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AMD XC6SLX75-3FGG484I
- Part No.:
- XC6SLX75-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-3FGG484I.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:108
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Product details
Overview
XC6SLX75-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 74,880 logic cells, 3.2 Gb/s transceiver capability, and embedded Block RAM totaling 3,001 kbits. It features 348 user I/Os in a 484-pin Fine-Pitch BGA package and operates across industrial temperature range (–40°C to +100°C), targeting high-reliability embedded control and interface bridging applications.
For engineers reviewing the XC6SLX75-3FGG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade (-3), thermal performance in FGG484 packaging, and compatibility with Spartan-6 design toolchain and IP libraries.
Technical Context
The XC6SLX75-3FGG484I implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with 18×18 multipliers and integrated clock management tiles (CMT) containing DCMs and PLLs. It supports SelectIO standards including LVCMOS, LVDS, and SSTL up to 1.0 Gbps per differential pair.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and fallback modes. The device includes internal configuration memory and supports bitstream encryption using AES-256 for secure programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 3,001 kbits - provides on-chip memory for FIFOs, buffers, or small lookup tables without external memory |
| User I/Os | 348 - enables high-density peripheral interfacing with voltage- and standard-flexible banks |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency within Spartan-6 family specifications |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating or forced cooling |
| Package | FGG484 - 484-pin Fine-Pitch BGA with 23×23 mm body and 1.0 mm ball pitch, compatible with standard SMT reflow |
Pinout & Package
XC6SLX75-3FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG484) package with 23×23 array, 1.0 mm ball pitch, and 0.8 mm ball diameter. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output supply - must be decoupled locally for signal integrity |
| A1 | GCLK1 | Global clock input - low-skew routing to all clock regions |
| P2 | M0 | Configuration mode select - sets boot source (SPI/JTAG) |
| T1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence |
| Y2 | DONE | Open-drain status indicator - goes high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Two DCMs and one PLL per CMT - enables precise clock synthesis, phase alignment, and jitter reduction for synchronous subsystems |
| SelectIO Technology | Support for 18 I/O standards including LVDS, SSTL, and HSTL - eliminates level-shifting components in mixed-voltage systems |
| Secure Configuration | AES-256 bitstream encryption - prevents reverse engineering and unauthorized cloning of programmed logic |
| Dual-Boot Capability | Two independent configuration images stored in SPI flash - enables field-upgradable firmware with fail-safe rollback |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric executes closed-loop control algorithms with sub-microsecond latency. Use Value: 348 I/Os allow direct connection to gate drivers, ADCs, and position sensors without glue logic. | Use Scenario: Converting HDMI 1.4a video streams to MIPI DSI for embedded displays. IC Role / Device Role / Timing Role: Implements pixel-clock domain crossing, protocol translation, and packet buffering. Use Value: Embedded Block RAM (3,001 kbits) stores frame buffers sufficient for 720p line-based processing. |
| Medical Imaging Data Acquisition | Avionics Data Concentrator |
Use Scenario: Aggregating and preprocessing sensor data from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Parallel acquisition engine synchronizes multiple ADC channels and applies real-time FIR filtering. Use Value: -3 speed grade ensures deterministic timing for 100+ MSPS sampling clocks with tight setup/hold margins. | Use Scenario: Consolidating ARINC 429, discrete I/O, and CAN FD signals in flight control units. IC Role / Device Role / Timing Role: Protocol-aware bridge with time-triggered scheduling and error detection. Use Value: Industrial temperature rating (–40°C to +100°C) meets DO-160 Section 22 Category E environmental requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-2FGG484C | Slower speed grade (-2), commercial temp range (0°C to +85°C) | Limited to non-industrial ambient conditions; lower max clock frequency | Choose when cost sensitivity outweighs timing margin or extended temperature needs |
| XC6SLX100-3FGG484I | Higher logic density (101,280 LUTs), same package and speed grade | Supports larger designs with more complex datapaths or additional peripherals | Choose when XC6SLX75-3FGG484I resource utilization exceeds 90% in implementation |
Compared with XC6SLX75-3FGG484I, the -2C variant trades timing headroom and temperature range for lower unit cost, while the LX100-3I offers scalable logic capacity without changing PCB layout or thermal design.
Availability
XC6SLX75-3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging data acquisition, and avionics data concentrators requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX75-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-sensitive, high-volume applications demanding low power, small footprint, and reliable I/O flexibility - especially in industrial automation and video infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX75-3FGG484I?
XC6SLX75-3FGG484I supports I/O standards from 1.2 V to 3.3 V across its 12 selectable I/O banks. Each bank is independently configurable for voltage and standard, enabling mixed-voltage interfaces such as 1.8 V LVDS with 3.3 V GPIO on the same device. This capability is documented in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.11).
Does XC6SLX75-3FGG484I include built-in configuration memory?
No, XC6SLX75-3FGG484I does not include on-chip nonvolatile configuration memory. It requires an external serial PROM or flash memory for master SPI configuration. However, it supports bitstream encryption and dual-image storage in external flash, enabling secure and fail-safe reconfiguration. The configuration process is managed entirely by internal startup circuitry.
Can XC6SLX75-3FGG484I operate in a 100°C ambient environment?
Yes, XC6SLX75-3FGG484I is rated for industrial temperature operation from –40°C to +100°C case temperature. Its thermal design, combined with the FGG484 package's exposed thermal pad, allows sustained operation at full performance under these conditions when PCB thermal vias and copper pour are implemented per Xilinx AN677 guidelines.
What configuration modes does XC6SLX75-3FGG484I support?
XC6SLX75-3FGG484I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M[2:0] pins at power-up. Master SPI is most commonly used for standalone operation with external flash, while JTAG is standard for debugging and programming during development.
Is XC6SLX75-3FGG484I compatible with Vivado Design Suite?
No, XC6SLX75-3FGG484I is not supported in Vivado. It requires Xilinx ISE Design Suite 14.7 as the official and final toolchain. ISE 14.7 provides full synthesis, implementation, and simulation support, including access to Spartan-6-specific IP cores and timing analysis engines validated for this device.
XC6SLX75-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-3FGG484I FAQ
1.How can I place an order for XC6SLX75-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-3FGG484I reliable?
The price and inventory of XC6SLX75-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-3FGG484I?
XC6SLX75-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-3FGG484I?
For technical support, including XC6SLX75-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX75-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-3FGG484I?
All XC6SLX75-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX75-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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