AMD XC6SLX45-N3FGG484C
- Part No.:
- XC6SLX45-N3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45-N3FGG484C.pdf
- Description:
- IC FPGA 316 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC6SLX45-N3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2.1 Mb of block RAM, and 186 DSP48A1 slices. It supports LVDS, SSTL, HSTL, and LVCMOS I/O standards with up to 348 user I/Os in the FGG484 package. It is used in industrial control logic, video interface bridging, and embedded vision preprocessing.
For engineers reviewing the XC6SLX45-N3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded memory depth, DSP slice count, and -3 speed grade timing performance for deterministic logic implementation.
Technical Context
The XC6SLX45-N3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It integrates dual-port block RAM (18 Kb per block), clock management tiles (CMT) with DCM and PLL, and SelectIO™ technology supporting multi-standard I/O with programmable drive strength and slew rate.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. The device supports partial reconfiguration and includes built-in boundary-scan (IEEE 1149.1) and internal logic analyzer (ChipScope Pro) support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 – determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2,125 kbits (118 × 18 Kb blocks) – enables local data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 186 × DSP48A1 – provides hardwired multiply-accumulate capability for filtering and math-intensive algorithms |
| User I/O Pins | 348 – supports high-pin-count parallel interfaces such as RGB video, camera sensors, and industrial buses |
| Speed Grade | -3 – guarantees worst-case propagation delay and setup/hold timing at 1.2 V core supply and 85°C junction temperature |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II, LVCMOS 1.2–3.3 V – allows direct interfacing with DDR2 memory, image sensors, and legacy peripherals |
Pinout & Package
The XC6SLX45-N3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply – must be decoupled locally for signal integrity in LVDS/SSTL interfaces |
| P17 | IO_L1P_T0_0 | Differential input pair (positive) for Bank 0 – used for clock or data reception in high-speed serial links |
| R18 | IO_L1N_T0_0 | Differential input pair (negative) for Bank 0 – requires matched trace length to P17 for common-mode noise rejection |
| V15 | VCCAUX | 1.8 V auxiliary supply for configuration circuitry and transceivers – requires low-noise regulation |
| T14 | PROGRAM_B | Active-low configuration reset – initiates reconfiguration when pulled low, synchronous to next CCLK edge |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs + one PLL per CMT – enables precise clock synthesis, phase alignment, and jitter reduction for multi-domain systems |
| SelectIO Technology | Programmable I/O standards per bank – eliminates level-shifter ICs when interfacing mixed-voltage peripherals |
| Partial Reconfiguration Support | Runtime logic module swapping – allows dynamic function updates without full system reset in adaptive control applications |
| Embedded Memory Blocks | 18 Kb dual-port RAM per block – supports simultaneous read/write access for video frame buffering and real-time processing |
| Boundary-Scan Compliance | IEEE 1149.1 integrated – enables PCB-level interconnect testing without physical probe access |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time servo loop execution with encoder feedback and PWM output generation in CNC machines. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machine and PID controller with sub-microsecond latency. Use Value: 43,661 logic cells and -3 speed grade ensure cycle-accurate timing for 20 kHz PWM and 100 kHz encoder sampling. | Use Scenario: Converting MIPI CSI-2 camera output to parallel BT.656 video stream for display processing ASICs. IC Role / Device Role / Timing Role: Protocol translation engine with deserialization, pixel reordering, and timing adjustment logic. Use Value: 348 user I/Os and LVDS/SSTL support enable direct connection to both MIPI D-PHY receivers and BT.656 parallel buses. |
| Embedded Vision Preprocessing | Communications Baseband Processing |
Use Scenario: On-camera histogram calculation, white balance correction, and Bayer demosaicing before JPEG compression. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator using DSP48A1 slices and block RAM for line buffers. Use Value: 186 DSP48A1 slices execute fixed-point arithmetic at 200+ MHz, reducing host CPU load by offloading compute-intensive kernels. | Use Scenario: Channel coding (Viterbi decoding) and modulation mapping (QPSK/16-QAM) in point-to-point wireless modems. IC Role / Device Role / Timing Role: Soft-core digital signal processor implemented in LUT-based logic with dedicated RAM for trellis state storage. Use Value: 2.1 Mb block RAM provides sufficient memory for 64-state Viterbi traceback depth and symbol lookup tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484I | Same logic resources and I/O count, but -3I industrial temperature grade (−40°C to +100°C) vs. -3C commercial (0°C to +85°C) | Required for extended-temperature deployments such as outdoor base stations or factory-floor controllers | Select XC6SLX45-3FGG484I when ambient operating temperature exceeds 85°C or requires extended qualification |
| XC7S25-1CSGA225C | Smaller logic capacity (23,360 LUTs), lower I/O count (100), but includes hardened PCIe Gen2 endpoint and 6-channel ADC | Suitable for cost-sensitive, lower-complexity designs where analog integration or protocol offload is prioritized over raw logic density | Choose XC7S25-1CSGA225C if PCIe connectivity or on-chip analog sensing reduces BOM count, despite reduced FPGA resources |
Compared with XC6SLX45-3FGG484I, the XC6SLX45-N3FGG484C offers identical logic and I/O performance at lower thermal qualification cost; versus XC7S25-1CSGA225C, it delivers 87% more logic cells and 248 additional I/Os-critical for high-bandwidth parallel interfaces-but lacks integrated analog or PCIe blocks.
Availability
XC6SLX45-N3FGG484C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision preprocessing, and video interface bridging requiring stable component supply across multi-year production cycles.
Supply support for XC6SLX45-N3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous workloads.
The Spartan-6 family-including XC6SLX45-N3FGG484C-was designed for cost-sensitive, high-volume applications demanding reliable logic density, flexible I/O, and low-power operation in industrial and video systems.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45-N3FGG484C?
The XC6SLX45-N3FGG484C supports I/O standards ranging from 1.2 V to 3.3 V, including LVCMOS, LVTTL, SSTL, HSTL, and LVDS. Each of its 12 I/O banks can be independently configured for different voltage levels, enabling mixed-voltage interface design without external level shifters. This capability is confirmed in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.12).
Does XC6SLX45-N3FGG484C support partial reconfiguration?
Yes, the XC6SLX45-N3FGG484C supports partial reconfiguration through Xilinx ISE Design Suite tools and associated bitstream generation flow. This allows dynamic replacement of logic modules while the rest of the design remains operational-enabling field-upgradable functionality in systems like adaptive test equipment or multi-mode communication gateways. Configuration memory partitioning and routing isolation are hardware-supported features of the Spartan-6 architecture.
What is the purpose of the VCCAUX pin on XC6SLX45-N3FGG484C?
The VCCAUX pin supplies 1.8 V to auxiliary circuitry including configuration logic, JTAG TAP controller, and clock management tiles (DCM/PLL). Stable, low-noise regulation of VCCAUX is required for reliable configuration and clock synthesis. Decoupling capacitors must be placed within 10 mm of the VCCAUX pins, as specified in the Spartan-6 FPGA Packaging and Pinout Product Specification (DS162 v3.3).
Can XC6SLX45-N3FGG484C interface directly with DDR2 SDRAM?
Yes, the XC6SLX45-N3FGG484C supports DDR2 SDRAM interfaces using its SSTL-18 Class I and II I/O standards and dedicated source-synchronous capture logic. The device provides programmable output drive strength and input termination for impedance matching, and timing closure is achievable up to 400 Mbps data rates using the MIG (Memory Interface Generator) tool in ISE. Verified reference designs exist for 16-bit and 32-bit DDR2 interfaces.
What configuration modes are supported by XC6SLX45-N3FGG484C?
The XC6SLX45-N3FGG484C supports Master Serial (via SPI flash), Slave Serial (processor-controlled), and JTAG modes. In Master Serial mode, the FPGA initiates configuration automatically after power-up; Slave Serial allows host processor control over bitstream loading; JTAG is used for debugging and programming during development. All modes use the same configuration pins (INIT_B, PROGRAM_B, CCLK, DIN), with mode selected by MODE pins during power-on reset.
XC6SLX45-N3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 316
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45-N3FGG484C FAQ
1.How can I place an order for XC6SLX45-N3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-N3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-N3FGG484C reliable?
The price and inventory of XC6SLX45-N3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-N3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45-N3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-N3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-N3FGG484C?
XC6SLX45-N3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-N3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-N3FGG484C?
For technical support, including XC6SLX45-N3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-N3FGG484C requirements.
6.How does Aetrix verify that XC6SLX45-N3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-N3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-N3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45-N3FGG484C?
All XC6SLX45-N3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-N3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-N3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX45-N3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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