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AMD XC6SLX75-3FGG676I
- Part No.:
- XC6SLX75-3FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX75-3FGG676I.pdf
- Description:
- IC FPGA 408 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,533
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Product details
Overview
XC6SLX75-3FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 3.2 MB of total block RAM. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and uses a 676-pin Fine-Pitch BGA (FGG) package. It is deployed in industrial motor control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX75-3FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS-compatible banks, dual-register flip-flops per CLB, and support for PCI Express Gen1 endpoint configuration.
Technical Context
The XC6SLX75-3FGG676I implements a hierarchical FPGA architecture with six I/O bank groups, each supporting independent voltage standards (1.2 V to 3.3 V). It integrates dedicated clock management tiles with DCMs (Digital Clock Managers) and PLLs for jitter reduction and frequency synthesis.
Configuration is performed via Master Serial or Slave SelectMAP modes using external SPI flash or processor-controlled parallel interface. Bitstream encryption and readback protection are supported for secure configuration loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 - supports high-density peripheral interfacing with bank-wise voltage flexibility |
| Block RAM | 3,204 kbits - enables on-chip data buffering, FIFOs, and lookup table storage without external memory |
| DSP Slices | 180 - provides dedicated 18×18-bit multiplier-accumulator units for real-time filtering and math-intensive tasks |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies within industrial temperature range |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation environments |
| Package | 676-pin FGG (Fine-Pitch BGA, 27×27 mm, 1.0 mm pitch) - enables high I/O density with thermal and mechanical reliability |
Pinout & Package
The XC6SLX75-3FGG676I is housed in a 676-ball Fine-Pitch BGA (FGG) package with 27×27 array, 1.0 mm ball pitch, and standard thermal pad layout. Pin functions are organized into six I/O banks, each supporting selectable VCCO and VREF voltages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain output signaling successful configuration completion; used for system boot sequencing |
| P17 | INIT_B | Active-low open-drain status signal indicating configuration memory readiness or error condition |
| V16 | CCLK | Configuration clock input for Master Serial mode; drives internal bitstream shift register |
| R15 | M0–M2 | Mode select inputs determining configuration interface (e.g., Master Serial, Slave SelectMAP) |
| Y16 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports concurrent 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces - eliminates level-shifter ICs in mixed-voltage systems |
| Dual-Register Flip-Flops | Each CLB slice includes two independent registers per LUT - enables time-multiplexed logic or pipelined datapaths |
| PCIe Gen1 Endpoint | Hard IP block compliant with PCI Express Base 1.1 specification - reduces integration effort for host communication |
| Embedded Block RAM | Configurable as true dual-port RAM, single-port RAM, or shift register - optimizes memory usage per application need |
| DCM & PLL Clock Management | Provides frequency synthesis, phase shifting, and duty-cycle correction - ensures precise clock domain alignment |
Applications
| Industrial Motor Control | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time closed-loop servo drive with field-oriented control (FOC) and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, current loop computation, and safety monitoring with sub-microsecond latency. Use Value: 480 user I/Os enable direct connection to multiple encoder interfaces, analog front-ends, and isolated gate drivers without glue logic. | Use Scenario: Modular PLC backplane with hot-swappable I/O modules and deterministic cyclic communication. IC Role / Device Role / Timing Role: Configurable logic handles protocol bridging (e.g., EtherCAT to Modbus TCP), cyclic task scheduling, and diagnostics. Use Value: Dual-register flip-flops and deterministic timing allow cycle times under 1 ms while maintaining functional safety compliance. |
| Railway Signaling Interface | Test & Measurement Equipment |
Use Scenario: EN 5012x-compliant trackside interlocking unit interfacing with relay-based signaling circuits. IC Role / Device Role / Timing Role: Implements fail-safe voting logic, watchdog timers, and galvanically isolated input/output conditioning. Use Value: Industrial temperature rating (-40°C to +100°C) and configuration security features meet SIL-3 certification requirements. | Use Scenario: High-speed digital pattern generator with synchronized multi-channel output and jitter analysis capability. IC Role / Device Role / Timing Role: Generates precise stimulus waveforms and captures response data using embedded block RAM as deep sample buffers. Use Value: 3.2 MB block RAM allows >1 million samples per channel at 200 MS/s, eliminating external DDR dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-2FGG676I | Slower -2 speed grade; lower maximum clock frequency and reduced timing margin | Suitable for cost-sensitive designs where full -3 performance is unused | Select when timing closure is achievable at lower frequency targets and industrial temp range remains required |
| XC6SLX100-3FGG676I | Higher logic density (101,280 LCs), same package and speed grade | Required for larger state machines, additional protocol stacks, or expanded I/O aggregation | Choose when design scalability or future feature expansion exceeds XC6SLX75-3FGG676I capacity |
Compared with XC6SLX75-3FGG676I, the -2 variant trades timing margin for cost, while the XC6SLX100-3FGG676I retains identical packaging and speed but adds 26,400 more logic cells - enabling higher integration without PCB redesign.
Availability
XC6SLX75-3FGG676I is available at Aetrix Electronics and suitable for industrial motor control, railway signaling, and programmable logic controller (PLC) applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC6SLX75-3FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-6 family, including XC6SLX75-3FGG676I, was designed for cost-sensitive, high-volume applications demanding low power, small footprint, and industrial-grade reliability - especially in industrial automation and embedded vision.
FAQ
What is the maximum operating frequency of the XC6SLX75-3FGG676I?
The XC6SLX75-3FGG676I is rated for a -3 speed grade, meaning its internal logic and I/O paths are characterized to operate reliably up to 667 MHz for DCM outputs and 333 MHz for general logic paths under industrial temperature conditions. Actual maximum frequency depends on design implementation, routing, and resource utilization - verified during static timing analysis in Vivado or ISE tools.
Does the XC6SLX75-3FGG676I support JTAG boundary-scan testing?
Yes, the XC6SLX75-3FGG676I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated for this function and remain active regardless of configuration mode, enabling in-system verification and fault isolation during manufacturing and field service.
Can the XC6SLX75-3FGG676I be configured using SPI flash memory?
Yes, the XC6SLX75-3FGG676I supports Master Serial configuration mode, where it actively clocks out configuration data from standard SPI flash devices (e.g., Micron, Winbond, Macronix) connected to dedicated CCLK, DIN, and CS_B pins. This method enables single-chip, non-volatile, and fast startup without external controllers.
What I/O standards are supported by the XC6SLX75-3FGG676I?
The XC6SLX75-3FGG676I supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, and RSDS across its six I/O banks. Each bank operates independently at VCCO voltages from 1.2 V to 3.3 V, allowing mixed-standard interfaces on a single device - critical for bridging legacy and modern peripherals.
Is the XC6SLX75-3FGG676I RoHS compliant and lead-free?
Yes, the XC6SLX75-3FGG676I is manufactured in a RoHS-compliant, lead-free process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The FGG676 package uses matte tin finish on solder balls and conforms to IPC/JEDEC J-STD-020D for reflow profile compatibility and long-term reliability.
XC6SLX75-3FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 408
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX75-3FGG676I FAQ
1.How can I place an order for XC6SLX75-3FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-3FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-3FGG676I reliable?
The price and inventory of XC6SLX75-3FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-3FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX75-3FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-3FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-3FGG676I?
XC6SLX75-3FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-3FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-3FGG676I?
For technical support, including XC6SLX75-3FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-3FGG676I requirements.
6.How does Aetrix verify that XC6SLX75-3FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-3FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-3FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX75-3FGG676I?
All XC6SLX75-3FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-3FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-3FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX75-3FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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