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AMD XC6SLX75-2FG676I
- Part No.:
- XC6SLX75-2FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75-2FG676I.pdf
- Description:
- IC FPGA 408 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,487
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Product details
Overview
XC6SLX75-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates across industrial temperature range (–40°C to +100°C). It is used in industrial motor control systems requiring deterministic real-time logic execution and multi-protocol interface bridging.
For engineers reviewing the XC6SLX75-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, transceiver speed, thermal rating, and supported configuration modes (JTAG, Master SPI, Slave SelectMAP).
Technical Context
The XC6SLX75-2FG676I implements a hierarchical FPGA architecture with six-input LUTs, distributed RAM, and dedicated carry chains for arithmetic. It integrates 220 DSP48A1 slices supporting 18×18-bit multiply-accumulate operations at up to 250 MHz.
Configuration is supported via 1.8 V or 3.3 V JTAG, or through Master SPI mode using external serial flash. The device includes internal voltage regulation for VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO (1.2–3.3 V configurable per bank).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,001 kbits - supports on-chip data buffering, FIFOs, and small lookup tables without external memory |
| User I/O Pins | 480 - enables high-pin-count interface consolidation (e.g., parallel bus, multiple UART/SPI/I2C) |
| Transceiver Speed | 3.2 Gb/s - supports PCIe Gen1, SATA I, and Gigabit Ethernet physical layer interfacing |
| Operating Temperature | –40°C to +100°C - qualified for industrial environments without forced cooling or derating |
| Supply Voltages | VCCINT = 1.2 V, VCCAUX = 2.5 V, VCCO = 1.2–3.3 V - allows mixed-voltage I/O bank configuration per interface standard |
Pinout & Package
Package: 676-ball Fine-Pitch BGA (FG676), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core logic supply (1.2 V); must be filtered and decoupled locally per AMD layout guidelines |
| P2 | VCCAUX | Auxiliary supply (2.5 V) for configuration circuitry, clock management, and I/O reference |
| U19 | VCCO_0 | I/O bank 0 output supply (configurable 1.2–3.3 V); sets voltage level for all pins in Bank 0 |
| R15 | PROGRAM_B | Active-low asynchronous reset; initiates reconfiguration when pulsed low |
| T14 | DONE | Open-drain status signal; goes high when configuration completes successfully |
| Y16 | TCK | JTAG test clock input; required for boundary-scan and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Low-power 45 nm process | Reduces dynamic and static power vs. prior 65 nm FPGAs; enables fanless industrial enclosure designs |
| DSP48A1 slices | 220 dedicated arithmetic units support real-time filtering, FFT, and motor control algorithms |
| SelectIO technology | Supports LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards within same I/O bank |
| Embedded Clock Management | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication |
Applications
| Industrial Motor Control | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time closed-loop servo drive with field-oriented control (FOC) and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes position loop, current loop, and PWM generation with sub-microsecond latency. Use Value: XC6SLX75-2FG676I delivers deterministic timing and 480 I/Os to manage multi-axis motion, safety interlocks, and EtherCAT slave interface simultaneously. | Use Scenario: Modular PLC backplane with hot-swappable I/O modules and dual-CPU redundancy. IC Role / Device Role / Timing Role: Configurable logic handles protocol translation between Modbus RTU, Profibus DP, and local bus arbitration. Use Value: XC6SLX75-2FG676I provides sufficient logic cells and Block RAM to implement dual-core soft-CPU firmware plus real-time I/O mapping buffers. |
| Video Surveillance Encoder | Test & Measurement Instrumentation |
Use Scenario: HD video stream preprocessing (de-interlacing, noise reduction) before H.264 encoding. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator offloading CPU-intensive image processing tasks. Use Value: XC6SLX75-2FG676I's 3,001 kbits Block RAM enables line-buffered frame processing without external SDRAM latency penalties. | Use Scenario: High-precision digital multimeter with simultaneous analog sampling, FFT analysis, and USB 2.0 host interface. IC Role / Device Role / Timing Role: Timing-critical ADC controller and digital signal co-processor synchronized to internal DCM clocks. Use Value: XC6SLX75-2FG676I supports 250 MHz DSP slice operation and 3.2 Gb/s transceivers for high-speed data streaming to PC host. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-TQG144C | Lower density (7,680 logic cells), 100 I/Os, TQFP-144 package, commercial temp (0°C to +85°C) | Suitable for prototyping or low-I/O cost-sensitive designs; lacks transceivers and industrial temp rating | Select when board space, cost, and thermal envelope constrain use of FG676 package and extended temperature operation |
| XC7A75T-2CSG324I | Artix-7 architecture, 74,000 logic cells, 28 nm process, 210 I/Os, -40°C to +100°C, no built-in transceivers | Better power efficiency and higher DSP performance, but requires external PHY for high-speed serial protocols | Choose for new designs prioritizing lower static power and future-proof toolchain (Vivado), accepting trade-off in transceiver integration |
Compared with XC6SLX9-TQG144C, the XC6SLX75-2FG676I enables full industrial deployment with transceiver support and I/O scalability; versus XC7A75T-2CSG324I, it retains native high-speed serial interface capability at the expense of newer process node advantages.
Availability
XC6SLX75-2FG676I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and video infrastructure applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable logic density, low power, and long-term availability - with XC6SLX75-2FG676I targeting mid-range system integration where transceiver capability and I/O count are critical.
FAQ
What is the maximum operating frequency of the XC6SLX75-2FG676I's internal logic?
The XC6SLX75-2FG676I is speed-grade -2, meaning its guaranteed maximum internal logic frequency is 540 MHz for register-to-register paths under worst-case industrial conditions. This rating applies to synchronous logic implemented in LUTs and flip-flops, and is verified via static timing analysis in Xilinx ISE tools. The XC6SLX75-2FG676I achieves this performance using 45 nm process technology and optimized routing architecture.
Does the XC6SLX75-2FG676I support JTAG boundary-scan testing?
Yes, the XC6SLX75-2FG676I fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TDI, TDO, TMS, and TCK pins. It implements mandatory boundary-scan instructions (SAMPLE/PRELOAD, EXTEST, INTEST, BYPASS) and supports device identification (IDCODE). This capability is integral to PCB assembly validation and in-system debug workflows for the XC6SLX75-2FG676I.
What configuration modes does the XC6SLX75-2FG676I support?
The XC6SLX75-2FG676I supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (using on-chip oscillator to read bitstream from external SPI flash), and Slave SelectMAP (for high-speed parallel loading from microcontroller or processor). All modes are supported across the full –40°C to +100°C range, and the XC6SLX75-2FG676I includes dedicated INIT_B and DONE pins to monitor configuration status.
Can the XC6SLX75-2FG676I operate with mixed I/O voltages on different banks?
Yes, the XC6SLX75-2FG676I supports independent VCCO supplies per I/O bank (Banks 0–4), allowing simultaneous operation at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Each bank's voltage setting determines compatible I/O standards (e.g., LVCMOS18 in Bank 2, SSTL15 in Bank 3). This capability is essential for interfacing with heterogeneous peripherals and is fully specified in the XC6SLX75-2FG676I datasheet.
Is the XC6SLX75-2FG676I pin-compatible with other Spartan-6 devices in the FG676 package?
No, the XC6SLX75-2FG676I is not pin-compatible with other Spartan-6 devices in the FG676 package, such as XC6SLX150-2FG676I. While both share the same 676-ball footprint, I/O bank assignments, voltage requirements, and dedicated function pin locations differ significantly. Board-level reuse requires verification of each pin's electrical role and connectivity; the XC6SLX75-2FG676I must be treated as a unique layout target.
XC6SLX75-2FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75-2FG676I FAQ
1.How can I place an order for XC6SLX75-2FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-2FG676I reliable?
The price and inventory of XC6SLX75-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-2FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-2FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-2FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-2FG676I?
XC6SLX75-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-2FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-2FG676I?
For technical support, including XC6SLX75-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-2FG676I requirements.
6.How does Aetrix verify that XC6SLX75-2FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-2FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-2FG676I?
All XC6SLX75-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-2FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-2FG676I part is unused and in its original packaging.
Return procedure for XC6SLX75-2FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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