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AMD XC6SLX75-2FG484I
- Part No.:
- XC6SLX75-2FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-2FG484I.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,725
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Product details
Overview
XC6SLX75-2FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in industrial motor control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX75-2FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), integrated DSP48A1 slices for real-time filtering, and support for PCI Express Gen1 endpoint configuration.
Technical Context
The XC6SLX75-2FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes eight CMT clock management tiles-each with two DCMs and one PLL-for multi-domain clock synthesis and phase alignment.
I/O banks are organized into four groups supporting independent VCCO voltages and selectable standards including LVCMOS, LVDS, and SSTL. Configuration occurs via Master SelectMAP, Serial, or JTAG interfaces with AES bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides gate count equivalent to ~450K ASIC gates for complex state machines and protocol engines |
| Block RAM | 3,001 kbits - supports dual-port FIFOs up to 18 kbit depth with independent read/write clocks |
| DSP Slices | 180 × DSP48A1 - enables 250 MHz MAC operations for motor current loop compensation |
| Max I/O Pins | 348 - configurable as single-ended or differential with programmable slew rate and drive strength |
| Speed Grade | -2 - guarantees timing closure at 595 MHz for internal logic and 1,050 Mbps for LVDS I/O |
| Operating Temp | -40°C to +100°C - qualified for industrial enclosure environments without forced cooling |
Pinout & Package
XC6SLX75-2FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.2 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain output confirming successful configuration and releasing downstream reset chains |
| P16 | INIT_B | Active-low open-drain status signal indicating configuration memory readiness |
| VCCO_0 | I/O Bank 0 Supply | Provides selectable 1.2–3.3 V power for bank-specific I/O standard compliance |
| M15 | CLKIN1 | Dedicated single-ended clock input routed to adjacent CMT for low-jitter domain generation |
| R14 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
Key Features
| Feature | Design Value |
|---|---|
| ISE Design Suite Support | Full toolchain compatibility with place-and-route, timing analysis, and bitstream generation up to v14.7 |
| Partial Reconfiguration | Enables dynamic module swapping without system reset-critical for adaptive motion profiling |
| AES Bitstream Encryption | Hardware-accelerated 256-bit key decryption prevents IP theft during field updates |
| Embedded PCIe Endpoint | Integrated hard IP block supporting x1 Gen1 link with <500 ns transaction latency |
| Multi-Voltage I/O Banks | Four independent banks allow concurrent interfacing to 1.8 V sensors, 3.3 V microcontrollers, and 2.5 V FPGAs |
Applications
| Industrial Motor Drive | Programmable Logic Controller |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with encoder feedback and current sensing. IC Role / Device Role / Timing Role: FPGA acts as deterministic servo controller executing PWM generation, Clarke/Park transforms, and PID loops within 2 µs cycle time. Use Value: Achieves 12-bit effective resolution in current loop sampling using integrated 12-bit ADC interface and DSP48A1-based filtering. | Use Scenario: Modular I/O expansion for distributed control cabinets with mixed analog/digital field devices. IC Role / Device Role / Timing Role: Configurable logic handles protocol bridging (Modbus RTU ↔ EtherCAT), cyclic redundancy checking, and hot-swap detection. Use Value: Supports 32-channel isolated digital I/O with <100 ns input synchronization across all channels using dedicated ILOGIC resources. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: High-speed data aggregation from ultrasound transducer arrays with time-of-flight correlation. IC Role / Device Role / Timing Role: FPGA performs parallel LVDS deserialization, beamforming delay alignment, and FIR filtering before DDR2 buffering. Use Value: Leverages 348 I/O pins to sustain 1.2 Gbps aggregate bandwidth across 24 LVDS lanes with sub-cycle skew calibration. | Use Scenario: Arbitrary waveform generation and high-precision timestamping in automated test systems. IC Role / Device Role / Timing Role: FPGA implements direct digital synthesis (DDS) engine, jitter-cleaned clock distribution, and TDC logic for picosecond-level event capture. Use Value: Uses CMT PLLs to generate 200 MHz sampling clock with <1.5 ps RMS jitter for 12-bit DAC synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-3FG484C | Faster -3 speed grade; commercial temperature range (0°C to +85°C); higher static power consumption | Lacks industrial temperature qualification; unsuitable for uncooled enclosures or extended ambient operation | Select only if timing margin exceeds 15% and thermal environment is controlled |
| XC6SLX100-2FG484I | Higher logic capacity (101,280 LCs); same package and speed grade; increased Block RAM (3,780 kbits) | Requires revised PCB layout due to identical footprint but different power delivery requirements | Choose when additional logic resources are needed for multi-axis coordination or safety monitoring logic |
Compared with XC6SLX75-2FG484I, the XC6SLX75-3FG484C offers tighter timing margins but sacrifices industrial temperature resilience, while XC6SLX100-2FG484I delivers scalable logic density at the cost of higher power delivery complexity and no pinout reuse.
Availability
XC6SLX75-2FG484I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controllers, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75-2FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client applications through its acquisition of Xilinx.
The Spartan-6 family was engineered for cost-sensitive, high-volume industrial and automotive applications demanding reliable performance, low static power, and long-term availability.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75-2FG484I?
XC6SLX75-2FG484I supports I/O bank voltages from 1.2 V to 3.3 V per bank, enabling mixed-voltage interfacing with legacy peripherals and modern low-power sensors. Each of the four I/O banks can be independently configured, and VCCO must match the selected I/O standard's specification-e.g., 1.8 V for SSTL18 or 3.3 V for LVCMOS33. This flexibility is verified in Xilinx UG381 v1.11.
Does XC6SLX75-2FG484I support partial reconfiguration in production systems?
Yes, XC6SLX75-2FG484I supports hardware-verified partial reconfiguration using the Xilinx ISE 14.7 toolflow and BITGEN options for modular design. Field deployment requires encrypted bitstreams and proper configuration state isolation between static and dynamic regions. This capability is documented in Xilinx AR# 41722 and UG723 v1.5.
Can XC6SLX75-2FG484I operate as a PCI Express Gen1 endpoint without external PHY?
Yes, XC6SLX75-2FG484I integrates a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification v1.1. It requires no external PHY and supports MSI, BAR decoding, and DMA transfers. Link training and error reporting are handled in silicon, as confirmed in Xilinx UG372 v1.7 and DS162 v3.1.
What configuration modes are supported by XC6SLX75-2FG484I?
XC6SLX75-2FG484I supports Master SelectMAP, Slave SelectMAP, Serial (SPI flash), and JTAG configuration modes. Master SelectMAP allows autonomous boot from external parallel NOR flash, while Serial mode enables compact 4-wire SPI interface with fallback recovery. All modes are electrically validated per Xilinx DS162 v3.1 and UG380 v1.9.
Is XC6SLX75-2FG484I qualified for automotive applications?
No, XC6SLX75-2FG484I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. While it meets extended temperature requirements, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation required for automotive ECUs. Use in automotive contexts requires customer-led qualification per ISO/TS 16949.
XC6SLX75-2FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-2FG484I FAQ
1.How can I place an order for XC6SLX75-2FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-2FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-2FG484I reliable?
The price and inventory of XC6SLX75-2FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-2FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-2FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-2FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-2FG484I?
XC6SLX75-2FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-2FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-2FG484I?
For technical support, including XC6SLX75-2FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-2FG484I requirements.
6.How does Aetrix verify that XC6SLX75-2FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-2FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-2FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-2FG484I?
All XC6SLX75-2FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-2FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-2FG484I part is unused and in its original packaging.
Return procedure for XC6SLX75-2FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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