX causes configuration failures or DCM unlock events, even if VCCINT and VCCO rails are nominal. XC6SLX45-N3CSG324C has dedicated VCCAUX pins (e.g., C13, D14) requiring separate power plane routing.
Is XC6SLX45-N3CSG324C compatible with Xilinx Vivado Design Suite?
No, XC6SLX45-N3CSG324C is not supported in Vivado. It requires Xilinx ISE Design Suite 14.7 as the final official toolchain. Vivado dropped Spartan-6 support after version 2013.4. XC6SLX45-N3CSG324C bitstreams generated in ISE 14.7 remain functional indefinitely, but no new features, IP updates, or OS compatibility patches are provided beyond that release.
XC6SLX45-N3CSG324C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 218
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSPBGA (15x15)
XC6SLX45-N3CSG324C FAQ
1.How can I place an order for XC6SLX45-N3CSG324C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-N3CSG324C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-N3CSG324C reliable?
The price and inventory of XC6SLX45-N3CSG324C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-N3CSG324C is usually 5 days.
3.What payment methods are accepted for XC6SLX45-N3CSG324C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-N3CSG324C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-N3CSG324C?
XC6SLX45-N3CSG324C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-N3CSG324C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-N3CSG324C?
For technical support, including XC6SLX45-N3CSG324C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-N3CSG324C requirements.
6.How does Aetrix verify that XC6SLX45-N3CSG324C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-N3CSG324C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-N3CSG324C meets industry standards.
7.What is the process for return or replacement of XC6SLX45-N3CSG324C?
All XC6SLX45-N3CSG324C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-N3CSG324C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-N3CSG324C part is unused and in its original packaging.
Return procedure for XC6SLX45-N3CSG324C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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