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AMD XC6SLX75-3CSG484I
- Part No.:
- XC6SLX75-3CSG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX75-3CSG484I.pdf
- Description:
- IC FPGA 328 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,862
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Product details
Overview
XC6SLX75-3CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.3 V I/O voltage support, -3 speed grade, and 484-pin CSG package. It integrates block RAM, DSP48A1 slices, and SelectIO technology for high-speed interface implementation in industrial control and communications infrastructure.
For engineers reviewing the XC6SLX75-3CSG484I datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O count (348 user I/Os), speed grade (-3), thermal performance (industrial temperature range –40°C to +100°C), and configuration interface options (JTAG, Master SPI, Slave SelectMAP).
Technical Context
The XC6SLX75-3CSG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It supports multi-standard I/O banks with programmable drive strength, slew rate, and on-chip termination (up to 50 Ω or 75 Ω).
Configuration is performed via JTAG, serial (Master/Slave SPI), or parallel (SelectMAP) modes. Built-in clock management includes DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty cycle correction across up to 16 global clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational and sequential logic density for system-on-chip integration |
| User I/O Pins | 348 - supports high-pin-count interfaces such as DDR2/DDR3 memory, Gigabit Ethernet PHY, and PCI Express Gen1 |
| Block RAM | 3,008 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 180 - provides dedicated 18×18-bit multiplier-accumulators for filtering, FFT, and motor control algorithms |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies within industrial temperature range |
| Operating Temperature | –40°C to +100°C - qualified for extended-temperature industrial and outdoor embedded applications |
| I/O Voltage Support | 1.2 V to 3.3 V - allows mixed-voltage interfacing with legacy and modern peripherals |
Pinout & Package
XC6SLX75-3CSG484I is housed in a 484-ball CSG (Chip-Scale Grid Array) package with 0.8 mm pitch, 23 × 23 mm body size, and exposed thermal pad for enhanced thermal dissipation in high-utilization designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVDS or SSTL-18 interfaces |
| K1 | CONFIG_IO | Configuration mode select - pulled high for Master SPI, low for JTAG or Slave SelectMAP |
| T1 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration and clears internal state on falling edge |
| V1 | INIT_B | Open-drain status output - indicates configuration completion or error during startup |
| Y2 | CCLK | Configuration clock input - driven externally in Master SPI mode; outputs clock in Slave mode |
| W3 | DONE | Open-drain configuration status - goes high when bitstream loading completes and device is operational |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device - enable jitter-tolerant clock synthesis and phase alignment for multi-clock domain systems |
| SelectIO Technology | Supports 18 I/O standards including LVCMOS, LVDS, SSTL, HSTL - eliminates level-shifter ICs in mixed-signal boards |
| Embedded Memory | 3,008 kbits of block RAM + distributed RAM - reduces external memory footprint for real-time buffering and control state storage |
| PCI Express Endpoint | Gen1 x1 endpoint capability - enables direct host communication without bridge chips in compact embedded controllers |
| Power-Optimized Architecture | Multi-rail I/O and core voltage separation - allows dynamic I/O voltage scaling and selective bank shutdown during low-power states |
Applications
| Industrial PLC Controller | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time motion control and sensor fusion in modular programmable logic controllers. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic ladder logic and closed-loop PID control with sub-microsecond latency. Use Value: 348 user I/Os interface directly with analog input modules, digital I/O cards, and EtherCAT PHYs without glue logic. | Use Scenario: High-speed data aggregation from ultrasound transducer arrays and ADC front-ends. IC Role / Device Role / Timing Role: XC6SLX75-3CSG484I acts as a real-time preprocessing engine for beamforming and echo digitization. Use Value: 180 DSP48A1 slices accelerate FIR filtering and envelope detection; block RAM buffers raw RF samples before compression. |
| Wireless Baseband Unit | Avionics Data Concentrator |
Use Scenario: LTE-TDD baseband processing in small-cell remote radio units. IC Role / Device Role / Timing Role: Configurable logic implements channel estimation, OFDM modulation/demodulation, and MAC-layer scheduling. Use Value: -3 speed grade ensures timing closure at 125 MHz system clock; SelectIO supports DDR2 memory interface for frame buffering. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control computers. IC Role / Device Role / Timing Role: XC6SLX75-3CSG484I serves as protocol-aware data concentrator with deterministic latency and dual-redundant I/O paths. Use Value: Industrial temperature rating (–40°C to +100°C) and configuration security features meet DO-254 design assurance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2CSG324C | Fewer logic cells (9,152), lower speed grade (-2), smaller 324-pin CSG package | Suitable for cost-sensitive, lower-complexity control tasks with ≤200 I/Os | Select when full XC6SLX75-3CSG484I resources are unnecessary and board space is constrained |
| XC7S25-1CSGA225I | Artix-7 architecture, higher logic density per mm², integrated PCIe Gen2 block, no DCMs (uses MMCM) | Better suited for new designs requiring higher bandwidth, lower power, or Gen2 PCIe endpoints | Choose XC7S25-1CSGA225I for migration paths where long-term availability and advanced features outweigh legacy toolchain compatibility |
Compared with XC6SLX75-3CSG484I, XC6SLX9-2CSG324C offers reduced cost and footprint but lacks sufficient logic and I/O for complex protocols like DDR3 or multi-channel Ethernet. XC7S25-1CSGA225I delivers improved DSP efficiency and Gen2 PCIe, yet requires Vivado toolchain and has different configuration and clocking architecture.
Availability
XC6SLX75-3CSG484I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and wireless infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75-3CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-6 family was designed for high-volume, cost-sensitive applications demanding reliable performance, low power, and broad I/O flexibility in industrial and communications equipment.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75-3CSG484I?
The XC6SLX75-3CSG484I supports I/O voltages from 1.2 V to 3.3 V across its 18 configurable I/O banks. Each bank operates independently, enabling mixed-voltage operation - for example, interfacing 1.8 V DDR2 memory while driving 3.3 V GPIOs. VCCO must match the selected I/O standard's required voltage, and all pins in a bank share the same VCCO rail.
Does XC6SLX75-3CSG484I support JTAG boundary-scan testing?
Yes, XC6SLX75-3CSG484I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, and TCK pins are dedicated and compliant with standard JTAG chains. Boundary-scan instructions include SAMPLE/PRELOAD, EXTEST, and IDCODE, and the device reports a unique 32-bit IDCODE consistent with Spartan-6 family identification.
Can XC6SLX75-3CSG484I configure from a serial flash device?
Yes, XC6SLX75-3CSG484I supports Master SPI configuration mode, allowing it to boot directly from industry-standard SPI flash devices such as Micron MT25QL or Winbond W25Q series. In this mode, the FPGA drives the CCLK signal and reads the configuration bitstream sequentially, eliminating the need for an external controller or microprocessor during power-up.
What is the purpose of the INIT_B pin on XC6SLX75-3CSG484I?
The INIT_B pin on XC6SLX75-3CSG484I is an open-drain, active-low output that signals configuration status. It asserts low during power-up and remains low until configuration begins; it goes high upon successful bitstream loading and completion of startup sequence. If configuration fails (e.g., CRC error), INIT_B pulses low again, providing visible feedback for debug and system monitoring.
Is XC6SLX75-3CSG484I qualified for automotive applications?
No, XC6SLX75-3CSG484I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While its thermal rating overlaps with some automotive under-hood environments, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive use, AMD recommends the XA Spartan-6 family variants, which are explicitly qualified and marked with "XA" prefix.
XC6SLX75-3CSG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 328
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX75-3CSG484I FAQ
1.How can I place an order for XC6SLX75-3CSG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-3CSG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-3CSG484I reliable?
The price and inventory of XC6SLX75-3CSG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3CSG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-3CSG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3CSG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-3CSG484I?
XC6SLX75-3CSG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-3CSG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-3CSG484I?
For technical support, including XC6SLX75-3CSG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3CSG484I requirements.
6.How does Aetrix verify that XC6SLX75-3CSG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-3CSG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3CSG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-3CSG484I?
All XC6SLX75-3CSG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3CSG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-3CSG484I part is unused and in its original packaging.
Return procedure for XC6SLX75-3CSG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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