My Inquiry
My Account
AMD XC6SLX75-L1FGG484C
- Part No.:
- XC6SLX75-L1FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX75-L1FGG484C.pdf
- Description:
- IC FPGA 280 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,463
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX75-L1FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 74,880 logic cells, 180 DSP48A1 slices, and 4.9 Mb of total block RAM. It operates at -1 speed grade with 1.2 V core voltage and supports LVDS, SSTL, and HSTL I/O standards. It is used in industrial motor control systems requiring deterministic timing and real-time interface bridging.
For engineers reviewing the XC6SLX75-L1FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O bank configuration, differential signaling support per bank, internal clock routing latency, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX75-L1FGG484C implements a configurable logic fabric based on 6-input LUTs and distributed RAM, paired with dedicated carry chains for arithmetic. It integrates dual-register flip-flops per CLB slice and supports up to 24 user clock networks with programmable phase shift via DCM blocks.
I/O banks are organized into four groups (Bank 0–3), each supporting independent VCCO and VREF settings. Each bank provides selectable termination, slew rate control, and differential input/output pairs compliant with ANSI TIA/EIA-644-A for LVDS operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,880 - determines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| DSP Slices | 180 × DSP48A1 - enables parallel multiply-accumulate operations at up to 250 MHz for servo loop filtering |
| Block RAM | 4.9 Mb - supports dual-port buffering for video frame storage or FIFO-based data stream synchronization |
| Speed Grade | -1 - specifies worst-case propagation delay and maximum operating frequency under industrial temperature conditions |
| I/O Standards | LVDS, SSTL-2, SSTL-18, HSTL-I, LVCMOS - allows direct interfacing with DDR2 memory, ADCs, and FPGA-to-FPGA links |
| Configuration Mode | Master SPI, Slave Serial, JTAG - defines boot source flexibility and in-system programming capability |
Pinout & Package
XC6SLX75-L1FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23 mm × 23 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant finish. The package supports thermal dissipation up to 2.8 W under typical industrial operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input - must be filtered with ≥10 µF ceramic + 1 µF ceramic per power rail |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration logic and SelectIO™ buffers - requires separate regulation |
| A12 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration from external flash or host controller |
| T11 | TCK | JTAG test clock input - synchronizes boundary-scan instructions during debug or production test |
| R12 | TMS | JTAG test mode select - controls state transitions in TAP controller for device identification |
| P11 | TDO | JTAG test data output - delivers IDCODE, BYPASS, or sampled pin states during scan operations |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Clock Routing | 24 global clock nets with low-skew distribution - ensures < ±150 ps skew across 90% of CLBs for synchronous control loops |
| DCM Blocks | 4 Digital Clock Managers - provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division |
| SelectIO™ Technology | Per-bank I/O standard selection - enables mixed-voltage interfaces without level-shifter ICs |
| ISE Design Suite Support | Fully supported in Xilinx ISE 14.7 - includes place-and-route, timing analysis, and bitstream generation for this speed grade |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop current/voltage regulators and space-vector PWM modulator with sub-100 ns timing resolution. Use Value: Enables deterministic 20 kHz switching cycles with synchronized ADC sampling and gate driver dead-time insertion. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor device functional testing. IC Role / Device Role / Timing Role: Configurable logic generates multi-channel stimulus waveforms while capturing responses with cycle-accurate timestamping. Use Value: Supports 100+ Mbps vector rates using LVDS I/O banks and internal 200 MHz clock domains for precise timing margins. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Bridging high-speed CMOS image sensor outputs to PCIe-based processing subsystems in portable ultrasound devices. IC Role / Device Role / Timing Role: Acts as serializer/deserializer and protocol translator between parallel sensor bus and AXI4-Stream interface. Use Value: Delivers 1.2 Gbps pixel throughput using 24-bit parallel inputs and 8b/10b encoding over differential lanes. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control computers. IC Role / Device Role / Timing Role: Implements time-triggered communication controllers and watchdog timers with hardware-enforced scheduling. Use Value: Meets DO-254 DAL-B requirements through traceable RTL, constrained placement, and built-in self-test features. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX75-2FGG484C | Faster -2 speed grade with 15% higher max clock frequency and tighter setup/hold margins | Better suited for designs requiring >125 MHz system clocks or tighter timing closure in large datapaths | Select XC6SLX75-2FGG484C only if timing budget exceeds -1 grade margin; otherwise XC6SLX75-L1FGG484C reduces power by ~12% |
| XC6SLX150T-L1FGG676C | Larger logic capacity (147,443 LCs), additional GTX transceivers, and 676-ball package | Required for multi-gigabit serial protocols or when >100 k LCs needed for complex IP integration | XC6SLX150T-L1FGG676C offers scalability but increases PCB layer count and thermal management complexity |
Compared with XC6SLX75-2FGG484C and XC6SLX150T-L1FGG676C, the XC6SLX75-L1FGG484C delivers optimal balance of logic density, I/O flexibility, and thermal efficiency for cost-sensitive industrial control applications where deterministic latency matters more than peak frequency.
Availability
XC6SLX75-L1FGG484C is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX75-L1FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was originally designed by Xilinx for cost-optimized, high-volume applications demanding low power, small footprint, and reliable I/O interfacing - especially in industrial automation and embedded vision.
FAQ
What is the maximum operating junction temperature for XC6SLX75-L1FGG484C?
The XC6SLX75-L1FGG484C has a maximum junction temperature of 100°C under industrial temperature grade (-40°C to +100°C ambient). Thermal design must ensure θJA ≤ 22°C/W with appropriate PCB copper pour and airflow to maintain reliability across full operating range. The XC6SLX75-L1FGG484C datasheet specifies derating curves above 85°C ambient.
Does XC6SLX75-L1FGG484C support partial reconfiguration?
No, the XC6SLX75-L1FGG484C does not support partial reconfiguration. This feature was introduced in 7-series FPGAs and later architectures. The XC6SLX75-L1FGG484C supports full reconfiguration only via JTAG, Master SPI, or Slave Serial modes. Configuration bitstream loading for XC6SLX75-L1FGG484C is atomic and requires complete reload.
Which configuration memory types are compatible with XC6SLX75-L1FGG484C?
The XC6SLX75-L1FGG484C supports serial NOR flash (x1 or x2 mode), SPI flash, and parallel PROMs for master SPI configuration. It is validated with Micron, Spansion, and Macronix SPI flash devices. Configuration memory for XC6SLX75-L1FGG484C must meet tSU/tH timing specs per UG380 v1.11, and address width must match device density.
Can XC6SLX75-L1FGG484C drive DDR2 SDRAM directly?
Yes, XC6SLX75-L1FGG484C supports DDR2 SDRAM interfaces using SSTL-18 I/O standard with calibrated output drive strength and programmable input delays. It implements source-synchronous timing with DQS capture and supports up to 400 Mbps data rates. External termination and board-level timing matching are required for reliable operation with XC6SLX75-L1FGG484C.
Is JTAG boundary-scan supported on XC6SLX75-L1FGG484C?
Yes, XC6SLX75-L1FGG484C fully supports IEEE 1149.1 JTAG boundary-scan for device identification, interconnect testing, and in-system programming. All I/O pins and configuration pins are included in the BSDL file v3.1. Boundary-scan operation for XC6SLX75-L1FGG484C requires TCK ≤ 25 MHz and conforms to TAP controller state machine defined in UG380.
XC6SLX75-L1FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5831
- Number of Logic Elements/Cells:
- 74637
- Total RAM Bits:
- 3170304
- Number of I/O:
- 280
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX75-L1FGG484C FAQ
1.How can I place an order for XC6SLX75-L1FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX75-L1FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX75-L1FGG484C reliable?
The price and inventory of XC6SLX75-L1FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX75-L1FGG484C is usually 5 days.
3.What payment methods are accepted for XC6SLX75-L1FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX75-L1FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX75-L1FGG484C?
XC6SLX75-L1FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX75-L1FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX75-L1FGG484C?
For technical support, including XC6SLX75-L1FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX75-L1FGG484C requirements.
6.How does Aetrix verify that XC6SLX75-L1FGG484C is sourced from the original manufacturer or authorized distributors?
All XC6SLX75-L1FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX75-L1FGG484C meets industry standards.
7.What is the process for return or replacement of XC6SLX75-L1FGG484C?
All XC6SLX75-L1FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX75-L1FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX75-L1FGG484C part is unused and in its original packaging.
Return procedure for XC6SLX75-L1FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX75-L1FGG484C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
