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AMD XC6SLX45T-2FGG484C
- Part No.:
- XC6SLX45T-2FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45T-2FGG484C.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,253
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Product details
Overview
XC6SLX45T-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2.1 Mb of block RAM, 186 DSP48A1 slices, and operates at -2 speed grade with 1.2 V core voltage. It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial control logic, video interface bridging, and embedded vision preprocessing.
For engineers reviewing the XC6SLX45T-2FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (348 user I/Os), LVDS/PCIe Gen1-compatible transceivers, and support for DDR2/DDR3 memory interfaces in cost-sensitive embedded systems.
Technical Context
The XC6SLX45T-2FGG484C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with dedicated clock management including DCMs and PLLs for jitter reduction and frequency synthesis. It supports SelectIO standards up to 1.0 Gbps and includes integrated PCI Express® Endpoint Block v1.0 (Gen1 x1).
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled initialization. The device integrates 24 multipliers (18×18-bit) within its DSP48A1 slices and supports partial reconfiguration for dynamic function swapping in real-time applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total programmable logic capacity for combinational and sequential logic implementation |
| Block RAM | 2.1 Mb - distributed across 116 BRAM blocks, each configurable as 18 Kb dual-port memory |
| DSP Slices | 186 DSP48A1 - each provides 18×18 multiplier + accumulator + pipeline registers for signal processing |
| User I/O Pins | 348 - supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS |
| Transceivers | None - this variant lacks high-speed serial transceivers; PCIe endpoint is implemented in fabric + I/O |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies per data sheet tables for all I/O and internal paths |
| Core Voltage | 1.2 V ±3% - requires tightly regulated power supply with low-noise decoupling for stable operation |
Pinout & Package
XC6SLX45T-2FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Pin functions are defined per Xilinx DS162 (v3.3) and include configuration, clock, I/O, power, and ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - sets logic level for associated I/O pins |
| K1 | CCLK | Configuration clock input - drives internal configuration shift register during SPI/JTAG load |
| M2 | PROG_B | Active-low configuration reset - initiates reconfiguration and clears internal state |
| P2 | INIT_B | Open-drain status output - indicates configuration completion or error condition |
| T3 | DONE | Open-drain configuration status - pulled high when configuration is successfully completed |
| Y1 | VCCAUX | 1.8 V auxiliary supply - powers configuration logic, clock management, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Complies with PCIe Base Spec v1.1 (Gen1 x1); uses fabric-based endpoint without dedicated hard IP |
| Low-Power 45 nm Process | Reduces static power consumption vs. previous 90 nm Spartan families while enabling higher logic density |
| SelectIO Technology | Supports 18 I/O standards including single-ended and differential signaling up to 1.0 Gbps per pin |
| Dual-Mode Clock Management | Each DCM provides phase shifting, frequency synthesis, and duty cycle correction; PLL adds wider multiplication range |
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset - verified in Xilinx ISE 14.7 toolflow |
Applications
| Industrial Motion Control | Video Interface Bridging |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements custom PID controllers, pulse-width modulators, and quadrature decoder logic with sub-microsecond latency. Use Value: 43,661 logic cells and 186 DSP slices enable concurrent multi-axis control algorithms without external co-processors. | Use Scenario: Converting between HDMI 1.4 and MIPI CSI-2 for camera-to-processor video pipelines in embedded vision systems. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, protocol translation, and line buffering using block RAM and I/O serialization. Use Value: 348 user I/Os and SelectIO support for both TMDS and MIPI D-PHY voltage levels enable direct interface without level-shifter ICs. |
| Medical Imaging Preprocessing | Avionics Data Concentration |
Use Scenario: Real-time noise filtering and histogram equalization on ultrasound or endoscope image streams before compression. IC Role / Device Role / Timing Role: Configurable logic executes parallel FIR filters and gamma correction LUTs synchronized to pixel clock domains. Use Value: 2.1 Mb of block RAM provides sufficient line buffer depth for 1080p@60fps processing with zero-frame-delay pipelining. | Use Scenario: Aggregating ARINC 429, discrete I/O, and MIL-STD-1553B signals into a unified Ethernet backbone for flight control systems. IC Role / Device Role / Timing Role: Implements protocol-specific state machines, time-stamped buffering, and deterministic packet scheduling logic. Use Value: Dual-mode clock managers ensure precise timing alignment across heterogeneous bus interfaces with <±50 ps skew tolerance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-2FGG484C | Omits PCIe endpoint logic; identical logic resources, I/O count, and package; no integrated PCIe compliance features | Suitable for non-PCIe applications requiring same logic density and I/O but lower cost | Select XC6SLX45-2FGG484C only if PCIe endpoint functionality is unused and BOM cost reduction is critical |
| XC6SLX75T-2FGG484C | Higher logic density (74,637 LCs), more BRAM (3.8 Mb), additional DSP slices (228), same package and speed grade | Used where future scalability or increased algorithm complexity demands headroom beyond XC6SLX45T-2FGG484C | Choose XC6SLX75T-2FGG484C when design requires >43K logic cells or >186 DSP slices while retaining footprint compatibility |
Compared with XC6SLX45-2FGG484C, the XC6SLX45T-2FGG484C adds verified PCIe endpoint capability without increasing pin count or power envelope; versus XC6SLX75T-2FGG484C, it offers identical packaging and timing but trades logic capacity for lower cost and thermal footprint in fixed-function deployments.
Availability
XC6SLX45T-2FGG484C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and medical imaging preprocessing requiring stable component supply across extended production lifecycles.
Supply support for XC6SLX45T-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family under the AMD Adaptive SoC portfolio.
The Spartan-6 family targets cost-sensitive, high-volume embedded applications requiring balanced logic density, low power, and flexible I/O - optimized for industrial automation, vision, and communications edge nodes.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45T-2FGG484C?
The XC6SLX45T-2FGG484C supports I/O standards up to 3.3 V, including LVCMOS33, LVTTL, and SSTL18. Each I/O bank has independent VCCO voltage ranging from 1.2 V to 3.3 V, allowing mixed-voltage operation across banks. The device does not support 5 V-tolerant inputs. All I/O configurations must comply with Xilinx DS162 Table 12 for voltage and timing limits.
Does XC6SLX45T-2FGG484C include built-in high-speed serial transceivers?
No, the XC6SLX45T-2FGG484C does not contain dedicated high-speed serial transceivers. Its PCIe Gen1 x1 endpoint is implemented using fabric logic and SelectIO resources, not hard transceiver blocks. This differs from Spartan-6 LX150T or Virtex-6 devices that integrate GTP transceivers. Designers must allocate logic resources and I/O for serialization/deserialization.
What configuration modes are supported by XC6SLX45T-2FGG484C?
The XC6SLX45T-2FGG484C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI mode uses an external SPI PROM; Slave Serial allows microcontroller-driven configuration; JTAG enables programming and debugging. Configuration file format is bitstream (.bit), generated via Xilinx ISE 14.7 or Vivado 2019.1 legacy flow.
Is partial reconfiguration supported on XC6SLX45T-2FGG484C?
Yes, partial reconfiguration is supported on XC6SLX45T-2FGG484C using Xilinx ISE 14.7 with PlanAhead tools. It requires specific floorplanning, modular design partitioning, and bitstream generation workflows. Verified use cases include dynamic filter coefficient updates and protocol stack switching without full device reset or system interruption.
What is the thermal design power (TDP) range for XC6SLX45T-2FGG484C under typical operation?
The XC6SLX45T-2FGG484C has a typical thermal design power of 3.2 W to 5.8 W depending on resource utilization, clock frequency, and I/O activity. Xilinx XPE (Xilinx Power Estimator) v14.7 reports 4.1 W at 50% logic utilization, 100 MHz system clock, and 100 I/Os active. Thermal management must accommodate peak junction temperature ≤100°C per DS162 specification.
XC6SLX45T-2FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45T-2FGG484C FAQ
1.How can I place an order for XC6SLX45T-2FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45T-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45T-2FGG484C reliable?
The price and inventory of XC6SLX45T-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45T-2FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45T-2FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45T-2FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45T-2FGG484C?
XC6SLX45T-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45T-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45T-2FGG484C?
For technical support, including XC6SLX45T-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45T-2FGG484C requirements.
6.How does Aetrix verify that XC6SLX45T-2FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45T-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45T-2FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45T-2FGG484C?
All XC6SLX45T-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45T-2FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45T-2FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX45T-2FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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