AMD XC6SLX45-N3FGG676C

Overview

XC6SLX45-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2,088 Kbits of block RAM, 180 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.

For engineers reviewing the XC6SLX45-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), LVDS/MLVDS compatibility, SelectIO™ DCI termination, and dual-register flip-flop support for high-speed interface design.

Technical Context

The XC6SLX45-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for multi-phase clock synthesis and jitter reduction.

I/O banks are organized into four groups supporting independent voltage domains (1.2 V to 3.3 V), enabling mixed-voltage interfacing. Configuration occurs via Master SPI, Slave Parallel, or JTAG, with bitstream encryption and SEU mitigation using built-in CRC and optional ECC for configuration memory.

Key Specifications

Pinout & Package

XC6SLX45-N3FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Compared with XC6SLX45-3FGG484I, the XC6SLX45-N3FGG676C provides 152 additional user I/Os and enhanced thermal headroom; versus XC7S50-2CSGA324C, it offers mature tool support and proven qualification for long-lifecycle industrial deployments without requiring Vivado migration.

Availability

XC6SLX45-N3FGG676C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and power electronics monitoring requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX45-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic implementation, robust I/O flexibility, and long-term industrial qualification - especially in motor control, display interface, and embedded vision.

FAQ

What is the maximum supported DDR3 data rate for XC6SLX45-N3FGG676C?

The XC6SLX45-N3FGG676C supports DDR3 SDRAM interfaces up to 667 Mbps data rate (333 MHz clock) when operated at speed grade -3. This is validated in Xilinx UG382 and confirmed by timing analysis using ISE 14.7. The device uses dedicated DQS logic and phase-aligned clocking to meet setup/hold requirements without external delay elements. XC6SLX45-N3FGG676C achieves this with its integrated DLL and I/O calibration circuitry.

Does XC6SLX45-N3FGG676C support partial reconfiguration?

Yes, XC6SLX45-N3FGG676C supports partial reconfiguration through the Xilinx ISE design suite using the PlanAhead toolflow. This capability allows dynamic swapping of functional modules-such as protocol engines or filter coefficients-without resetting the entire device. XC6SLX45-N3FGG676C requires specific floorplanning and bitstream generation steps, and is documented in Xilinx UG702. Configuration security features remain active during partial updates.

What configuration modes are available for XC6SLX45-N3FGG676C?

XC6SLX45-N3FGG676C supports three primary configuration modes: Master SPI (internal oscillator drives serial flash), Slave Parallel (external controller writes configuration data), and JTAG (boundary-scan programming and debugging). All modes are electrically supported on the same pin set, with mode selection determined by M[2:0] pins at power-up. XC6SLX45-N3FGG676C also supports fallback configuration and multi-boot from SPI flash.

Is XC6SLX45-N3FGG676C qualified for automotive applications?

No, XC6SLX45-N3FGG676C is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably within automotive under-hood temperature extremes, it lacks automotive-specific screening, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, Xilinx recommends the Spartan-6Q family (e.g., XC6SLX45-Q3FGG676C), which carries full automotive qualification. XC6SLX45-N3FGG676C remains appropriate for non-safety-critical vehicle infotainment or diagnostics subsystems.

What I/O standards does XC6SLX45-N3FGG676C support?

XC6SLX45-N3FGG676C supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, MLVDS, RSDS, and differential signaling standards across its 480 user I/Os. Each I/O bank operates independently at 1.2 V to 3.3 V, enabling mixed-voltage operation. On-chip DCI termination supports 50 Ω and 75 Ω impedance matching. XC6SLX45-N3FGG676C implements these standards using SelectIO technology, with programmable slew rate and drive strength per pin group.