AMD XC6SLX75-2FGG484I

Overview

XC6SLX75-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4,032 Kbits of block RAM. It operates at -2 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 484-pin Fine-Pitch BGA (FGG) package. It is used in industrial motor control systems requiring deterministic I/O timing and partial reconfiguration support.

For engineers reviewing the XC6SLX75-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS-compatible banks, SelectIO™ voltage support (1.2–3.3 V), and compatibility with Xilinx ISE Design Suite v14.7 for synthesis and place-and-route.

Technical Context

The XC6SLX75-2FGG484I implements a hierarchical FPGA architecture with six primary I/O banks, each supporting independent VCCO and VREF settings. It integrates dual-register flip-flops per LUT, dedicated carry logic, and configurable I/O standards including LVCMOS, LVTTL, HSTL, SSTL, and differential standards such as LVDS and TMDS.

It supports JTAG boundary-scan (IEEE 1149.1), configuration via SPI x4/x2/x1, Master SelectMAP, and Slave SelectMAP modes. Configuration memory is loaded into SRAM-based CLBs and block RAM, requiring external non-volatile storage (e.g., SPI flash) for power-up initialization.

Key Specifications

Pinout & Package

XC6SLX75-2FGG484I uses a 484-pin Fine-Pitch Ball Grid Array (FGG) package with 23×23 array, 1.0 mm pitch, and exposed thermal pad. Pinout follows Xilinx Spartan-6 FPGA pinout conventions with dedicated configuration, clock, JTAG, and I/O bank assignments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Compared with XC6SLX75-2FGG484I, the -3C variant trades industrial temperature tolerance for higher speed, while the LX100-2I offers scalable resources without changing package or footprint-enabling design reuse with increased logic capacity.

Availability

XC6SLX75-2FGG484I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, and medical data acquisition requiring stable component supply across long-lifecycle programs.

Supply support for XC6SLX75-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, low-latency applications.

The Spartan-6 family, including XC6SLX75-2FGG484I, was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O interfacing in industrial and embedded systems.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75-2FGG484I?

XC6SLX75-2FGG484I supports I/O voltages from 1.2 V to 3.3 V per bank via SelectIO™ technology. Each of the six I/O banks can be independently configured for LVCMOS, LVTTL, SSTL, HSTL, or differential standards like LVDS. The VCCO supply for each bank must match the selected standard's voltage requirement, and XC6SLX75-2FGG484I does not support 5 V-tolerant inputs.

Does XC6SLX75-2FGG484I support partial reconfiguration in production systems?

Yes, XC6SLX75-2FGG484I supports partial reconfiguration through Xilinx ISE Design Suite v14.7 tools and associated bitstream generation flow. This capability allows runtime replacement of logic modules without resetting the entire device, which is validated for use in industrial motor control and PLC applications where continuous operation is critical. XC6SLX75-2FGG484I requires external configuration memory and proper floorplanning to implement this feature reliably.

What configuration modes are supported by XC6SLX75-2FGG484I?

XC6SLX75-2FGG484I supports four primary configuration modes: Master SPI (x1/x2/x4), Slave SelectMAP, Master SelectMAP, and JTAG. Configuration is initiated via PROGRAM_B and controlled by M0/M1/M2 mode pins sampled at power-on. XC6SLX75-2FGG484I does not support passive serial (PROM-based) or BPI parallel modes. External SPI flash is commonly used for autonomous startup.

Is XC6SLX75-2FGG484I compatible with Vivado Design Suite?

No, XC6SLX75-2FGG484I is not supported in Vivado Design Suite. It is exclusively supported by Xilinx ISE Design Suite v14.7, the final and only officially qualified toolchain for Spartan-6 devices. Using Vivado will result in synthesis failure or incorrect timing analysis. XC6SLX75-2FGG484I bitstreams generated in ISE v14.7 are not forward-compatible with newer toolchains.

What thermal considerations apply to XC6SLX75-2FGG484I in industrial enclosures?

XC6SLX75-2FGG484I is rated for industrial temperature range (-40°C to +100°C) and features an exposed thermal pad in its FGG484 package. For reliable operation at maximum junction temperature, a minimum 4-layer PCB with thermal vias under the pad and ≥25 mm² copper pour is recommended. XC6SLX75-2FGG484I power dissipation must be estimated using Xilinx XPE tool with actual toggle rates; typical active power at 100 MHz is 1.8–2.4 W depending on resource usage.