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AMD XC6SLX75-3FG676C
- Part No.:
- XC6SLX75-3FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75-3FG676C.pdf
- Description:
- IC FPGA 408 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,162
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Product details
Overview
XC6SLX75-3FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4,992 Kbits of block RAM. It operates at -3 speed grade (1.2 V core, 1.2 GHz I/O), housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, and targets high-volume industrial control and embedded vision systems.
For engineers reviewing the XC6SLX75-3FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX75-3FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP slices for multiply-accumulate operations, and integrated clock management using DCM and PLL blocks. It supports multi-standard I/O banks with programmable drive strength and slew rate control across 12 I/O banks.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG interfaces, with bitstream encryption and readback protection available. The device uses 45 nm process technology and supports partial reconfiguration for dynamic function swapping without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 - supports high-density peripheral interfacing including parallel buses and multiple camera links |
| Block RAM | 4,992 Kbits - enables on-chip buffering for video frame storage or protocol stack data handling |
| DSP Slices | 180 - provides fixed-point arithmetic acceleration for real-time filtering and motor control algorithms |
| Speed Grade | -3 - guarantees timing closure up to 1.2 GHz I/O toggle rate and 500 MHz internal clock frequency |
| Package | 676-pin FBGA (27×27 mm, 1.0 mm pitch) - enables high I/O density with manageable thermal dissipation in industrial enclosures |
Pinout & Package
XC6SLX75-3FG676C is packaged in a 676-ball fine-pitch BGA (FG676) with 12 I/O banks, power/ground ball distribution optimized for signal integrity, and dedicated configuration and clock pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets voltage level (1.2–3.3 V) for all pins in bank 0 |
| A2 | IO_L0N_0 | Differential input pair - supports LVDS receive at up to 840 Mbps per lane |
| B1 | IO_L0P_0 | Differential input pair - paired with A2 for noise-immune high-speed data capture |
| T17 | M0 | Mode pin - selects configuration mode (e.g., Master SPI when pulled high) |
| R16 | CCLK | Configuration clock - drives external PROM or controls bitstream load timing during startup |
| P15 | DIN | Serial configuration data input - receives bitstream from SPI flash memory |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs and one PLL per device - enables precise clock synthesis, phase alignment, and jitter reduction for multi-domain timing |
| Multi-Standard I/O | Supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and TMDS - eliminates level-shifting ICs in mixed-voltage systems |
| Partial Reconfiguration | Enables dynamic logic module swapping - reduces downtime in field-upgradable industrial controllers |
| Embedded Security | Bitstream encryption and readback disable - protects IP in deployed edge devices against reverse engineering |
| Low-Power Architecture | 45 nm process with dual-VCC design - achieves 25% lower static power vs. Virtex-5 at comparable logic density |
Applications
| Industrial PLC I/O Module | Embedded Vision Camera Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response under cyclic scan execution. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and high-speed serial-to-parallel conversion for sensor/actuator data aggregation. Use Value: 480 user I/Os and -3 speed grade enable simultaneous control of >64 discrete channels with sub-microsecond latency. | Use Scenario: High-resolution image acquisition from dual CMOS sensors with pixel clock synchronization. IC Role / Device Role / Timing Role: Timing-critical interface bridge between MIPI CSI-2 receivers and DDR3 memory controller. Use Value: LVDS-capable I/O banks and 180 DSP slices allow real-time Bayer demosaicing and histogram calculation on-chip. |
| Medical Imaging Front-End | Avionics Data Concentrator |
Use Scenario: Ultrasound beamforming subsystem requiring low-jitter sampling clock generation and channel delay calibration. IC Role / Device Role / Timing Role: Clock manager generates synchronized sampling clocks; CLBs implement delay-line calibration logic. Use Value: Integrated DCM/PLL blocks achieve <50 ps peak-to-peak jitter, meeting IEC 62304 Class C timing safety requirements. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in compact flight control units. IC Role / Device Role / Timing Role: Protocol engine implementing Manchester decoding, parity checking, and message queuing. Use Value: Partial reconfiguration allows in-field updates of bus protocol firmware without hardware replacement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2TQG144C | Fewer logic cells (9,152), 102 user I/Os, TQFP-144 package | Limited to single-sensor interfaces or simple control logic; no multi-camera support | Select when board space and cost constrain complexity, and I/O count <120 suffices |
| XC7A75T-2CSG324C | Artix-7 architecture, 74,400 logic cells, 210 user I/Os, smaller 324-pin CSPBGA | Higher DSP density (210 slices) but fewer I/Os; better for compute-heavy, I/O-light tasks | Choose for new designs needing PCIe Gen2 or transceivers; not drop-in compatible |
Compared with XC6SLX75-3FG676C, XC6SLX9-2TQG144C trades I/O count and logic capacity for lower cost and simpler layout, while XC7A75T-2CSG324C offers advanced features like built-in transceivers and AXI interconnect but requires PCB redesign and toolchain migration.
Availability
XC6SLX75-3FG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX75-3FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now leads in adaptive computing solutions, delivering FPGAs, ACAPs, and software-defined platforms for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and long-term availability - especially in industrial control, display, and connectivity systems.
FAQ
What is the maximum operating temperature for XC6SLX75-3FG676C?
The XC6SLX75-3FG676C is rated for commercial temperature range (0°C to +85°C ambient). Its thermal design supports continuous operation at full utilization in forced-air-cooled enclosures. Derating curves in DS162 specify junction temperature limits up to 100°C, and thermal resistance (θJA) is 12.5°C/W for the FG676 package under standard JEDEC conditions.
Does XC6SLX75-3FG676C support JTAG boundary-scan testing?
Yes, XC6SLX75-3FG676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, TCK, and TRST pins are dedicated and electrically isolated during normal operation. Boundary-scan instruction register includes BYPASS, SAMPLE/PRELOAD, EXTEST, and IDCODE modes as defined in DS162.
Can XC6SLX75-3FG676C be configured via SPI flash memory?
Yes, XC6SLX75-3FG676C supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices. The M0–M2 pins configure boot mode, and DIN/CCLK pins interface directly to flash. Configuration bitstream is loaded automatically on power-up, with CRC verification and fallback support if enabled in bitstream generation.
What I/O standards does XC6SLX75-3FG676C support in Bank 1?
XC6SLX75-3FG676C Bank 1 supports LVCMOS33, LVCMOS25, LVCMOS18, LVTTL, and SSTL18_I. It does not support differential standards or higher-voltage SSTL variants in this bank. Voltage reference (VREF) must be supplied externally when using SSTL or calibrated input standards, and each I/O pin's standard is set individually via configuration bits.
Is partial reconfiguration supported on XC6SLX75-3FG676C?
Yes, partial reconfiguration is supported on XC6SLX75-3FG676C using the Xilinx ISE Design Suite with PlanAhead tools. It requires specific floorplanning, modular HDL coding, and bitstream generation with PR-enabled configuration frames. Verified use cases include dynamic filter coefficient updates and protocol engine swaps without resetting the entire FPGA fabric.
XC6SLX75-3FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75-3FG676C FAQ
1.How can I place an order for XC6SLX75-3FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-3FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-3FG676C reliable?
The price and inventory of XC6SLX75-3FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-3FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-3FG676C?
XC6SLX75-3FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-3FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-3FG676C?
For technical support, including XC6SLX75-3FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3FG676C requirements.
6.How does Aetrix verify that XC6SLX75-3FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-3FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-3FG676C?
All XC6SLX75-3FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-3FG676C part is unused and in its original packaging.
Return procedure for XC6SLX75-3FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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