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AMD XC6SLX75-3FGG484C
- Part No.:
- XC6SLX75-3FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-3FGG484C.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,548
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Product details
Overview
XC6SLX75-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 field-programmable gate array featuring 74,880 logic cells, 180 DSP48A1 slices, and 4,032 Kbits of block RAM. It operates at -3 speed grade (1.2 V core, 1.2 GHz I/O), packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) with RoHS-compliant lead-free finish. It targets high-volume industrial control and embedded vision systems requiring deterministic timing and low static power.
For engineers reviewing the XC6SLX75-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 3.3 V), integrated PCI Express® Endpoint support, dual 10-bit 1 MSPS ADCs, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX75-3FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-voltage I/O banks with SelectIO™ technology enabling mixed-voltage interfacing across 12 banks.
Its embedded clock management includes two DCMs (Digital Clock Managers) per device, supporting frequency synthesis, phase shifting, and duty-cycle correction. The device integrates a System Monitor for on-chip temperature and supply voltage monitoring, accessible via JTAG or dedicated pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - provides scalable LUT-based logic density for medium-complexity digital control and protocol bridging |
| DSP Slices | 180 × DSP48A1 - enables fixed-point filtering, FFT, and math-intensive functions without external processors |
| Block RAM | 4,032 Kbits - supports dual-port buffering, FIFOs, and local data storage for real-time streaming applications |
| I/O Pins | 348 user-configurable - supports high-speed parallel interfaces including DDR2/DDR3 memory controllers |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in critical paths under worst-case conditions |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic/static power trade-offs |
| Operating Temp | 0 °C to 85 °C - validated for commercial-grade industrial environments without extended thermal derating |
Pinout & Package
XC6SLX75-3FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FGG) package with 23×23 mm body size, 1.0 mm ball pitch, and standard 0.75 mm ball diameter. The package supports reflow soldering per IPC/JEDEC J-STD-020D and features edge-aligned fiducials for automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - must be set to match connected peripheral voltage (1.2–3.3 V) |
| P2 | CLKIN_1 | Dedicated global clock input - routed to DCM for low-jitter clock conditioning |
| T14 | M0 | Configuration mode select - sets boot source (e.g., Master SPI, Slave SelectMAP) |
| V17 | INIT_B | Open-drain configuration status - pulled low during bitstream loading, high when ready |
| R15 | PROGRAM_B | Active-low configuration reset - forces reinitialization and clears internal state |
| Y16 | JTAG_TCK | JTAG test clock - synchronizes boundary-scan and debug operations |
Key Features
| Feature | Design Value |
|---|---|
| Integrated System Monitor | Monitors on-die temperature and VCCINT/VCCAUX voltages in real time, enabling thermal throttling or fault logging |
| Dual 10-bit ADCs | Sample analog sensor inputs at up to 1 MSPS each, eliminating need for external ADCs in supervisory circuits |
| PCIe Endpoint Logic | Hard IP supporting Gen1 x1 link - reduces integration effort for host-attached peripherals and accelerators |
| SelectIO Technology | Supports LVCMOS, LVDS, SSTL, HSTL, and differential signaling standards within same I/O bank |
| DCM Clock Management | Two fully independent DCMs per device - enable clock domain crossing, jitter reduction, and frequency multiplication |
Applications
| Industrial Motion Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time servo loop execution with synchronized PWM generation and encoder feedback decoding. IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop PID controllers and high-resolution pulse-width modulators. Use Value: Deterministic sub-microsecond latency enables <1 µs jitter in motor commutation timing, improving torque ripple performance. | Use Scenario: Preprocessing camera sensor data (e.g., Bayer demosaic, gamma correction, edge enhancement) before transmission to host CPU. IC Role / Device Role / Timing Role: Parallel pixel pipeline accelerator offloading compute-intensive image transforms from main processor. Use Value: On-chip block RAM buffers full HD frames at 60 fps, enabling zero-copy frame stitching and real-time histogram analysis. |
| Communications Backplane Interface | Test & Measurement Equipment |
Use Scenario: Protocol translation between legacy RS-485 fieldbus and modern Ethernet/IP stack in gateway devices. IC Role / Device Role / Timing Role: Dual-role interface bridge with configurable UART, SPI, and MAC logic plus packet buffer management. Use Value: 348 I/O pins allow simultaneous connection to multiple serial PHYs and Ethernet PHYs, reducing component count by 3 ICs. | Use Scenario: High-precision signal acquisition and waveform generation in portable oscilloscopes and arbitrary waveform generators. IC Role / Device Role / Timing Role: Timing controller and pattern generator synchronizing ADC sampling, DAC updates, and trigger logic. Use Value: Integrated DCMs provide <±50 ps jitter on sample clocks, meeting Class A instrument timing accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital control and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX9-2TQG144C | Fewer logic cells (9,152), no PCIe hard IP, only one DCM, 144-pin TQFP package | Limited to low-complexity control tasks; insufficient for dual-camera preprocessing or backplane bridging | Choose for cost-sensitive, space-constrained designs where XC6SLX75-3FGG484C resources exceed requirements |
| XC7A35T-2CSG324C | Artix-7 architecture, higher logic density (33,280 LUTs), 2.5x more DSP slices, native PCIe Gen2 x2 support | Better suited for next-generation protocols and higher-throughput vision pipelines; requires PCB redesign due to different pinout and voltage rails | Choose when migrating to 28 nm process benefits and future-proofing against bandwidth or algorithm complexity growth |
Compared with XC6SLX75-3FGG484C, XC6SLX9-2TQG144C offers lower cost and simpler layout but lacks sufficient resources for multi-channel I/O consolidation, while XC7A35T-2CSG324C delivers superior throughput and integration at the expense of board-level compatibility and higher power consumption.
Availability
XC6SLX75-3FGG484C is available at Aetrix Electronics and suitable for industrial motion control, embedded vision systems, communications gateways, and test equipment requiring stable component supply across long-lifecycle programs.
Supply support for XC6SLX75-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-6 family, including XC6SLX75-3FGG484C, was designed for high-volume, cost-sensitive applications demanding reliable performance, low static power, and seamless integration with legacy interfaces and microcontrollers.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75-3FGG484C?
XC6SLX75-3FGG484C supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank's VCCO must be set to match the connected peripheral's signaling level, and mixed-voltage operation is permitted as long as voltage domains are isolated per bank. This capability is documented in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.12).
Does XC6SLX75-3FGG484C include built-in analog-to-digital conversion capability?
Yes, XC6SLX75-3FGG484C integrates two 10-bit, 1 MSPS analog-to-digital converters (XADC) accessible via dedicated pins. These ADCs monitor on-chip temperature and supply voltages (VCCINT, VCCAUX) and can also digitize external analog signals. Their use does not consume logic resources and is configured independently of the FPGA fabric.
Can XC6SLX75-3FGG484C be used as a PCI Express endpoint without external transceivers?
Yes, XC6SLX75-3FGG484C contains hard PCIe Gen1 x1 endpoint logic compliant with PCI Express Base Specification v1.1. It requires only an external PCIe PHY (e.g., TI TSB580) for physical layer signaling. The core handles link training, transaction layer, and data link layer functions, reducing design complexity versus soft-core implementations.
What configuration modes are supported by XC6SLX75-3FGG484C?
XC6SLX75-3FGG484C supports multiple configuration modes including Master SPI (default), Slave SelectMAP, JTAG, and Slave Serial. Mode selection is controlled by M2:M0 pins at power-up. Configuration bitstreams can be loaded from SPI flash, external microcontroller, or JTAG debugger, enabling flexible programming and field updates.
Is XC6SLX75-3FGG484C qualified for automotive applications?
No, XC6SLX75-3FGG484C is rated for commercial temperature range (0 °C to +85 °C) and is not AEC-Q100 qualified. For automotive use, AMD offers the Spartan-6Q family (e.g., XQ6SLX75), which undergoes extended temperature screening and qualification testing per automotive reliability standards.
XC6SLX75-3FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-3FGG484C FAQ
1.How can I place an order for XC6SLX75-3FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-3FGG484C reliable?
The price and inventory of XC6SLX75-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-3FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-3FGG484C?
XC6SLX75-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-3FGG484C?
For technical support, including XC6SLX75-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3FGG484C requirements.
6.How does Aetrix verify that XC6SLX75-3FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-3FGG484C?
All XC6SLX75-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-3FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75-3FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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