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AMD XC6SLX75-3FG676I

Part No.:
XC6SLX75-3FG676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC6SLX75-3FG676I.pdf
Description:
IC FPGA 408 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,703

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Product details

Overview

XC6SLX75-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and -3 speed grade operating over -40°C to +100°C industrial temperature range. It integrates block RAM, DSP slices, and clock management tiles for embedded vision and industrial control applications.

For engineers reviewing the XC6SLX75-3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS support, internal configuration memory, and JTAG boundary-scan compliance.

Technical Context

The XC6SLX75-3FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic and shift registers. It includes six CMT clock management tiles supporting phase-matched dual-clock outputs and spread-spectrum clocking.

Configuration is performed via Master SPI or JTAG mode using internal 256-bit configuration memory. The device supports partial reconfiguration and uses SelectIO technology for programmable I/O standards including LVCMOS, LVDS, and SSTL.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells74,880 - total configurable logic resources for combinational and sequential logic implementation
User I/O Pins480 - supports high-density interface routing with bank-wise voltage assignment
Block RAM3,004 kbits - distributed across 234 blocks for data buffering and FIFOs
DSP Slices180 - each performs 18×18-bit multiply-accumulate in one cycle
Speed Grade-3 - guarantees timing closure at highest performance tier for this family
Operating Temp-40°C to +100°C - qualified for extended industrial environments
PackageFG676 - 676-pin Fine-Pitch BGA with 1.0 mm pitch and 27×27 mm body

Pinout & Package

XC6SLX75-3FG676I is housed in a 676-pin Fine-Pitch Ball Grid Array (FG676) package with 1.0 mm ball pitch and 27×27 mm footprint. Thermal pad exposed on underside supports conduction cooling in high-power operation.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 output supply - sets voltage level for associated LVCMOS/LVDS outputs
P2IO_L1P_0Differential I/O pair positive - supports LVDS, TMDS, or RSDS signaling
R1IO_L1N_0Differential I/O pair negative - paired with P2 for noise-immune differential signaling
T14M0/M1/M2Configuration mode select - determines boot source (SPI/JTAG/Slave Serial)
V17TCK/TMS/TDI/TDOJTAG boundary-scan interface - enables IEEE 1149.1 test and programming
Y16VCCAUX1.8 V auxiliary supply - powers configuration logic and PLLs

Key Features

FeatureDesign Value
Integrated Clock ManagementSix CMTs with DCM and PLL provide jitter filtering, frequency synthesis, and phase alignment
SelectIO TechnologySupports 21 I/O standards including LVDS, SSTL-2, HSTL-I, and PCI-X 1.0
Internal Configuration Memory256-bit one-time-programmable memory stores configuration mode and security settings
Partial ReconfigurationEnables dynamic logic module swapping without full device reset or system interruption
Embedded Block RAMConfigurable as true dual-port RAM, ROM, or shift register with byte-write enable

Applications

Industrial PLC ControllersVideo Surveillance Encoders

Use Scenario: Real-time motion detection and multi-channel video compression in outdoor IP cameras.

IC Role / Device Role / Timing Role: FPGA fabric executes custom video preprocessing pipelines and interfaces with H.264/H.265 encoder ASICs via parallel BT.656 or MIPI CSI-2 bridge logic.

Use Value: 480 user I/Os enable concurrent sensor input, DDR2 memory interface, and Gigabit Ethernet MAC integration on single XC6SLX75-3FG676I.

Use Scenario: Deterministic I/O scanning and safety-critical logic execution in modular automation systems.

IC Role / Device Role / Timing Role: Configurable logic implements cyclic I/O mapping, watchdog timers, and SIL2-compliant fail-safe state machines.

Use Value: -40°C to +100°C operating range and built-in JTAG boundary-scan ensure long-term reliability and field diagnostics in uncooled control cabinets.

Medical Imaging Front-EndAvionics Data Concentrators

Use Scenario: Time-aligned acquisition of ultrasound echo data from 64+ transducer channels.

IC Role / Device Role / Timing Role: XC6SLX75-3FG676I synchronizes ADC sampling clocks, buffers raw data in block RAM, and formats packets for PCIe endpoint transmission.

Use Value: 180 DSP slices accelerate beamforming calculations while LVDS I/O ensures low-noise analog front-end interfacing.

Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and AFDX endpoints in flight control units.

IC Role / Device Role / Timing Role: FPGA implements deterministic time-triggered communication stacks and hardware CRC offload engines.

Use Value: Six CMT clock management tiles generate phase-aligned clocks for multiple legacy bus interfaces without external jitter cleaners.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX9-2TQG144CFewer logic cells (5,720), smaller TQFP-144 package, commercial temp range onlyLimited to low-complexity control logic; no transceiver support or block RAM depth for video bufferingChoose when cost-sensitive, space-constrained designs require only basic glue logic and GPIO expansion
XC7A35T-2CSG324IArtix-7 architecture, higher logic density (33,280 LUTs), 6.6 Gb/s transceivers, and integrated PCIe blockBetter suited for high-throughput serial protocols and embedded processing with MicroBlaze soft-corePrefer when migrating legacy Spartan-6 designs toward higher bandwidth, lower power, or integrated hard IP requirements

Compared with XC6SLX9-2TQG144C, the XC6SLX75-3FG676I delivers 13× more logic and industrial temperature support; versus XC7A35T-2CSG324I, it offers mature toolchain stability and lower gate delay variability but lacks native PCIe and hardened floating-point units.

Availability

XC6SLX75-3FG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and avionics applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC6SLX75-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O flexibility - especially in industrial and video infrastructure.

FAQ

What is the maximum supported I/O standard voltage for XC6SLX75-3FG676I?

The XC6SLX75-3FG676I supports I/O bank voltages from 1.2 V to 3.3 V, with individual banks configurable for LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, and differential standards like LVDS and RSDS. Each bank's VCCO must match its assigned I/O standard's required voltage.

Does XC6SLX75-3FG676I include built-in configuration memory?

Yes, the XC6SLX75-3FG676I contains 256-bit one-time-programmable (OTP) memory used to store configuration mode bits (M[2:0]), startup clock selection, and security settings. This eliminates need for external mode resistors in most board designs.

Can XC6SLX75-3FG676I operate in partial reconfiguration mode?

Yes, the XC6SLX75-3FG676I supports partial reconfiguration through Xilinx ISE Design Suite tools. This allows dynamic replacement of logic modules while keeping other portions of the design active - critical for runtime adaptation in video processing or protocol switching applications.

What clock resources are available on XC6SLX75-3FG676I?

The XC6SLX75-3FG676I integrates six Clock Management Tiles (CMTs), each containing a Digital Clock Manager (DCM) and Phase-Locked Loop (PLL). These support frequency synthesis, duty-cycle correction, phase shifting, and jitter reduction for up to 12 independent clock domains.

Is XC6SLX75-3FG676I qualified for automotive applications?

No, the XC6SLX75-3FG676I is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, designers should consider Xilinx Automotive (XA) variants such as XC6SLX75-3CSG484I or newer AMD Versal derivatives with automotive qualification.

XC6SLX75-3FG676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
5831
Number of Logic Elements/Cells:
74637
Total RAM Bits:
3170304
Number of I/O:
408
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC6SLX75-3FG676I FAQ

1.How can I place an order for XC6SLX75-3FG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX75-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX75-3FG676I reliable?

The price and inventory of XC6SLX75-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3FG676I is usually 5 days.

3.What payment methods are accepted for XC6SLX75-3FG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3FG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX75-3FG676I?

XC6SLX75-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX75-3FG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX75-3FG676I?

For technical support, including XC6SLX75-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3FG676I requirements.

6.How does Aetrix verify that XC6SLX75-3FG676I is sourced from the original manufacturer or authorized distributors?

All XC6SLX75-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3FG676I meets industry standards.

7.What is the process for return or replacement of XC6SLX75-3FG676I?

All XC6SLX75-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3FG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX75-3FG676I part is unused and in its original packaging.

Return procedure for XC6SLX75-3FG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX75-3FG676I Tags

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