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AMD XC6SLX75-2FGG484C

Part No.:
XC6SLX75-2FGG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX75-2FGG484C.pdf
Description:
IC FPGA 280 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,741

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Product details

Overview

XC6SLX75-2FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It operates at -2 speed grade with 1.2 V core voltage and targets high-reliability industrial control and video processing systems.

For engineers reviewing the XC6SLX75-2FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, DCI termination, and compatibility with Xilinx ISE Design Suite v14.7.

Technical Context

The XC6SLX75-2FGG484C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, with integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes 220 SelectIO™ resources supporting LVCMOS, LVTTL, LVDS, and SSTL standards.

Its clocking architecture comprises four DCMs (Digital Clock Managers) and one PLL for internal clock synthesis, jitter reduction, and phase alignment across multiple domains. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external SPI flash or PROM.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,880 - determines maximum combinational/sequential logic capacity for custom digital functions
User I/O Pins348 - supports high-pin-count interface bridging, such as parallel video or multi-sensor data aggregation
Block RAM3,001 kbits - enables on-chip buffering for frame storage, FIFOs, or lookup tables without external memory
Speed Grade-2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions (0°C to 85°C)
Transceiver Data Rate3.2 Gb/s - supports serial protocols including DisplayPort 1.1a and PCIe Gen1 x1
Core Voltage1.2 V ±3% - requires tight-regulation power delivery with <±10 mV ripple for stable configuration and operation

Pinout & Package

XC6SLX75-2FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 3.5 W under typical industrial operating conditions.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration shift register during Master Serial mode; must be driven by external oscillator or microcontroller
DONEConfiguration Status OutputOpen-drain signal indicating successful bitstream loading; pulled high externally to enable startup sequencing
INIT_BConfiguration InitializationActive-low input that resets configuration logic and clears internal state prior to reconfiguration
M0–M2Mode Selection InputsSet configuration mode (e.g., Master Serial, JTAG) at power-up; sampled on PROG_B deassertion
PROG_BProgram Initiate InputActive-low signal triggering full reconfiguration from external memory or host processor

Key Features

FeatureDesign Value
Integrated DSP48A1 Slices18×18-bit multiplier + accumulator per slice, enabling real-time FIR filtering and motor control algorithms
SelectIO™ TechnologySupports 18 I/O standards including LVDS differential pairs and on-die termination (DCI) for impedance matching
Dual-Register Flip-FlopsPer-LUT dual registers reduce routing congestion and improve timing closure for high-frequency state machines
Embedded Memory Blocks18-kbit Block RAMs configurable as 18K×1, 9K×2, or 4K×4, supporting synchronous dual-port access

Applications

Industrial Motion ControlHD Video Interface Bridge

Use Scenario: Real-time closed-loop servo drive with encoder feedback and PWM output generation.

IC Role / Device Role / Timing Role: FPGA fabric implements position loop controller, PWM modulator, and encoder counter logic with sub-microsecond latency.

Use Value: Enables deterministic 100 kHz control loop execution using dedicated logic and DSP slices, eliminating need for external ASIC.

Use Scenario: Conversion between MIPI CSI-2 camera interface and parallel BT.656 video bus in machine vision systems.

IC Role / Device Role / Timing Role: Protocol translator and clock domain crossing bridge with embedded FIFOs and DDR capture logic.

Use Value: Supports 720p60 video throughput using 348 user I/Os and 3,001 kbits of Block RAM for line buffering.

Programmable Logic Controller (PLC)Medical Imaging Data Aggregator

Use Scenario: Modular I/O expansion unit with analog input conditioning, digital isolation, and EtherCAT slave interface.

IC Role / Device Role / Timing Role: System-on-chip controller managing isolated GPIO, ADC interface, and real-time Ethernet MAC layer.

Use Value: Integrates 348 I/Os with DCI termination and DCM-based clock synchronization for deterministic EtherCAT cycle times.

Use Scenario: Aggregation of multi-channel ultrasound echo data from 16 ADCs into a unified AXI-Stream pipeline.

IC Role / Device Role / Timing Role: High-throughput data concentrator with parallel-to-serial conversion and packet framing logic.

Use Value: Leverages 74,880 logic cells and 3.2 Gb/s transceivers to sustain >2.5 Gbps aggregate data rate with low-latency buffering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150-2FGG676CHigher logic density (147,443 LCs), larger 676-pin FBGA, 480 user I/Os, same -2 speed gradeRequired for designs needing >100k logic cells or >400 I/Os; not drop-in compatible due to package and pinout mismatchSelect when scaling logic capacity beyond XC6SLX75-2FGG484C limits while retaining Spartan-6 toolchain and IP compatibility
XC7S25-2CSGA225CArtix-7 family, lower logic count (23,360 LCs), smaller 225-pin CSBGA, 100 user I/Os, 1.0 V coreSuitable for cost-sensitive, lower-complexity designs; lacks native LVDS support and has reduced Block RAM (1,800 kbits)Choose for new designs prioritizing lower power and smaller footprint where XC6SLX75-2FGG484C resources are over-provisioned

Compared with XC6SLX75-2FGG484C, XC6SLX150-2FGG676C offers scalable logic and I/O but requires PCB redesign, while XC7S25-2CSGA225C reduces cost and size at the expense of I/O count, transceiver capability, and memory resources.

Availability

XC6SLX75-2FGG484C is available at Aetrix Electronics and suitable for industrial motion control, HD video interface bridging, and medical imaging data aggregation requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75-2FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-6 family was originally designed by Xilinx for cost-optimized, high-volume applications demanding low-power programmable logic with integrated memory and I/O features.

FAQ

What is the maximum operating temperature range for XC6SLX75-2FGG484C?

The XC6SLX75-2FGG484C is rated for industrial temperature operation from 0°C to +85°C ambient. This range is validated per Xilinx DS162 specification and applies to all speed grades including the -2 grade. Thermal derating is required above 70°C case temperature, and junction temperature must remain below 100°C under sustained load. The XC6SLX75-2FGG484C's thermal resistance (θJA) is 22.5°C/W in standard board layout conditions.

Does XC6SLX75-2FGG484C support JTAG boundary-scan testing?

Yes, XC6SLX75-2FGG484C fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. Its TAP controller implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional ones (IDCODE, USERCODE). JTAG pins (TCK, TMS, TDI, TDO) are dedicated and electrically isolated from user I/O banks. The XC6SLX75-2FGG484C also supports JTAG configuration via iMPACT or Vivado hardware server.

Can XC6SLX75-2FGG484C be configured using SPI flash memory?

Yes, XC6SLX75-2FGG484C supports Master Serial configuration mode using industry-standard SPI flash devices (e.g., Micron N25Q, Spansion S25FL). The CCLK signal drives the flash clock, and configuration data is loaded via the DIN pin. Boot time is typically 80–120 ms depending on flash density and clock frequency. The XC6SLX75-2FGG484C requires no external controller for this mode, making it ideal for standalone boot scenarios.

What I/O standards are supported by XC6SLX75-2FGG484C's SelectIO™ banks?

XC6SLX75-2FGG484C supports 18 I/O standards across its SelectIO™ banks, including LVCMOS 1.2/1.5/1.8/2.5/3.3 V, LVTTL, PCI, HSTL, SSTL, and differential standards like LVDS, BLVDS, and RSDS. Each bank is independently voltage-controlled, allowing mixed-voltage operation. On-die termination (DCI) is available for single-ended and differential standards, eliminating external resistors for impedance matching.

Is XC6SLX75-2FGG484C compatible with Xilinx Vivado Design Suite?

No, XC6SLX75-2FGG484C is not supported in Xilinx Vivado Design Suite. It requires Xilinx ISE Design Suite version 14.7 or earlier for synthesis, implementation, and bitstream generation. Vivado dropped Spartan-6 support after ISE end-of-life. Users must retain ISE 14.7 for maintenance and re-spin projects involving XC6SLX75-2FGG484C, as no migration path exists to Vivado for this device family.

XC6SLX75-2FGG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
280
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX75-2FGG484C FAQ

1.How can I place an order for XC6SLX75-2FGG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX75-2FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX75-2FGG484C reliable?

The price and inventory of XC6SLX75-2FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-2FGG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX75-2FGG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-2FGG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX75-2FGG484C?

XC6SLX75-2FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX75-2FGG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX75-2FGG484C?

For technical support, including XC6SLX75-2FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-2FGG484C requirements.

6.How does Aetrix verify that XC6SLX75-2FGG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX75-2FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-2FGG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX75-2FGG484C?

All XC6SLX75-2FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-2FGG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX75-2FGG484C part is unused and in its original packaging.

Return procedure for XC6SLX75-2FGG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX75-2FGG484C Tags

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