My Inquiry
My Account
AMD XC6SLX45-N3FGG676I
- Part No.:
- XC6SLX45-N3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX45-N3FGG676I.pdf
- Description:
- IC FPGA 358 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,273
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX45-N3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2.1 Mb of block RAM, 180 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (–40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX45-N3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and JTAG boundary-scan compliance.
Technical Context
The XC6SLX45-N3FGG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates clock management tiles containing DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty-cycle correction across up to 16 output clocks per DCM.
I/O banks are organized into eight groups, each supporting independent VCCO voltage (1.2 V to 3.3 V) and selectable I/O standards including LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards such as LVDS and RSDS. Configuration is supported via Master SPI, Slave SPI, or SelectMAP modes using external PROM or processor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2.1 Mb - supports embedded data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 480 - provides high-density parallel interface capability for sensors, displays, or FMC mezzanine connectivity |
| Speed Grade | -3 - guarantees timing closure at 595 MHz for internal logic and 1,050 Mbps for LVDS I/O |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating |
| Configuration Mode | Master/Slave SPI, SelectMAP, JTAG - enables flexible boot sources and field updates |
Pinout & Package
XC6SLX45-N3FGG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for FPGA logic fabric and CLBs |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCMs |
| A1 | VCCO_0 | Programmable I/O bank 0 output driver supply (1.2–3.3 V) |
| T14 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload |
| R15 | INIT_B | Open-drain status signal indicating configuration progress |
| V16 | CCLK | Configuration clock input for Master SPI mode (up to 50 MHz) |
| W17 | DIN | Serial configuration data input for Master/Slave SPI |
| Y16 | TCK | JTAG test clock input for IEEE 1149.1 boundary-scan and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping in-system without full device reset or interrupting active logic |
| Dual-Register Flip-Flops | Increases register density by 2× per slice, reducing resource usage for pipelined datapaths |
| Integrated DCMs | Provides jitter-tolerant clock synthesis and phase alignment without external PLL ICs |
| SelectIO Technology | Allows mixed-voltage I/O banks on same device, simplifying interface to legacy and modern peripherals |
| ISE Design Suite Compatibility | Guarantees full toolchain support through Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion for programmable logic controllers handling sensor inputs and actuator outputs. IC Role / Device Role / Timing Role: FPGA acts as protocol-agnostic I/O concentrator with cycle-accurate timing control and isolation between field-side and controller-side buses. Use Value: Enables 480-channel parallel I/O mapping with sub-microsecond response latency and integrated CRC error checking on all I/O banks. | Use Scenario: Conversion between HDMI 1.3a source and LVDS-based display panels in medical imaging equipment. IC Role / Device Role / Timing Role: Timing-critical bridge implementing pixel clock domain crossing, color space conversion, and embedded sync stripping/reinsertion. Use Value: Delivers 165 MHz pixel clock handling with <1.5 UI jitter on TMDS outputs and supports dual-link LVDS up to 1080p60 resolution. |
| Motor Control Encoder Interface | Communications Backplane Manager |
Use Scenario: High-resolution quadrature decoding and commutation timing for servo drives in factory automation. IC Role / Device Role / Timing Role: FPGA serves as real-time encoder preprocessor with hardware-accelerated edge detection, index pulse filtering, and PWM synchronization. Use Value: Processes 5 MHz quadrature signals with 4× interpolation and generates synchronized 20 kHz three-phase PWM with <50 ns dead-time control precision. | Use Scenario: Protocol translation and packet routing between PCIe host and multiple serial RapidIO endpoints in telecom baseband units. IC Role / Device Role / Timing Role: FPGA functions as deterministic interconnect manager with low-latency cut-through switching and link-layer error recovery. Use Value: Supports 5 GT/s PCIe Gen2 x4 upstream and four 3.125 Gbaud RapidIO lanes with end-to-end latency under 120 ns per hop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484I | 484-pin FBGA, 328 user I/Os, reduced I/O count and smaller thermal footprint | Suitable for space-constrained designs where full 480 I/Os not required | Select when board layout area or thermal budget limits use of 676-ball package |
| XC7S50-2CSGA324I | Artix-7 family, higher logic density (52,000 LUTs), 2.5x DSP slices, native PCIe Gen2 endpoint support | Required for designs needing integrated transceivers or AXI-based system integration | Choose when migrating to 28 nm process benefits or requiring hardened IP blocks not available in Spartan-6 |
Compared with XC6SLX45-N3FGG676I, the XC6SLX45-3FGG484I offers identical logic resources but fewer I/Os and lower power, while the XC7S50-2CSGA324I delivers superior performance and integration at the cost of higher static power and toolchain migration effort.
Availability
XC6SLX45-N3FGG676I is available at Aetrix Electronics and suitable for industrial control, video processing, motor drive, and communications infrastructure requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX45-N3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families. AMD is a global semiconductor leader focused on adaptive computing solutions.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation, embedded vision, and communications edge devices.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45-N3FGG676I?
The XC6SLX45-N3FGG676I supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO settings. Each of its eight I/O banks can be configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS and RSDS. This allows direct interfacing with mixed-voltage peripherals without level shifters. The XC6SLX45-N3FGG676I datasheet specifies absolute maximum ratings and DC characteristics for each supported standard.
Does XC6SLX45-N3FGG676I support JTAG boundary-scan testing?
Yes, XC6SLX45-N3FGG676I fully complies with IEEE 1149.1 (JTAG) boundary-scan architecture. It includes dedicated TCK, TMS, TDI, TDO, and TRST pins for test access, enabling board-level interconnect testing, in-system programming, and debug visibility. The XC6SLX45-N3FGG676I implements mandatory JTAG instructions including SAMPLE/PRELOAD, EXTEST, and IDCODE, verified in Xilinx documentation UG380.
Can XC6SLX45-N3FGG676I perform partial reconfiguration in the field?
Yes, XC6SLX45-N3FGG676I supports partial reconfiguration through Xilinx ISE tools and the PlanAhead design environment. This allows dynamic replacement of logic modules without resetting the entire device or halting active functions. The XC6SLX45-N3FGG676I implements frame-based configuration memory addressing and CRC-protected bitstream loading, enabling safe runtime updates in industrial and medical applications.
What configuration modes are supported by XC6SLX45-N3FGG676I?
XC6SLX45-N3FGG676I supports Master SPI, Slave SPI, SelectMAP, and JTAG configuration modes. Master SPI uses an internal oscillator to clock external serial PROM; Slave SPI allows external controller initiation; SelectMAP enables parallel loading via 8- or 16-bit bus; JTAG supports debugging and programming. All modes are electrically and logically defined in the XC6SLX45-N3FGG676I configuration user guide (UG380).
Is XC6SLX45-N3FGG676I qualified for industrial temperature operation?
Yes, XC6SLX45-N3FGG676I is rated for industrial temperature range (–40°C to +100°C) and carries the "I" suffix denoting industrial qualification. It undergoes extended burn-in and characterization across this range, with guaranteed timing performance and I/O electrical specifications meeting data sheet limits at both extremes. The XC6SLX45-N3FGG676I is commonly deployed in factory automation, outdoor infrastructure, and transportation systems.
XC6SLX45-N3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 358
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX45-N3FGG676I FAQ
1.How can I place an order for XC6SLX45-N3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45-N3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45-N3FGG676I reliable?
The price and inventory of XC6SLX45-N3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45-N3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX45-N3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45-N3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45-N3FGG676I?
XC6SLX45-N3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45-N3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45-N3FGG676I?
For technical support, including XC6SLX45-N3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45-N3FGG676I requirements.
6.How does Aetrix verify that XC6SLX45-N3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45-N3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45-N3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX45-N3FGG676I?
All XC6SLX45-N3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45-N3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45-N3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX45-N3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX45-N3FGG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
