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AMD XC6SLX45T-N3FG484C
- Part No.:
- XC6SLX45T-N3FG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX45T-N3FG484C.pdf
- Description:
- IC FPGA 296 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,614
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Product details
Overview
XC6SLX45T-N3FG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA with 43,661 logic cells, 2.1 Mb of block RAM, 186 DSP48A1 slices, and supports 725 Mbps LVDS I/O. It is configured via SPI flash or JTAG and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC6SLX45T-N3FG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility (1.2 V to 3.3 V), -3 speed grade timing margin, and FG484 flip-chip BGA package compatibility with industrial temperature range operation.
Technical Context
The XC6SLX45T-N3FG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS standards across 316 user I/O pins.
Configuration is performed through Master SPI, Slave Serial, or JTAG modes, with support for fallback configuration and multi-boot via external flash. The device includes internal oscillator, PLLs for clock synthesis, and power management features including suspend mode and dynamic I/O banking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,661 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 2.1 Mb - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 186 × DSP48A1 - provides fixed-point multiply-accumulate capability for filtering and math-intensive tasks |
| User I/O Pins | 316 - supports high-pin-count parallel interfaces, sensor arrays, and multi-protocol connectivity |
| Speed Grade | -3 - guarantees timing closure up to 725 Mbps LVDS and 1.2 GHz internal clocking in industrial temp range |
| I/O Standards | SSTL-2/18, HSTL-I/II, LVCMOS, LVDS - allows direct interfacing with DDR2, ADCs, FPGAs, and microcontrollers |
| Operating Temp | 0 °C to +85 °C - validated for industrial environment deployment without derating |
Pinout & Package
XC6SLX45T-N3FG484C is housed in a 484-pin flip-chip fine-pitch BGA (FG484) package with 25 × 25 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction. Thermal pad design supports standard reflow profiles and industrial thermal cycling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies 1.2–3.3 V to Bank 0 I/Os; must match connected interface voltage |
| IO_L0N_0 | Differential Input | LVDS/NLVDS negative input pair for high-speed serial links or clock inputs |
| M0–M2 | Mode Select | Configures boot source (SPI/JTAG/Slave Serial) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during Master SPI mode; externally generated |
| PROG_B | Program Initiate | Active-low signal that resets configuration memory and initiates reconfiguration |
| GND | Ground Reference | Provides low-impedance return path for all I/O and core logic; multiple balls assigned per bank |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Eight independent banks support mixed-voltage operation (1.2 V to 3.3 V) enabling direct connection to diverse peripherals |
| Dedicated Clock Resources | Four DCMs and two PLLs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous systems |
| Embedded Memory | 2.1 Mb block RAM + distributed RAM enables dual-port memory, FIFOs, and register-based state machines without external SRAM |
| PCI Express Endpoint | Integrated PCIe Gen1 x1 endpoint logic eliminates need for external bridge IC in host-attached designs |
| Power Management | Support for suspend mode, selective bank shutdown, and dynamic I/O termination reduces active and standby power in battery-aware systems |
Applications
| Industrial Motion Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time servo loop execution with encoder feedback, PWM generation, and safety monitoring in CNC and robotics drives. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, pulse-width modulators, and deterministic interrupt response within sub-µs latency. Use Value: 316 user I/Os enable simultaneous connection to multiple encoders, analog inputs, and isolated digital outputs; -3 speed grade ensures timing margin for 20 kHz PWM update rates. | Use Scenario: High-channel-count digital pattern generation and acquisition in boundary-scan and functional test platforms. IC Role / Device Role / Timing Role: Configurable I/O banks drive and sample signals at up to 725 Mbps LVDS, synchronized to system clock domains via DCM/PLL. Use Value: On-chip block RAM stores multi-Mb test vectors; DSP slices accelerate real-time pass/fail analysis without host CPU intervention. |
| Medical Imaging Interface | Communications Backplane |
Use Scenario: Interfacing ultrasound transducer arrays and ADC front-ends to ARM-based processing modules in portable imaging devices. IC Role / Device Role / Timing Role: Bridges parallel LVDS ADC streams to AXI bus using custom IP cores; manages data packing, buffering, and error correction. Use Value: Multi-bank I/O supports concurrent 1.8 V ADC interface and 3.3 V processor bus; 2.1 Mb block RAM absorbs bursty sensor data before DMA transfer. | Use Scenario: Protocol translation and signal conditioning between legacy TDM and modern packet-based backplane interconnects. IC Role / Device Role / Timing Role: Implements HDLC framing, CRC generation, and SerDes alignment logic for 100 Mbps+ serial links. Use Value: DSP48A1 slices perform real-time bit-level processing; SelectIO supports both 2.5 V HSTL and 3.3 V CMOS signaling required by mixed-generation line cards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX45-3FG484C | No T suffix; lacks built-in PCIe Gen1 endpoint logic and has reduced I/O drive strength | Suitable for non-PCIe embedded control where protocol offload is not required | Select XC6SLX45T-N3FG484C when PCIe endpoint integration or higher I/O drive is mandatory |
| XC7S50-2FTG256I | Artix-7 generation; higher logic density (52,000 LUTs), 2.5x more block RAM, and native DDR3 controller | Better suited for designs requiring DDR3 memory interface or higher throughput video/data pipelines | Choose XC6SLX45T-N3FG484C for cost-constrained industrial applications needing proven qualification and lower power |
Compared with XC6SLX45-3FG484C, the XC6SLX45T-N3FG484C adds PCIe endpoint capability and tighter I/O timing; versus XC7S50-2FTG256I, it offers lower BOM cost and mature industrial qualification at the expense of DDR3 and newer process advantages.
Availability
XC6SLX45T-N3FG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and communications backplane applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX45T-N3FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-optimized, low-power embedded applications requiring reliable I/O interfacing, real-time control, and industrial temperature operation - not high-performance compute or AI workloads.
FAQ
What is the operating temperature range for XC6SLX45T-N3FG484C?
The XC6SLX45T-N3FG484C is rated for industrial temperature operation from 0 °C to +85 °C. This range is verified per AMD's qualification testing and applies to all speed grades and I/O configurations specified in the official Spartan-6 DC and Switching Characteristics datasheet. The device maintains full timing compliance and I/O performance across this range without derating.
Does XC6SLX45T-N3FG484C support PCIe Gen1 x1 endpoint functionality?
Yes, XC6SLX45T-N3FG484C includes integrated PCIe Gen1 x1 endpoint logic compliant with PCI Express Base Specification v1.1. This capability is enabled by the "T" suffix in the part number and requires no external bridge IC. Configuration is handled through dedicated hard IP blocks and supported by Xilinx ISE 14.7 or later toolchains.
How many I/O banks does XC6SLX45T-N3FG484C have, and what voltage levels do they support?
XC6SLX45T-N3FG484C has eight user-configurable I/O banks. Each bank supports independent VCCO voltages from 1.2 V to 3.3 V and can be set to SSTL, HSTL, LVCMOS, or LVDS standards. This enables mixed-voltage board designs, such as interfacing 1.8 V ADCs and 3.3 V microcontrollers simultaneously without level shifters.
What configuration modes are supported by XC6SLX45T-N3FG484C?
XC6SLX45T-N3FG484C supports Master SPI, Slave Serial, JTAG, and Boundary Scan configuration modes. Master SPI is most common for production, using on-board SPI flash; JTAG is used for debugging and programming during development. Mode selection is controlled by M0–M2 pins at power-up, as defined in the Spartan-6 Configuration User Guide UG380.
Is XC6SLX45T-N3FG484C pin-compatible with other Spartan-6 FG484 packages?
XC6SLX45T-N3FG484C shares the same FG484 footprint and pinout with other Spartan-6 devices in the same density and package variant (e.g., XC6SLX45-3FG484C), but differs electrically in PCIe endpoint presence and I/O drive strength. Mechanical compatibility is guaranteed; however, PCB reuse requires verification of power delivery, I/O voltage assignments, and configuration mode settings.
XC6SLX45T-N3FG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3411
- Number of Logic Elements/Cells:
- 43661
- Total RAM Bits:
- 2138112
- Number of I/O:
- 296
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX45T-N3FG484C FAQ
1.How can I place an order for XC6SLX45T-N3FG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX45T-N3FG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX45T-N3FG484C reliable?
The price and inventory of XC6SLX45T-N3FG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX45T-N3FG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX45T-N3FG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX45T-N3FG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX45T-N3FG484C?
XC6SLX45T-N3FG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX45T-N3FG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX45T-N3FG484C?
For technical support, including XC6SLX45T-N3FG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX45T-N3FG484C requirements.
6.How does Aetrix verify that XC6SLX45T-N3FG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX45T-N3FG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX45T-N3FG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX45T-N3FG484C?
All XC6SLX45T-N3FG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX45T-N3FG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX45T-N3FG484C part is unused and in its original packaging.
Return procedure for XC6SLX45T-N3FG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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