AMD XC6SLX75-3FGG676C

Overview

XC6SLX75-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 3.2 MB of total block RAM. It operates at -3 speed grade with 1.2 V core voltage and supports LVDS, SSTL, and HSTL I/O standards. It is used in industrial vision systems for real-time image preprocessing.

For engineers reviewing the XC6SLX75-3FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O bank configuration, embedded memory depth, and speed-grade timing closure requirements.

Technical Context

The XC6SLX75-3FGG676C implements a fully programmable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual-port 18 Kb block RAMs, configurable I/O banks supporting 1.2–3.3 V operation, and clock management tiles with DCMs for frequency synthesis and phase alignment.

It supports JTAG boundary-scan, SelectMAP, and serial PROM configuration modes. The -3 speed grade guarantees maximum internal clock frequencies up to 595 MHz for register-to-register paths and 333 MHz for I/O setup/hold timing under worst-case conditions.

Key Specifications

Pinout & Package

XC6SLX75-3FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FGG676) package with 27×27 array, 1.0 mm ball pitch, and 0.55 mm ball diameter. Thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC6SLX75-3FGG676C, the -2 variant reduces timing margin but lowers power consumption, while the XC6SLX100-3 offers headroom for future feature expansion at identical footprint and thermal profile.

Availability

XC6SLX75-3FGG676C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and avionics data acquisition requiring stable component supply and long-term lifecycle support.

Supply support for XC6SLX75-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 family. AMD is a global leader in adaptive computing, delivering high-performance, energy-efficient silicon solutions.

The Spartan-6 family targets cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low static power - especially in industrial control, video processing, and communications infrastructure.

FAQ

What is the maximum operating junction temperature for XC6SLX75-3FGG676C?

The XC6SLX75-3FGG676C has a maximum operating junction temperature of 85°C, as defined by its commercial temperature grade (C). This rating applies under specified voltage, loading, and airflow conditions per Xilinx DS162. Derating is required above 85°C ambient depending on power dissipation and PCB thermal design.

Does XC6SLX75-3FGG676C support JTAG boundary-scan testing?

Yes, XC6SLX75-3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for interconnect testing and in-system programming. The TDI, TDO, TMS, TCK, and TCK pins are dedicated and electrically compatible with standard JTAG controllers used in production test fixtures.

Can XC6SLX75-3FGG676C interface directly with DDR2 SDRAM?

Yes, XC6SLX75-3FGG676C supports DDR2 SDRAM interfacing via its I/O banks configured for SSTL-18 Class I. It provides source-synchronous capture using IDELAY/ISERDES primitives and meets setup/hold timing for 400 MT/s operation when used with appropriate board layout and termination.

What configuration modes does XC6SLX75-3FGG676C support?

XC6SLX75-3FGG676C supports Master SPI, Slave Serial, Slave Parallel (SelectMAP), and JTAG configuration modes. Mode selection is controlled by M[2:0] pins at power-up, and configuration bitstreams can be loaded from SPI flash, microcontroller, or JTAG debugger.

Is XC6SLX75-3FGG676C RoHS compliant and lead-free?

Yes, XC6SLX75-3FGG676C is RoHS compliant and manufactured with lead-free (Pb-free) packaging per Xilinx specification DS162. The FGG676 package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3.