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AMD XC6SLX45T-3CSG484C
- Part No.:
- XC6SLX45T-3CSG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX45T-3CSG484C.pdf
- Description:
- IC FPGA 296 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,681
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Product details
Overview
XC6SLX45T-3CSG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2,088 Kbits of block RAM, 180 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is housed in a 484-pin CSGA (Chip Scale Grid Array) package and used in industrial control logic, motor drive sequencing, and real-time protocol bridging.
For engineers reviewing the XC6SLX45T-3CSG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, embedded memory depth, DSP slice count, and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX45T-3CSG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
This device integrates dual-register flip-flops per LUT, six-input LUTs, and supports JTAG boundary-scan (IEEE 1149.1) and ICAP for partial reconfiguration. Configuration is performed via SPI serial flash or master/slave parallel mode using external PROM or processor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - total available LUT-based logic resources for combinational and sequential logic implementation |
| Block RAM | 2,088 Kbits - distributed across 116 BRAM blocks, each configurable as 18 Kb dual-port memory |
| DSP Slices | 180 - each provides 18×18-bit signed multiplication with optional accumulator and pipeline stages |
| User I/O Pins | 348 - support mixed-voltage I/O banks with independent VCCO per bank (1.2 V to 3.3 V) |
| Speed Grade | -3 - highest performance grade in Spartan-6 LX family, enabling 667 Mbps DDR3 interface operation |
| Core Voltage | 1.2 V ±3% - requires tight regulation; impacts dynamic power and timing closure margin |
Pinout & Package
XC6SLX45T-3CSG484C is packaged in a 484-ball CSGA (Chip Scale Grid Array) with 1.0 mm ball pitch, 23×23 array, and thermal pad on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input; must be decoupled within 10 mm of ball with ≥10 µF + 100 nF ceramic |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration, JTAG, and certain I/O banks |
| T14 | PROGRAM_B | Active-low asynchronous reset; pulls device into configuration state when asserted |
| R15 | INIT_B | Open-drain status output indicating configuration memory readiness |
| W19 | CCLK | Configuration clock input; driven externally during master serial mode or internally during slave mode |
| Y18 | DONE | Open-drain output confirming successful configuration completion and releasing I/Os from high-Z |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Supports x1 Gen1 PCIe endpoint with hard IP block-reduces logic resource usage and simplifies compliance testing |
| Dual-Register LUTs | Each LUT includes two independent registers, enabling high-speed pipelining without consuming additional CLB resources |
| SelectIO Technology | Per-bank I/O voltage support (1.2–3.3 V) enables direct interfacing with legacy and modern peripherals without level shifters |
| Embedded Memory Blocks | 116 × 18 Kb BRAMs support true dual-port operation up to 333 MHz, suitable for FIFOs and frame buffers |
| Configurable I/O Standards | LVDS, RSDS, BLVDS, and differential HSTL supported-enables high-speed serial links up to 1 Gbps per pair |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis synchronization and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic PWM generation, position loop computation, and EtherCAT slave protocol stack. Use Value: 348 user I/Os enable direct connection to 16-channel ADCs, isolated digital I/O, and dual Ethernet PHYs without glue logic. | Use Scenario: High-speed digital pattern generation and acquisition for semiconductor wafer probing. IC Role / Device Role / Timing Role: XC6SLX45T-3CSG484C serves as the timing engine and data path controller for parallel 128-bit vector I/O. Use Value: -3 speed grade ensures sub-2 ns clock-to-out delay for 200 MHz test clocks, meeting ATE timing margins. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of ultrasound transducer channel data before GPU transfer. IC Role / Device Role / Timing Role: XC6SLX45T-3CSG484C implements LVDS deserialization, beamforming coefficient loading, and DMA arbitration. Use Value: 180 DSP48A1 slices perform real-time FIR filtering across 64 channels at 40 MSPS, reducing host CPU load. | Use Scenario: ARINC 429/664 (AFDX) protocol conversion and time-triggered scheduling in flight control systems. IC Role / Device Role / Timing Role: XC6SLX45T-3CSG484C acts as deterministic network interface controller with hardware timestamping and queue management. Use Value: Embedded block RAM provides 2 MB of packet buffering across 8 virtual links, meeting DO-254 safety-critical latency requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484C | Same logic capacity and I/O count but uses FGG484 (Fine-Pitch BGA) package with 22×22 array and 1.0 mm pitch; no thermal pad | Lacks underside thermal pad; less suitable for sustained 85°C ambient industrial deployments | Prefer XC6SLX45T-3CSG484C where board-level thermal resistance must be minimized under continuous load |
| XC6SLX75T-3FGG484C | Higher logic density (74,637 LUTs), more BRAM (2,688 Kbits), and 228 DSP slices; same package footprint but higher power and cost | Enables larger protocol stacks (e.g., full TCP/IP + UDP offload) but requires upgraded thermal design | Choose XC6SLX45T-3CSG484C when application fits within 43K LUTs and thermal budget is constrained |
Compared with XC6SLX45-3FGG484C, XC6SLX45T-3CSG484C delivers better thermal performance in sealed enclosures; compared with XC6SLX75T-3FGG484C, it reduces BOM cost and power delivery complexity while retaining sufficient resources for deterministic motion control and AFDX edge nodes.
Availability
XC6SLX45T-3CSG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and avionics data concentrators requiring stable component supply over extended production lifecycles.
Supply support for XC6SLX45T-3CSG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, Kintex, and Virtex FPGA families for industrial, aerospace, and communications markets.
The Spartan-6 family, including XC6SLX45T-3CSG484C, was designed for cost-sensitive, high-volume applications demanding low static power, reliable single-event upset (SEU) mitigation, and seamless integration with legacy microcontrollers and analog front-ends.
FAQ
What is the maximum operating junction temperature for XC6SLX45T-3CSG484C?
The XC6SLX45T-3CSG484C has a maximum junction temperature rating of 100°C under continuous operation. This specification assumes proper PCB thermal design-including use of the underside thermal pad, ≥4 internal ground/power planes, and ≥6 thermal vias under the package-and airflow ≥200 LFM. Exceeding this limit risks timing violation and configuration loss.
Does XC6SLX45T-3CSG484C support partial reconfiguration?
Yes, XC6SLX45T-3CSG484C supports partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows runtime modification of specific logic regions without resetting the entire device. Implementation requires Xilinx ISE Design Suite 14.7 or later, and the reconfigurable module must be constrained to a defined SLICE column range with isolation logic.
What configuration modes are supported by XC6SLX484C?
XC6SLX45T-3CSG484C supports Master Serial (via SPI flash), Slave Serial, Slave Parallel, and JTAG configuration modes. The mode is selected using MODE pins M[2:0] at power-up. Master Serial is most common for standalone boot; JTAG is used for debugging and programming during development.
Is XC6SLX45T-3CSG484C qualified for automotive applications?
No, XC6SLX45T-3CSG484C is rated for commercial and industrial temperature ranges (0°C to 85°C ambient), not automotive AEC-Q100 qualification. It lacks built-in error-correcting code (ECC) for configuration memory and does not meet automotive SEU hardening requirements. For automotive use, consider Xilinx Automotive Spartan-6 Q-grade variants like XC6SLX45-3QFGG484I.
What is the purpose of the thermal pad on the underside of XC6SLX45T-3CSG484C?
The exposed thermal pad on the underside of XC6SLX45T-3CSG484C must be soldered to a solid copper thermal plane on the PCB to conduct heat from the silicon die. It reduces junction-to-board thermal resistance by up to 40% versus non-thermal-pad packages, directly improving timing stability and long-term reliability in thermally constrained industrial enclosures.
XC6SLX45T-3CSG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX45T-3CSG484C FAQ
1.How can I place an order for XC6SLX45T-3CSG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45T-3CSG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45T-3CSG484C reliable?
The price and inventory of XC6SLX45T-3CSG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45T-3CSG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45T-3CSG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45T-3CSG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45T-3CSG484C?
XC6SLX45T-3CSG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45T-3CSG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45T-3CSG484C?
For technical support, including XC6SLX45T-3CSG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45T-3CSG484C requirements.
6.How does Aetrix verify that XC6SLX45T-3CSG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45T-3CSG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45T-3CSG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45T-3CSG484C?
All XC6SLX45T-3CSG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45T-3CSG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45T-3CSG484C part is unused and in its original packaging.
Return procedure for XC6SLX45T-3CSG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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