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AMD XC6SLX45T-3FGG484I
- Part No.:
- XC6SLX45T-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45T-3FGG484I.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:176
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Product details
Overview
XC6SLX45T-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 43,661 logic cells, 2.7 Mb of total block RAM, 180 DSP48A1 slices, and operation at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in embedded vision preprocessing, industrial Ethernet gateway logic, and reconfigurable I/O bridging.
For engineers reviewing the XC6SLX45T-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support (up to 24 differential pairs), and integrated clock management (two DCMs and one PLL).
Technical Context
The XC6SLX45T-3FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and duty-cycle correction.
I/O banks support multiple standards including LVCMOS, LVTTL, SSTL, HSTL, and LVDS, with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (up to 150 Ω). Configuration is performed via Master SPI, Slave Serial, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2.7 Mb - supports local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| User I/O Pins | 348 - provides high-density interface capability across 10 I/O banks with independent voltage domains |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies specified in the data sheet |
| Temperature Range | Industrial (-40°C to +100°C) - qualified for deployment in factory automation and outdoor edge equipment |
| Configuration Interface | Master SPI / Slave Serial / JTAG - enables flexible, secure, and field-upgradable bitstream loading |
Pinout & Package
The XC6SLX45T-3FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - sets voltage level for all outputs in bank 0 (1.2 V to 3.3 V) |
| P2 | IO_L1P_T0_0 | Bank 0 differential input/output pair - supports LVDS, LVPECL, or single-ended signaling |
| T1 | CLKIN_1 | Primary global clock input - feeds DCM/PLL for system-wide clock distribution |
| V1 | M0 | Mode pin - selects configuration mode (e.g., Master SPI) at power-on |
| R1 | INIT_B | Open-drain status signal - indicates configuration status and allows external reset coordination |
| W1 | CCLK | Configuration clock - generated internally or externally to synchronize bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs + one PLL - eliminates need for external clock synthesizers in multi-clock domain designs |
| SelectIO Technology | Per-bank voltage support and programmable I/O standards - simplifies mixed-voltage board design and reduces level-shifter count |
| Configurable Logic Blocks (CLBs) | 6-input LUTs with dual flip-flops - improves logic density and timing predictability over prior generations |
| Embedded Memory | 18 Kb block RAMs with true dual-port capability - enables simultaneous read/write access for buffer and cache applications |
| Power-Optimized Architecture | Multiple sleep modes and dynamic power gating - reduces static power in always-on industrial monitoring nodes |
Applications
| Machine Vision Preprocessing | Industrial Ethernet Gateway |
|---|---|
Use Scenario: Real-time Bayer demosaicing and noise filtering on camera sensor streams before transmission. IC Role / Device Role / Timing Role: Configurable logic fabric processes pixel data pipelines with deterministic latency using synchronous FIFOs and pipeline registers. Use Value: Enables sub-100 µs processing latency and eliminates external frame buffers by leveraging 2.7 Mb on-chip RAM. | Use Scenario: Protocol translation between PROFINET RT and Modbus TCP in factory-floor gateways. IC Role / Device Role / Timing Role: Dual Ethernet MAC interface controller with time-critical packet scheduling and CRC offload. Use Value: Supports deterministic <1 µs jitter on PROFINET cyclic data exchange using dedicated clock routing and DCM-based timestamping. |
| Reconfigurable I/O Bridging | Test Equipment Signal Conditioning |
Use Scenario: Adapting legacy parallel bus peripherals to modern PCIe or USB 3.0 host interfaces. IC Role / Device Role / Timing Role: Glue logic and protocol converter implementing handshaking, width conversion, and burst arbitration. Use Value: Reduces BOM cost by replacing ASICs with field-upgradable logic while maintaining 100 MHz parallel bus timing compliance. | Use Scenario: High-speed analog stimulus generation and digitized response capture in ATE systems. IC Role / Device Role / Timing Role: Timing controller synchronizing DAC/ADC sampling clocks, trigger sequencing, and pattern memory addressing. Use Value: Achieves <±50 ps channel-to-channel skew across 32 I/O pins using dedicated low-skew global routing resources. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FGG484I | Commercial temperature range (0°C to +85°C); identical logic resources and I/O count | Limited to controlled indoor environments; not qualified for thermal cycling in industrial enclosures | Select when operating ambient stays within commercial spec and cost sensitivity outweighs environmental robustness |
| XC6SLX75T-3FGG676I | Higher logic density (74,637 LUTs), larger 676-pin FBGA package, +27% more block RAM | Supports more complex protocols (e.g., EtherCAT master + safety stack) but requires PCB redesign | Choose when future scalability or additional parallel processing lanes are required beyond current XC6SLX45T capacity |
Compared with XC6SLX45-3FGG484I, the XC6SLX45T-3FGG484I adds industrial temperature qualification without logic or I/O trade-offs; compared with XC6SLX75T-3FGG676I, it offers footprint compatibility and lower power at the expense of headroom for feature expansion.
Availability
XC6SLX45T-3FGG484I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX45T-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable performance, low power, and seamless integration with legacy interfaces and industrial protocols.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX45T-3FGG484I?
The XC6SLX45T-3FGG484I supports I/O voltages from 1.2 V to 3.3 V per bank, with independent VCCO supplies enabling mixed-voltage operation. Each of the 10 I/O banks can be configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS, subject to bank-specific voltage constraints documented in the Spartan-6 Packaging and Pinout Product Specification (UG386).
Does XC6SLX45T-3FGG484I include built-in configuration memory?
No, the XC6SLX45T-3FGG484I does not include on-chip non-volatile configuration memory. It requires an external serial PROM or flash device for master SPI configuration, or relies on a processor-driven slave serial/JTAG interface. Bitstream security features such as AES encryption are supported when using compatible external configuration memory.
Can XC6SLX45T-3FGG484I implement a PCI Express endpoint?
No, the XC6SLX45T-3FGG484I lacks native PCI Express hard IP blocks. While soft-core PCIe implementations exist, they consume significant logic resources and do not meet Gen1 x1 timing guarantees without extensive engineering effort. For PCIe connectivity, AMD recommends Spartan-6 LX150T or later Artix-7 families with dedicated GT transceivers.
What clocking resources are available on XC6SLX45T-3FGG484I?
The XC6SLX45T-3FGG484I integrates two Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL), supporting frequency synthesis, phase alignment, duty-cycle correction, and clock enable/disable control. These resources feed up to 16 global clock networks, enabling precise timing control across large logic partitions without external clock fanout buffers.
Is XC6SLX45T-3FGG484I RoHS compliant and halogen-free?
Yes, the XC6SLX45T-3FGG484I is RoHS compliant and halogen-free per AMD's product compliance documentation (Xilinx PDN-XA-0001). The FGG484 package uses lead-free solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for standard surface-mount assembly.
XC6SLX45T-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45T-3FGG484I FAQ
1.How can I place an order for XC6SLX45T-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45T-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45T-3FGG484I reliable?
The price and inventory of XC6SLX45T-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45T-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX45T-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45T-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45T-3FGG484I?
XC6SLX45T-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45T-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45T-3FGG484I?
For technical support, including XC6SLX45T-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45T-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX45T-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX45T-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45T-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX45T-3FGG484I?
All XC6SLX45T-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45T-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45T-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX45T-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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