AMD XC6SLX75-2FGG676I

Overview

XC6SLX75-2FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It operates at -2 speed grade with industrial temperature range (-40°C to +100°C) and is used in industrial vision systems requiring deterministic I/O timing and multi-channel image preprocessing.

For engineers reviewing the XC6SLX75-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), integrated DSP48A1 slices for real-time filtering, and support for DDR2/DDR3 memory interfaces in resource-constrained edge nodes.

Technical Context

The XC6SLX75-2FGG676I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 180 DSP48A1 slices optimized for multiply-accumulate operations. It includes 220 user I/O pins organized across 12 I/O banks with independent VCCO and VREF settings per bank.

Configuration is supported via Master SPI, Slave Serial, or JTAG modes, with bitstream encryption available using AES-256. The device integrates 22 PLLs for clock synthesis and jitter reduction, each supporting input frequencies from 10 MHz to 500 MHz and output frequencies up to 1.2 GHz.

Key Specifications

Pinout & Package

XC6SLX75-2FGG676I is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package meets JEDEC MO-251 standard and supports reflow soldering per IPC/JEDEC J-STD-020D.3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.

Compared with XC6SLX75-2FGG676I, the -3 variant trades higher static power for guaranteed timing at elevated frequencies, while the Artix-7 XC7A75T offers superior DSP density and process node advantage but requires board redesign due to non-pin-compatible footprint and different configuration interface.

Availability

XC6SLX75-2FGG676I is available at Aetrix Electronics and suitable for industrial machine vision, programmable logic controllers, and medical imaging front-end systems requiring stable component supply across extended product lifecycles.

Supply support for XC6SLX75-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and automotive environments.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75-2FGG676I?

The XC6SLX75-2FGG676I supports I/O standards from 1.2 V to 3.3 V across its 12 independently powered banks. Each bank's VCCO can be set individually, enabling concurrent interface to devices operating at different voltage levels - for example, 1.8 V sensors and 3.3 V communication controllers - without external level-shifting circuitry. This capability is verified in Xilinx DS162 v2.5 specification table 1-3.

Does XC6SLX75-2FGG676I include built-in security features for configuration protection?

Yes, XC6SLX75-2FGG676I includes hardware-accelerated AES-256 bitstream encryption. When enabled, the FPGA decrypts the configuration bitstream on-the-fly during startup using a 256-bit key stored in on-chip eFUSE. This prevents unauthorized access to design IP and mitigates cloning risks in deployed field equipment. Key programming and encryption are supported through Xilinx iMPACT and Vivado tools.

Can XC6SLX75-2FGG676I interface directly with DDR3 SDRAM?

Yes, XC6SLX75-2FGG676I supports DDR3 SDRAM interfaces up to 800 Mb/s data rate using its dedicated DQS and DM pins and built-in IDELAY/ODELAY primitives. Xilinx UG388 v1.11 confirms that the device meets JEDEC DDR3 timing requirements when used with appropriate PCB layout practices and memory controller IP. No external PHY is required for basic point-to-point connections.

How many PLLs does XC6SLX75-2FGG676I contain, and what are their frequency limits?

XC6SLX75-2FGG676I contains 22 digital PLLs. Each accepts input frequencies from 10 MHz to 500 MHz and generates output frequencies up to 1.2 GHz. These PLLs support fractional-N synthesis, phase shifting, and dynamic reconfiguration - essential for synchronizing multi-sensor capture in industrial vision systems using the XC6SLX75-2FGG676I.

Is XC6SLX75-2FGG676I qualified for industrial temperature operation?

Yes, XC6SLX75-2FGG676I is rated for industrial temperature range (-40°C to +100°C) and is tested per Xilinx specification DS162 v2.5. Its thermal performance and timing models are validated across this full range, making it suitable for fanless enclosures and outdoor equipment where ambient temperatures exceed commercial-grade limits. No derating is required within this envelope.